Self-aligned liner formed on metal semiconductor alloy contacts
Metal semiconductor alloy contacts are provided on each of a source region and a drain region which are present in a semiconductor substrate. A transition metal is then deposited on each of the metal semiconductor alloy contacts, and during the deposition of the transition metal, the deposited transition metal reacts preferably, but not necessarily always, in-situ with a portion of each the metal semiconductor alloy contacts forming a transition metal-metal semiconductor alloy liner atop each metal semiconductor alloy contact. Each transition metal-metal semiconductor alloy liner that is provided has outer edges that are vertically coincident with outer edges of each metal semiconductor alloy contact. The transition metal-metal semiconductor alloy liner is more etch resistant as compared to the underlying metal semiconductor alloy. As such, the transition metal-metal semiconductor alloy liner can serve as an effective etch stop layer during any subsequently performed etch process.
1. A semiconductor structure comprising:
a semiconductor substrate having a source region and a drain region located within a semiconductor material portion of said semiconductor substrate, wherein said source region and said drain region are spaced apart by a channel region;
a functional gate structure located above said channel region;
a source-side material stack of, from bottom to top, a source-side metal semiconductor alloy portion and a source-side transition-metal metal semiconductor alloy portion located on one side of said functional gate structure and located atop said source region; and
a drain-side material stack of, from bottom to top, a drain-side metal semiconductor alloy portion and a drain-side transition metal-metal semiconductor alloy portion located on another side of said functional gate structure and located atop said drain region.
2. The semiconductor structure of claim 1 , wherein outermost edges of said source-side metal semiconductor alloy portion and outermost edges of said source-side transition metal-metal semiconductor alloy portion are vertically coincident to each other, and wherein outermost edges of said drain-side metal semiconductor alloy portion and outermost edges of said drain-side transition metal-metal semiconductor alloy portion are vertically coincident to each other.
3. The semiconductor structure of claim 1 , wherein said source-side transition metal-metal semiconductor alloy portion is more etch resistant than said source-side metal semiconductor alloy portion, and said drain-side transition metal-metal semiconductor alloy portion is more etch resistant than said drain-side metal semiconductor alloy portion.
4. The semiconductor structure of claim 1 , wherein said transition metal of said source-side transition metal-metal semiconductor alloy portion comprises a different metal than said metal of said source-side metal semiconductor alloy portion, and said transition metal of said drain-side transition metal-metal semiconductor alloy portion comprises a different metal than said metal of said drain-side metal semiconductor alloy portion.
5. The semiconductor structure of claim 4 , wherein said semiconductor substrate comprises silicon, said source-side metal semiconductor alloy portion comprises nickel silicide or platinum-nickel silicide, said source-side transition-metal metal semiconductor alloy portion comprises titanium-nickel or titanium-platinum-nickel silicide, said drain-side metal semiconductor alloy portion comprises nickel silicide and said drain-side transition metal-metal semiconductor alloy comprises titanium-nickel silicide or titanium-platinum-nickel silicide.
6. The semiconductor structure of claim 1 , wherein said functional gate structure comprises a dielectric material portion and a gate conductor portion, and said dielectric material portion is U-shaped.
7. The semiconductor structure of claim 1 , further comprising a dielectric cap material portion located on a topmost surface of said functional gate structure.
8. The semiconductor structure of claim 6 , wherein said gate conductor portion includes a transition metal-metal semiconductor alloy cap portion located on a surface of a metal semiconductor alloy cap portion.
9. The semiconductor structure of claim 1 , wherein said semiconductor substrate is a III-V compound semiconductor material.