Smart bridge for memory core

1. An apparatus comprising:

a first semiconductor die including a three-dimensional (3D) memory that includes multiple memory cells arranged in multiple physical levels that are monolithically formed above a substrate, wherein the 3D memory includes circuitry associated with operation of the multiple memory cells; and

a second semiconductor die including:

a memory device interface;

a memory controller interface; and

periphery circuitry associated with the 3D memory;

wherein the second semiconductor die is coupled to the first semiconductor die via the memory device interface, and wherein the memory controller interface is configured to be coupled to a memory interface of a memory controller die to enable communication of data and control information between the memory controller die and the 3D memory via the memory device interface and the memory controller interface of the second semiconductor die.

2. The apparatus of claim 1 , wherein the periphery circuitry is coupled to the 3D memory via the memory device interface, and wherein the memory device interface includes a differential signaling interface.

3. The apparatus of claim 2 , wherein the memory controller die includes a second differential signaling interface.

4. The apparatus of claim 1 , wherein the periphery circuitry includes a charge pump configured to generate a voltage to be applied to at least one of a word line, a bit line, or a source line of the 3D memory.

5. The apparatus of claim 1 , wherein the periphery circuitry includes a row decoder configured to decode at least a portion of an address and to select a row of the 3D memory based on the portion.

6. The apparatus of claim 1 , wherein the substrate is a silicon substrate.

7. The apparatus of claim 1 , wherein the circuitry associated with operation of the multiple memory cells is configured to be responsive to a write instruction to store data into memory cells of the 3D memory and to be responsive to a read instruction to read data from the memory cells of the 3D memory.

8. A method comprising:

receiving data at a second semiconductor die for storage at a three-dimensional (3D) memory at a first semiconductor die, wherein the second semiconductor die includes a memory device interface, a memory controller interface, and periphery circuitry for the 3D memory; and

sending a control signal from the second semiconductor die to the 3D memory at the first semiconductor die,

wherein the 3D memory includes multiple memory cells arranged in multiple physical levels that are monolithically formed above a substrate and wherein the 3D memory includes circuitry associated with operation of the multiple memory cells,

wherein the second semiconductor die is coupled to the first semiconductor die via the memory device interface, and

wherein the memory controller interface is configured to be coupled to a memory interface of a memory controller die to enable communication between the memory controller die and the 3D memory via the memory device interface and the memory controller interface of the second semiconductor die.

9. The method of claim 8 , wherein the periphery circuitry includes a different signaling interface.

10. The method of claim 8 , wherein the data is received from the memory controller die, and wherein the memory controller die is coupled to the second semiconductor die via the memory controller interface of the second semiconductor die.

11. The method of claim 8 , wherein the substrate is a silicon substrate.

12. The method of claim 8 , wherein the circuitry associated with operation of the multiple memory cells is configured to be responsive to a write instruction to store data into memory cells of the 3D memory and to be responsive to a read instruction to read data from the memory cells of the 3D memory.