Test output buffer functional output input, test output, enable input
Timely testing of die on wafer reduces the cost to manufacture ICs. This disclosure describes a die test structure and process to reduce test time by adding test pads on the top surface of the die. The added test pads allow a tester to probe and test more circuits within the die simultaneously. Also, the added test pads contribute to a reduction in the amount of test wiring overhead traditionally required to access and test circuits within a die, thus reducing die size.
1. A die of semiconductor material comprising:
A. functional die pads formed at the periphery of the die;
B. test die pads separate from the functional die pads;
C. functional circuitry having functional input and output terminals;
D. a functional input buffer having an input coupled with a functional die pad and an output coupled with a functional input terminal;
E. a test circuit output buffer having an input coupled with an output terminal that is not coupled with a functional die pad, an output that is coupled with a test die pad, and an enable input; and
F. an enable input buffer having an input coupled with an enable test die pad, and an output coupled with the enable input of the test circuit output buffer.
2. The die of claim 1 in which the output of the enable input buffer is coupled to a functional input terminal.
3. The die of claim 1 including plural functional circuitry, each having functional input and output terminals, one of the functional circuitry having a terminal coupled to a functional die pad and having a terminal uncoupled with a functional die pad.