Radio frequency coupling structure
View Patent ↗A radio frequency coupling structure is arranged to couple a radio frequency signal between a first side of the radio frequency coupling structure to a second side of the radio frequency coupling structure opposite to the first side. The radio frequency coupling structure comprises a dielectric layer, a first electrically conductive layer comprising a first transition structure, a second electrically conductive layer comprising a second transition structure, and an integrated waveguide structure formed by an array of electrically conductive vias extending through the dielectric layer from the first to the second electrically conductive layer to enclose a portion of the dielectric layer. The portion is arranged to guide the radio frequency signal between the first transition structure and the second transition structure.
1. A radio frequency coupling structure for coupling a radio frequency signal between a first side of the radio frequency coupling structure and a second side of the radio frequency coupling structure, the second side being opposite to the first side, the radio frequency coupling structure comprising:
a dielectric layer arranged between the first side and the second side,
a first electrically conductive layer arranged on the dielectric layer at the first side,
a second electrically conductive layer arranged on the dielectric layer at the second side,
an integrated waveguide structure being formed by an array of electrically conductive vias extending through the dielectric layer from the first electrically conductive layer to the second electrically conductive layer and enclosing a portion of the dielectric layer to form an integrated waveguide structure;
the first electrically conductive layer comprising a first transition structure, the second electrically conductive layer comprising a second transition structure,
the first transition structure and the second transition structure being arranged to electrically couple the radio frequency signal to the integrated waveguide structure and the portion of the dielectric layer being arranged to guide the radio frequency signal between first transition structure and the second transition structure.
2. A radio frequency coupling structure according to claim 1 , the first transition structure extending outside an area of the first electrically conductive layer enclosing the portion of the dielectric layer.
3. A radio frequency coupling structure according to claim 1 , the second transition structure being arranged inside an area of the second electrically conductive layer enclosing the portion of the dielectric layer.
4. A radio frequency coupling structure according to claim 3 , the second transition structure being provided with a hole in the area of the second electrically conductive layer enclosing the portion of the dielectric layer.
5. A radio frequency coupling structure according to claim 1 , the second transition structure comprising a patch element extending outside an area of the second electrically conductive layer enclosing the portion of the dielectric layer to outside said area.
6. A radio frequency coupling structure according to claim 1 , the array comprising a first line array and a second line array, the electrically conductive vias of the first line array being parallel arranged with the conductive vias of the second line array.
7. A radio frequency coupling structure according to claim 6 , the array comprising a third line array, the third line array extending from a first end of the first line array to a second end of the second line array, the portion of the dielectric layer having at least a region directly adjacent to the first transition structure not enclosed by the first line array, the second line array and the third line array.
8. A radio frequency coupling structure according to claim 1 , the first transition structure comprising a first microstrip taper and a first microstrip line, the first microstrip line being electrically connected to the integrated waveguide structure via the microstrip taper.
9. A radio frequency coupling structure according to claim 1 the portion of the dielectric layer being formed as a cuboid, the cuboid having:
a first face corresponding to the first electrically conductive layer enclosing the portion of the dielectric layer,
a second face parallel to the first face corresponding to the second electrically conductive layer enclosing the portion of the dielectric layer.
10. The radio frequency coupling structure according to claim 1 , further comprising:
an antenna electrically coupled to the first radio frequency wave guide for at least one of transmitting and receiving the radio frequency signal through a frequency channel.
11. A multi-layer printed circuit board for coupling a radio frequency signal between a first side of the multi-layer printed circuit board and a second side of the multi-layer printed circuit board, the second side being opposite the first side, the multi-layer printed circuit board comprising:
a first board electrically conductive layer;
a first board dielectric layer arranged between the first side and the second side, with the first board electrically conductive layer arranged on the first board dielectric layer at the first side; and
a second board electrically conductive layer arranged on the first board dielectric layer at the second side,
an integrated waveguide structure being formed by an array of electrically conductive vias extending through the first board dielectric layer from the first board electrically conductive layer to the second board electrically conductive layer and enclosing a portion of the first board dielectric layer to form an integrated waveguide structure,
the first board electrically conductive layer comprising a first transition structure,
the second board electrically conductive layer comprising a second transition structure,
the first transition structure and the second transition structure being arranged to electrically couple the radio frequency signal to the integrated waveguide structure and the portion of the first board dielectric layer being arranged to guide the radio frequency signal between first transition structure and the second transition structure,
the first board electrically conductive layer being stacked on the first board dielectric layer, the first board dielectric layer being stacked on the second board electrically conductive layer.
12. A multi-layer printed circuit board according to claim 11 , further comprising:
a second board dielectric layer the second board electrically conductive layer being stacked on the second board dielectric layer,
a first radio frequency waveguide being formed via a first hole extending through the second board dielectric layer, the first hole extending to an area of the radio frequency coupling structure corresponding to the second transition structure, the first hole having walls covered by a third board electrically conductive layer.
13. A multi-layer printed circuit board according to claim 12 , the first hole being filled with a third board dielectric material.
14. A multi-layer printed circuit board according to claim 12 , the radio frequency coupling structure being arranged for coupling the radio frequency signal between the first side and the second side in a first predetermined frequency band, the multi-layer printed circuit board further comprising:
a second radio frequency coupling structure for coupling a second radio frequency signal between the first side and the second side of the second radio frequency coupling structure in a second predetermined frequency band, the second radio frequency coupling structure comprising:
a third electrically conductive layer being formed as the first board electrically conductive layer,
a fourth electrically conductive layer being formed as the second board electrically conductive layer,
a second integrated waveguide structure being formed by a second array of electrically conductive vias extending through the dielectric layer from the third electrically conductive layer to the fourth electrically conductive layer and enclosing a second portion of the dielectric layer,
the third electrically conductive layer comprising a third transition structure,
the fourth electrically conductive layer comprising a fourth transition structure,
the third transition structure and the fourth transition structure being arranged to electrically couple the second radio frequency signal to the second integrated waveguide structure and the second portion of the dielectric layer being arranged to guide the second radio frequency signal between third transition structure and the fourth transition structure.
15. A multi-layer printed circuit board according to claim 14 further comprising:
a second radio frequency waveguide being formed via a second hole extending through the second board dielectric layer to an area of the second radio frequency coupling structure corresponding to the second transition structure, the second hole having walls covered by a fourth board electrically conductive layer.
16. A multi-layer printed circuit board according to claim 15 , the second hole being filled with a fourth board dielectric material.
17. A radio frequency device comprising:
a multi-layer printed circuit board for coupling a radio frequency signal between a first side of the multi-layer printed circuit board and a second side of the multi-layer printed circuit board, the second side being opposite the first side; and
an integrated circuit die mounted on the multi-layer printed circuit board at the first side, the integrated circuit die being arranged to at least one of to generate the radio frequency signal for transmission via a first transition structure and to receive the radio frequency signal as received via a second transition structure, wherein the multi-layer printed circuit board comprises:
a first board dielectric layer arranged between the first side and the second side;
a first board electrically conductive layer arranged on the first board dielectric layer at the first side; and
a second board electrically conductive layer arranged on the first board dielectric layer at the second side,
an integrated waveguide structure being formed by an array of electrically conductive vias extending through the first board dielectric layer from the first board electrically conductive layer to the second board electrically conductive layer and enclosing a portion of the first board dielectric layer to form an integrated waveguide structure,
the first board electrically conductive layer comprising the first transition structure,
the second board electrically conductive layer comprising the second transition structure,
the first transition structure and the second transition structure being arranged to electrically couple the radio frequency signal to the integrated waveguide structure and the portion of the first board dielectric layer being arranged to guide the radio frequency signal between first transition structure and the second transition structure,
the first board electrically conductive layer being stacked on the first board dielectric layer, the first board dielectric layer being stacked on the second board electrically conductive layer.
18. A radio frequency device according to claim 17 , further comprising an integrated circuit package, the integrated circuit die being arranged inside the integrated circuit package, the integrated circuit package being mounted on the printed circuit board via a plurality of solder balls.
19. A radio frequency device according to claim 17 , the integrated circuit die comprising a circuit of the group of circuits consisting of: a transmitter, a receiver, and a transceiver circuit, the circuit being electrically coupled to the first transition structure.