IP Library Granted Patent US 9,112,051
Granted Patent B1
US 9,112,051 · App. 14/451,252 · Granted Aug 18, 2015

Three-dimensional flash memory device

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Quick Facts
Patent No.
US 9,112,051
App. No.
14/451,252
Granted
Aug 18, 2015
Kind
B1
Abstract

The present invention is directed to a memory device comprising a semiconductor block formed on a p-type semiconductor substrate with the semiconductor block having i number of n-type line regions extending along a first direction separated by i−1 number of p-type line regions along a second direction substantially perpendicular to the first direction; and a plurality of paired gate electrodes extending along the second direction with each pair of the paired gate electrodes formed adjacent to two opposite sides of the semiconductor block with a charge-trapping layer interposed therebetween, where i is an integer greater than or equal to two. The n-type line regions may function as sub-bit lines or sub-source lines or both. The p-type line regions may function as channel lines that allow current to flow vertically between two n-type line regions adjacent thereto. The memory device may further include a bit or source select unit.

Claims (20)

1. A semiconductor memory device comprising:

a plurality of parallel semiconductor blocks separated along a first direction on a p-type semiconductor substrate, each of said semiconductor blocks having i number of n-type line regions extending along a second direction separated by i−1 number of p-type line regions along a third direction;

a plurality of first plate electrodes separated along said second direction, each of said first plate electrodes being perforated by said semiconductor blocks extending along said second direction; and

a charge-trapping layer formed between said semiconductor blocks and said plate electrodes,

wherein i is an integer greater than or equal to two; said first, second, and third directions are orthogonal to each other.

2. The semiconductor memory device of claim 1 , wherein said third direction is substantially orthogonal to surface of said p-type semiconductor substrate.

3. The semiconductor memory device of claim 1 , wherein each of said first plate electrodes being perforated by said semiconductor blocks has a portion formed above said semiconductor blocks that functions as a word line and portions formed between said semiconductor blocks that function as control gates.

4. The semiconductor memory device of claim 1 , wherein said n-type line regions function as sub-bit lines or sub-source lines or both.

5. The semiconductor memory device of claim 1 , wherein said p-type line regions function as channel lines that allow current to flow along said third direction between two n-type line regions adjacent thereto.

6. The semiconductor memory device of claim 1 , wherein said charge-trapping layer has a multilayer structure comprising silicon oxide/silicon nitride/silicon oxide (ONO) or aluminum oxide/silicon nitride/silicon oxide (ANO).

7. The semiconductor memory device of claim 1 , further including a plurality of bit select units with each of said bit select units comprising:

a bit terminal extending along said third direction;

i or i−1 number of bit leads coupled to said bit terminal; and

i or i−1 number of parallel pairs of bit select transistors, each pair of said bit select transistors being coupled to one of said n-type line regions at one end and one of said bit leads at the other end,

wherein each pair of said bit select transistors including a paired gate electrodes extending along said third direction and coupled to a bit select line extending along said first direction.

8. The semiconductor memory device of claim 1 , further including a plurality of source select units with each of said source select units comprising:

a source stud extending along said third direction;

i or i−1 number of source leads coupled to said source stud; and

i or i−1 number of parallel pairs of source select transistors, each pair of said source select transistors being coupled to one of said n-type line regions at one end and one of said source leads at the other end,

wherein each pair of said source select transistors includes a paired gate electrodes extending along said third direction and coupled to a source select line extending along said first direction.

Assignments (7)
SECURITY INTEREST Recorded Mar 18, 2022
From: AVALANCHE TECHNOLOGY, INC.
To: STRUCTURED ALPHA LP
Reel/Frame 059436/0203 →
SECURITY INTEREST Recorded Apr 19, 2021
From: AVALANCHE TECHNOLOGY, INC.
To: STRUCTURED ALPHA LP
Reel/Frame 057213/0050 →
SECURITY INTEREST Recorded Apr 19, 2021
From: AVALANCHE TECHNOLOGY, INC.
To: STRUCTURED ALPHA LP
Reel/Frame 057217/0674 →
SECURITY INTEREST Recorded Jul 8, 2020
From: AVALANCHE TECHNOLOGY, INC.
To: SILICON VALLEY BANK
Reel/Frame 053156/0223 →
SECURITY INTEREST Recorded Feb 13, 2020
From: AVALANCHE TECHNOLOGY, INC.
To: STRUCTURED ALPHA LP
Reel/Frame 051930/0396 →
SECURITY INTEREST Recorded Apr 18, 2017
From: AVALANCHE TECHNOLOGY, INC.
To: STRUCTURED ALPHA LP
Reel/Frame 042273/0813 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 4, 2014
From: SATOH, KIMIHIRO
To: AVALANCHE TECHNOLOGY, INC.
Reel/Frame 033458/0991 →