Method of forming electronic components with increased reliability

1. A method of producing an electronic component, the method comprising:

connecting a first terminal of a resistor to a first source of an enhancement-mode transistor, the enhancement-mode transistor comprising the first source, a first gate, and a first drain; and

directly connecting a second terminal of the resistor to the first drain and to a second source of a depletion-mode transistor, the depletion-mode transistor comprising the second source, a second gate, and a second drain.

2. The method of claim 1 , further comprising connecting the second gate to the first source.

3. The method of claim 1 , wherein a breakdown voltage of the depletion-mode transistor is greater than a breakdown voltage of the enhancement-mode transistor.

4. The method of claim 3 , wherein the breakdown voltage of the depletion-mode transistor is at least three times the breakdown voltage of the enhancement-mode transistor.

5. The method of claim 1 , wherein the enhancement-mode transistor or the depletion-mode transistor is a III-N device.

6. The method of claim 1 , wherein the enhancement-mode transistor is a silicon-based transistor, and the depletion-mode transistor is a III-N transistor.

7. The method of claim 1 , the enhancement-mode transistor having a threshold voltage, wherein a resistance of the resistor is sufficiently small to reduce a voltage of the first drain relative to the first source when the electronic component is biased such that a voltage of the first gate relative to the first source is less than the threshold voltage of the enhancement-mode transistor and a voltage of the second drain relative to the first source is greater than a breakdown voltage of the enhancement-mode transistor but less than a breakdown voltage of the depletion-mode transistor.

8. The method of claim 1 , the enhancement-mode transistor having a threshold voltage; wherein

when the electronic component is biased such that a voltage of the first gate relative to the first source is less than the threshold voltage of the enhancement-mode transistor and a voltage of the second drain relative to the first source is greater than a breakdown voltage of the enhancement-mode transistor but less than a breakdown voltage of the depletion-mode transistor, a first off-state leakage current flows through the depletion-mode transistor, and a second off-state leakage current which is smaller than the first off-state leakage current flows through the enhancement-mode transistor; and

at a first temperature, a resistance of the resistor is less than the breakdown voltage of the enhancement-mode transistor divided by a difference between the second off-state leakage current and the first off-state leakage current.

9. The method of claim 1 , the enhancement-mode transistor having a threshold voltage; wherein

when the electronic component is biased such that a voltage of the first gate relative to the first source is less than the threshold voltage of the enhancement-mode transistor and a voltage of the second drain relative to the first source is greater than a breakdown voltage of the enhancement-mode transistor but less than a breakdown voltage of the depletion-mode transistor, a first off-state leakage current flows through the second source of the depletion-mode transistor, and a second off-state leakage current which is smaller than the first off-state leakage current flows through the first drain of the enhancement-mode transistor; and

at a first temperature, a resistance of the resistor is less than the breakdown voltage of the enhancement-mode transistor divided by a difference between the second off-state leakage current and the first off-state leakage current.

10. The method of claim 9 , wherein the first temperature is 25° C.

11. The method of claim 10 , wherein the voltage of the first gate relative to the first source is 0V.

12. The method of claim 9 , the electronic component rated to operate at a temperature range between and including a second temperature and a third temperature, the second temperature being less than the first temperature and the third temperature being greater than the first temperature, wherein the resistance of the resistor is less than the breakdown voltage of the enhancement-mode transistor divided by the difference between the second off-state leakage current and the first off-state leakage current at all temperatures within the temperature range.

13. The method of claim 12 , wherein the second temperature is −55° C. and the third temperature is 200° C.

14. The method of claim 1 , the enhancement-mode transistor having a first threshold voltage and the depletion-mode transistor having a second threshold voltage; wherein

when the electronic component is biased such that a voltage of the first gate relative to the first source is less than the first threshold voltage and a voltage of the second drain relative to the first source is greater than a breakdown voltage of the enhancement-mode transistor but less than a breakdown voltage of the depletion-mode transistor, an off-state leakage current flows through the second source of the depletion-mode transistor; and

at a first temperature, a resistance of the resistor is sufficiently large to prevent the off-state leakage current from exceeding a critical value.

15. The method of claim 14 , wherein the first temperature is 25° C.

16. The method of claim 15 , wherein the voltage of the first gate relative to the first source is 0V.

17. The method of claim 14 , wherein the critical value is a value of off-state leakage current in the depletion-mode transistor during operation of the electronic component which results in fluctuations of over 10V in the second threshold voltage.

18. The method of claim 17 , the electronic component rated to operate at a temperature range between and including a second temperature and a third temperature, the second temperature being less than the first temperature and the third temperature being greater than the first temperature, and the critical value being a function of temperature, wherein the resistance of the resistor is sufficiently large to prevent the off-state leakage current from exceeding the critical value at all temperatures within the temperature range.

19. The method of claim 18 , wherein the second temperature is −55° C. and the third temperature is 200° C.

20. The method of claim 1 , the enhancement-mode transistor having a first threshold voltage and the depletion-mode transistor having a second threshold voltage; wherein

a resistance of the resistor is selected such that when the electronic component is biased such that a voltage of the first gate relative to the first source is less than the first threshold voltage and a voltage of the second drain relative to the first source is greater than a breakdown voltage of the enhancement-mode transistor but less than a breakdown voltage of the depletion-mode transistor, at a temperature of 25° C. a difference between a voltage of the second gate relative to the second source and the second threshold voltage is less than 10V.

21. The method of claim 20 , the electronic component rated to operate at a temperature range between and including a first temperature and a second temperature, wherein the difference between the voltage of the second gate relative to the second source and the second threshold voltage is less than 5V at all temperatures within the temperature range.

22. The method of claim 21 , wherein the first temperature is −55° C. and the second temperature is 200° C.

23. The method of claim 1 , wherein an absolute value of a threshold voltage of the depletion-mode transistor is smaller than a breakdown voltage of the enhancement-mode transistor.

24. The method of 23 , wherein the absolute value of the threshold voltage of the depletion-mode transistor is about 10V or larger.

25. The method of claim 1 , wherein the resistor has a resistance between 10 3 ohms and 10 9 ohms.

26. The method of claim 1 , further comprising providing a diode having an anode and a cathode, wherein the anode is connected to the first source or to the second gate, and the cathode is electrically connected to the first drain or to the second source.

27. The method of claim 26 , wherein the diode and the depletion-mode transistor are integrated into a single device.

28. The method of claim 27 , wherein the single device is a III-N device.

29. A method of producing an electronic component, the method comprising:

connecting a current-carrying component comprising a resistor in parallel with an enhancement-mode transistor, the enhancement-mode transistor having a first breakdown voltage, the enhancement-mode transistor comprising a first source, a first gate, and a first drain;

connecting the first drain to a second source of a depletion-mode transistor, the depletion-mode transistor having a second breakdown voltage which is larger than the first breakdown voltage, the depletion-mode transistor comprising the second source, a second gate, and a second drain; and

electrically connecting the second gate to the first source.

30. The method of claim 29 , wherein a first terminal of the current-carrying component is electrically connected to the first source, and a second terminal of the current-carrying component is electrically connected to the first drain or to the second source.

31. The method of claim 29 , wherein the enhancement-mode transistor or the depletion-mode transistor is a III-N device.

32. The method of claim 29 , wherein the enhancement-mode transistor is a silicon-based transistor, and the depletion-mode transistor is a III-N transistor.