Patent Assignment
Reel/Frame 045853/0159
Security Interest
Recorded: 2018-04-04
Pages: 13
Assignor
TRANSPHORM, INC.
Executed: 2018-04-04
Assignee
NEXPERIA B.V.
JONKERBOSPLEIN 52, NIJMEGEN, 6534 AB, NETHERLANDS
Covered Properties
(84)
Iii-Nitride Devices with Recessed Gates
Enhancement Mode Iii-N Hemts
Electrolysis transistor
Iii-Nitride Bidirectional Switches
Insulated Gate E-Mode Transistors
Semiconductor Heterostructure Diodes
Bridge Circuits and Their Components
Iii-Nitride Devices and Circuits
Semiconductor Devices with Field Plates
Inductive Load Power Switching Circuits
Package Configurations for Low Emi Circuits
Electronic Devices and Components for High Efficiency Power Circuits
Semiconductor Electronic Components and Circuits
Iii-Nitride Devices with Recessed Gates
Transistors with Isolation Regions
Semiconductor Heterostructure Diodes
Enhancement Mode Gallium Nitride Power Devices
Semiconductor Diodes with Low Reverse Bias Currents
Electrode Configurations for Semiconductor Devices
Bridge Circuits and Their Components
Semiconductor Devices with Guard Rings
High Power Semiconductor Electronic Components with Increased Reliability
Package Configurations for Low Emi Circuits
Electronic Components with Reactive Filters
Semiconductor Power Modules and Devices
Enhancement Mode Gallium Nitride Power Devices
Semiconductor Heterostructure Diodes
Semiconductor Devices with Integrated Hole Collectors
Semiconductor Electronic Components with Integrated Current Limiters
Inductive Load Power Switching Circuits
Inductive Load Power Switching Circuits
Semiconductor Modules and Methods of Forming the Same
Gallium Nitride Power Devices
Semiconductor Devices with Field Plates
Enhancement-Mode Iii-Nitride Devices
Package Configurations for Low Emi Circuits
Bridge Circuits and Their Components
Enhancement Mode Iii-N Hemts
Inductive Load Power Switching Circuits
Semiconductor Heterostructure Diodes
Semiconductor Electronic Components and Circuits
Package Configurations for Low Emi Circuits
Method of Forming Electronic Components with Increased Reliability
Gallium Nitride Power Devices
Semiconductor Power Modules and Devices
Semiconductor Devices with Field Plates
Electrodes for Semiconductor Devices and Methods of Forming the Same
Electrode Configurations for Semiconductor Devices
Gate Drivers for Circuits Based on Semiconductor Devices
Transistors with Isolation Regions
Method for Making Semiconductor Diodes with Low Reverse Bias Currents
Method of Forming Electronic Components with Reactive Filters
Semiconductor Electronic Components with Integrated Current Limiters
Multilevel Inverters and Their Components
Switching Circuits Having Ferrite Beads
Inductive Load Power Switching Circuits
Electronic Devices and Components for High Efficiency Power Circuits
Enhancement Mode III-N HEMTs
Method of Forming Electronic Components with Increased Reliability
Package Configurations for Low Emi Circuits
Semiconductor Devices with Guard Rings
Bridge Circuits and Their Components
Forming Enhancement Mode Iii-Nitride Devices
Recessed Ohmic Contacts in a Iii-N Device
Semiconductor Power Modules and Devices
Semiconductor Devices with Field Plates
Gate Drivers for Circuits Based on Semiconductor Devices
Enhancement-Mode Iii-Nitride Devices
Bridgeless Power Factor Correction Circuits
Patent:
9,590,494 →
Application:
14/802,333 →
Transistors with Isolation Regions
Electrodes for Semiconductor Devices and Methods of Forming the Same
Semiconductor Electronic Components with Integrated Current Limiters
Semiconductor Devices with Integrated Hole Collectors
Enhancement Mode III-N HEMTs
Semiconductor Power Modules and Devices
Gate Structures for Iii-N Devices
Semiconductor Modules and Methods of Forming the Same
Semiconductor Devices with Field Plates
Enhancement Mode III-N HEMTs
Switching Circuits Having Ferrite Beads
Bridgeless Power Factor Correction Circuits
Patent:
10,063,138 →
Application:
15/428,726 →
Enhancement-Mode Iii-Nitride Devices
Switching Circuits Having Ferrite Beads
Paralleling of Switching Devices for High Power Circuits
Related Assignments
(21)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 7, 2008
From: SUH, CHANG SOO; BEN-YAACOV, ILAN
To: TRANSPHORM INC.
Reel/Frame 020915/0428 →
Assignment of Assignor's Interest
Jun 24, 2008
From: MISHRA, UMESH; COFFIE, ROBERT; SHEN, LIKUN; BEN-YAACOV, ILAN
To: TRANSPHORM INC.
Reel/Frame 021144/0576 →
Assignment of Assignor's Interest
Aug 5, 2008
From: MISHRA, UMESH; LAL, RAKESH; SHEN, LIKUN; MC CARTHY, LEE
To: TRANSPHORM, INC.
Reel/Frame 021352/0010 →
Assignment of Assignor's Interest
Oct 21, 2008
From: HONEA, JAMES; PARIKH, PRIMIT; WU, YIFENG; BEN-YAACOV, ILAN
To: TRANSPHORM INC.
Reel/Frame 021713/0119 →
Assignment of Assignor's Interest
Jan 20, 2009
From: SUH, CHANG SOO; BEN-YAACOV, ILAN; COFFIE, ROBERT; MISHRA, UMESH
To: TRANSPHORM INC.
Reel/Frame 022130/0915 →
Assignment of Assignor's Interest
Feb 9, 2009
From: WU, YIFENG; MISHRA, UMESH; PARIKH, PRIMIT; CHU, RONGMING
To: TRANSPHORM INC.
Reel/Frame 022225/0988 →
Assignment of Assignor's Interest
Mar 4, 2009
From: HONEA, JAMES; WU, YIFENG
To: TRANSPHORM INC.
Reel/Frame 022344/0387 →
Assignment of Assignor's Interest
Apr 8, 2009
From: WU, YIFENG; CHU, RONGMING
To: TRANSPHORM INC.
Reel/Frame 022523/0790 →
Assignment of Assignor's Interest
Sep 29, 2009
From: CHU, RONGMING; COFFIE, ROBERT
To: TRANSPHORM INC.
Reel/Frame 023300/0334 →
Assignment of Assignor's Interest
Oct 14, 2009
From: HONEA, JAMES
To: TRANSPHORM INC.
Reel/Frame 023372/0320 →
Assignment of Assignor's Interest
Nov 19, 2009
From: WU, YIFENG
To: TRANSPHORM INC.
Reel/Frame 023545/0200 →
Assignment of Assignor's Interest
Jan 8, 2010
From: WU, YIFENG
To: TRANSPHORM INC.
Reel/Frame 023754/0720 →
Assignment of Assignor's Interest
Mar 29, 2010
From: PARIKH, PRIMIT; HONEA, JAMES; BLAKE, CARL C., JR.; COFFIE, ROBERT
To: TRANSPHORM INC.
Reel/Frame 024154/0144 →
Assignment of Assignor's Interest
Sep 23, 2010
From: SUH, CHANG SOO; BEN-YAACOV, ILAN
To: TRANSPHORM INC.
Reel/Frame 025071/0893 →
Assignment of Assignor's Interest
Feb 6, 2011
From: WU, YIFENG; MISHRA, UMESH; PARIKH, PRIMIT; CHU, RONGMING
To: TRANSPHORM INC.
Reel/Frame 025749/0539 →
Assignment of Assignor's Interest
Feb 6, 2011
From: MISHRA, UMESH; CHOWDHURY, SRABANTI
To: TRANSPHORM INC.
Reel/Frame 025749/0536 →
Assignment of Assignor's Interest
Mar 22, 2011
From: SUH, CHANG SOO; MISHRA, UMESH
To: TRANSPHORM INC.
Reel/Frame 025997/0454 →
Assignment of Assignor's Interest
Sep 13, 2012
From: WU, YIFENG
To: TRANSPHORM INC.
Reel/Frame 028953/0668 →
Assignment of Assignor's Interest
Jan 22, 2014
From: SUH, CHANG SOO; MISHRA, UMESH
To: TRANSPHORM INC.
Reel/Frame 032022/0833 →
Change of Name
Mar 4, 2020
From: TRANSPHORM, INC.
To: TRANSPHORM TECHNOLOGY, INC.
Reel/Frame 052091/0697 →
Security Interest
Mar 1, 2024
From: TRANSPHORM TECHNOLOGY, INC.; TRANSPHORM, INC.
To: RENESAS ELECTRONICS AMERICA INC.
Reel/Frame 066713/0531 →