Semiconductor devices with integrated hole collectors
Transistor devices which include semiconductor layers with integrated hole collector regions are described. The hole collector regions are configured to collect holes generated in the transistor device during operation and transport them away from the active regions of the device. The hole collector regions can be electrically connected or coupled to the source, the drain, or a field plate of the device. The hole collector regions can be doped, for example p-type or nominally p-type, and can be capable of conducting holes but not electrons.
1. A transistor device, comprising:
a source, a gate, and a drain;
a semiconductor material which includes a gate region between the source and the drain;
a channel in the semiconductor material;
an insulating material between the gate and the semiconductor material; and
a field plate over the insulating material;
wherein an electrically conductive portion extending from the source or from the field plate contacts the semiconductor material in the gate region; and
wherein the transistor device is an enhancement-mode transistor.
2. The transistor device of claim 1 , wherein the insulating material prevents the gate from contacting the semiconductor material in the gate region.
3. The transistor device of claim 1 , wherein the field plate is electrically connected to the source.
4. The transistor device of claim 1 , wherein in operation, the channel is not conductive when 0V is applied to the gate relative to the source and a voltage greater than 0V is applied to the drain relative to the source, but is conductive when a switching voltage greater than a device threshold voltage is applied to the gate relative to the source.
5. The transistor device of claim 1 , further comprising a hole collector region in the gate region of the semiconductor material, wherein the electrically conductive portion contacts the hole collector region.
6. The transistor device of claim 5 , wherein in a first mode of operation, the device is operable to block a positive voltage applied to the drain relative to the source when 0V is applied to the gate relative to the source, and in a second mode of operation, the device is operable to conduct current from the source to the drain when 0V is applied to the gate relative to the source and the drain is at a negative voltage relative to the source.
7. The transistor device of claim 6 , the contact between the electrically conductive portion and the hole collector region having a turn-on voltage, wherein the turn-on voltage is sufficiently large to prevent substantial current from flowing through the contact between the electrically conductive portion and the hole collector region during the second mode of operation.
8. The transistor device of claim 1 , wherein the semiconductor material includes a III-N channel layer and a III-N barrier layer, the channel being in the III-N channel layer adjacent to the III-N barrier layer.