Semiconductor die singulation methods
In one embodiment, a method of singulating semiconductor die from a semiconductor wafer includes forming a material on a surface of a semiconductor wafer and reducing a thickness of portions of the material. Preferably, the thickness of the material is reduced near where singulation openings are to be formed in the semiconductor wafer.
1. A cutting tool comprising:
a central support section having a major axis;
a cutting tip;
a cutting surface adjacent to the cutting tip and extending from the cutting tip toward the central support section terminating in a distal end of the cutting surface wherein the cutting surface is attached to the central support section;
a depth stop spaced a first distance from the cutting tip toward the central support section wherein a first volume is formed by a portion of the cutting surface extending from the cutting tip to the depth stop; and
an accumulation region adjacent to the central support section and extending away from the cutting surface, the accumulation region having a second volume that approximates the first volume.
2. The cutting tool of claim 1 wherein the accumulation region extends from the distal end of the cutting surface away from the cutting tip.
3. The cutting tool of claim 1 wherein the depth stop has a first portion that is configured to engage with a surface of a conductor on a semiconductor wafer to limit a depth of penetration of the cutting tip into the conductor.
4. The cutting tool of claim 1 wherein the central support section is rotatingly coupled to the cutting surface.
5. The cutting tool of claim 1 wherein the cutting surface angularly extends from the cutting tip to the central support section.
6. The cutting tool of claim 1 wherein the accumulation region is formed as a recess disposed within the central support section, the accumulation region positioned adjacent to the distal end of the cutting surface and extending from the distal end of the cutting surface into the central support section.
7. The cutting tool of claim 6 wherein the accumulation region has a width extending laterally across the central support section.
8. The cutting tool of claim 6 wherein the depth stop is formed as a surface of the central support section that extends from a distal end of the accumulation region away from the accumulation region.
9. The cutting tool of claim 1 wherein the depth stop is formed as a surface of a spacer attached to the central support section.