FinFET semiconductor structures and methods of fabricating same
The invention provides a method of forming a semiconductor structure, which include: providing an intermediate semiconductor structure having semiconductor substrate, a fin having an EG oxide layer in contact with at least a portion of the fin, and a gate stack disposed over a portion of the fin; forming a silicon nitride layer over portions of the fin that are not located under the gate stack; and after forming the silicon nitride layer, performing one or more ion implantation steps on the intermediate semiconductor structure. The invention also provides a method of forming a semiconductor structure including: providing an intermediate semiconductor structure having a semiconductor substrate, a fin having an EG oxide layer in contact with at least a portion of the fin, and a gate material disposed over the fin; forming, over the fin and gate material of the intermediate semiconductor structure, a gate stack hardmask including an oxide layer; forming a silicon nitride barrier layer on the oxide layer of the gate stack hardmask; performing one or more gate stack hardmask patterning steps; removing the EG oxide layer from portions of the fin that are not located under the gate; and subsequent to removing the EG oxide layer from portions of the fin that are not located under the gate, performing one or more ion implantation steps.
1. A method of forming a semiconductor structure comprising:
providing an intermediate semiconductor structure, comprising:
a semiconductor substrate;
a fin having an extended gate (EG) oxide layer in contact with at least a portion of the fin; and
a gate material disposed over the fin;
forming, over the fin and gate material of the intermediate semiconductor structure, a gate stack hardmask comprising an oxide layer;
forming, prior to gate etch processing to define gate regions, a silicon nitride barrier layer on the oxide layer of the gate stack hardmask;
performing one or more gate stack hardmask patterning steps, comprising forming, directly on the silicon nitride barrier layer, an organic planarizing layer (OPL);
removing the EG oxide layer from portions of the fin that are not located under the gate; and
subsequent to removing the EG oxide layer from portions of the fin that are not located under the gate, performing one or more ion implantation steps.
2. The method according to claim 1 , wherein removing the EG oxide layer comprises use of hydrofluoric acid and/or Siconi treatment.
3. The method according to claim 1 , comprising forming the silicon nitride barrier layer on portions of the oxide layer of the gate stack hardmask that are formed on one or more fins that, following gate etch processing, are not located under the gate.