IP Library Granted Patent US 9,761,521
Granted Patent B1
US 9,761,521 · App. 14/519,271 · Granted Sep 12, 2017

Flexible and robust power grid connectivity

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Quick Facts
Patent No.
US 9,761,521
App. No.
14/519,271
Granted
Sep 12, 2017
Kind
B1
Abstract

Various embodiments provide for flexible and robust power grid connectivity in a server on a chip environment. The power grid has three parallel conductors, (e.g., wires) which represent two power polarities. The outside two wires can be of a first polarity (e.g. Vdd), while the middle wire is of a second polarity (e.g., Vss). The polarities of the wires can also be switched, as long as the two outside wires have the same polarity, while the inside wire has a different polarity. Power pins from modules adjacent to the set of three wires make connections to the nearest wire of the matching polarity. In this way, every power pin on the modules can be connected to the power grid without need for special alignment or custom power pins.

Claims (23)

1. A power grid interface, comprising:

a first conductor and a second conductor having a first polarity, the first polarity is one of Vdd or Vss; and

a third conductor having a second polarity different from the first polarity, the third conductor positioned between the first conductor and the second conductor, wherein the first, second, and third conductors are in between two integrated circuit modules and are configured to supply power to the integrated circuit modules and wherein a first power pin from a first integrated circuit module and a second power pin from a second integrated circuit module, that are directly adjacent to each other, connect to the first conductor and second conductor respectively.

2. The power grid interface of claim 1 , wherein the first conductor and the second conductor are Vdd conductors and the third conductor is a Vss conductor.

3. The power grid interface of claim 1 , wherein the first conductor and the second conductor Vss conductors and the third conductor is a Vdd conductor.

4. The power grid interface of claim 1 , wherein power pins from modules adjacent the set of three conductors connect to the first conductor and the second conductor in response to the power pins being configured for accepting the first polarity.

5. The power grid interface of claim 1 , wherein power pins from modules adjacent to the set of three conductors connect to a closest conductor having a polarity matching the polarity of the power pins.

6. The power grid interface of claim 5 , wherein the power pins from the modules are aligned directly across from each other.

7. The power grid interface of claim 1 , wherein a power pin from a module of the modules do not cross over another connection from an adjacent power pin when making a connection to one of the conductors.

8. The power grid interface of claim 1 , wherein the set of three conductors are on a same layer.

9. The power grid interface of claim 1 , further comprising a second set of three conductors, wherein the set of three conductors and the second set of three conductors are in different orientations and are on different layers.

10. A system for providing power grid connectivity to modules on a chip, comprising:

means for arranging a set of three conductors next to each other, the three conductors being of two polarities, the outside conductors being a first polarity and the inside conductor being a second polarity; and

means for providing power to directly adjacent power pins on the modules on the chip via the set of three conductors, the directly adjacent power pins connecting to the outside conductors, wherein the three conductors positioned between the modules to which power is provided.

11. The power grid interface of claim 1 , wherein the first conductor, second conductor, and the third conductor are in a channel in between the first integrated circuit module and the second integrated circuit module.

12. A power grid system, comprising:

a set of three conductors parallel to each other, a first conductor and a second conductor being on the outside of the set of three conductors and being a first polarity, and a third conductor in between the first conductor and the second conductor being a second polarity, and integrated circuit modules on either side of the set of three conductors having power pins directly adjacent to each other and corresponding to the first polarity connect to the first conductor and second conductor.

13. The power grid system of claim 12 , wherein the first conductor and the second conductor are positive power supply conductors and the third conductor is a negative power supply conductor.

14. The power grid system of claim 12 , wherein the first conductor and the second conductor are negative power supply conductors and the third conductor is a positive power supply conductor.

15. The power grid system of claim 12 , wherein power pins from the integrated circuit modules adjacent the set of three conductors connect to the first conductor and the second conductor in response to the power pins being configured for accepting the first polarity.

16. The power grid system of claim 12 , wherein power pins from the integrated circuit modules adjacent to the set of three conductors connect to a closest conductor having a polarity matching the polarity of the power pins.

17. The power grid system of claim 12 , wherein a power pin from a module of the integrated circuit modules do not cross over another connection from an adjacent power pin when making a connection to one of the conductors.

18. The power grid system of claim 12 , wherein the set of three conductors are on a same layer.

Assignments (5)
CHANGE OF NAME Recorded Dec 6, 2017
From: PROJECT DENVER INTERMEDIATE HOLDINGS LLC
To: AMPERE COMPUTING LLC
Reel/Frame 044717/0683 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 21, 2017
From: MACOM CONNECTIVITY SOLUTIONS, LLC
To: PROJECT DENVER INTERMEDIATE HOLDINGS LLC
Reel/Frame 044798/0599 →
RELEASE OF SECURITY INTEREST Recorded Oct 31, 2017
From: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
To: MACOM CONNECTIVITY SOLUTIONS, LLC (SUCCESSOR TO APPLIED MICRO CIRCUITS CORPORATION)
Reel/Frame 044652/0609 →
SECURITY INTEREST Recorded May 11, 2017
From: MACOM CONNECTIVITY SOLUTIONS, LLC (SUCCESSOR TO APPLIED MICRO CIRCUITS CORPORATION)
To: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
Reel/Frame 042444/0891 →
MERGER AND CHANGE OF NAME Recorded Apr 6, 2017
From: APPLIED MICRO CIRCUITS CORPORATION; MACOM CONNECTIVITY SOLUTIONS, LLC; MACOM CONNECTIVITY SOLUTIONS, LLC
To: MACOM CONNECTIVITY SOLUTIONS, LLC
Reel/Frame 042176/0185 →