IP Library Granted Patent US 9,991,871
Granted Patent B2
US 9,991,871 · App. 14/526,466 · Granted Jun 5, 2018

Bulk acoustic wave resonator comprising a ring

Inventors: Qiang Zou (Fort Collins, CO); Dariusz Burak (Fort Collins, CO)
Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
H03H9/132H01L41/047H01L41/0533H03H3/04H03H9/15H03H9/173H03H9/175H03H9/02118
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Quick Facts
Patent No.
US 9,991,871
App. No.
14/526,466
Granted
Jun 5, 2018
Kind
B2
Abstract

An acoustic resonator includes a first electrode disposed over a substrate; a piezoelectric layer disposed over the first electrode; and a second electrode disposed over the piezoelectric layer; a passivation layer disposed over the second electrode; and a ring disposed between the substrate and the passivation layer.

Claims (22)

1. A bulk acoustic wave (BAW) resonator device, comprising:

a first electrode disposed over a substrate;

a piezoelectric layer disposed over the first electrode;

a second electrode disposed over the piezoelectric layer wherein the second electrode further comprises a raised frame element, or a recessed frame element, or both a raised frame element and a recessed frame element; and

a passivation layer disposed over the second electrode, wherein a ring exists between the second electrode, and the passivation layer.

2. A BAW resonator device as claimed in claim 1 , wherein the ring is a first ring, and the BAW resonator device further comprises a second ring.

3. A BAW resonator device as claimed in claim 2 , wherein the first ring has a first width, the second ring has a second width, and the first width is less than the second width.

4. A BAW resonator device as claimed in claim 2 , wherein the first ring, or the second ring, or both the first and second rings are filled with air.

5. A BAW resonator device as claimed in claim 2 , the first ring, or the second ring, or both the first and second rings are filled with a dielectric material.

6. A BAW resonator device as claimed in claim 5 , wherein the dielectric material comprises one of non-etchable borosilicate glass (NEBSG), carbon doped silicon dioxide (CDO), or silicon carbide (SiC).

7. A BAW resonator device as claimed in claim 1 , wherein the first ring, or the second ring, or both the first and second rings, are filled with a metal or a metal alloy.

8. BAW resonator device as claimed in claim 7 , wherein the metal comprises one or more of Iridium (Ir), Tungsten (W), Molybdenum (Mo), Niobium (Nb), Ruthenium (Ru), Aluminum (Al), and Cooper (Cu).

9. A bulk acoustic wave (BAW) resonator device, comprising:

a first electrode disposed over a substrate;

a piezoelectric layer disposed over the first electrode;

a second electrode disposed over the piezoelectric layer; and

a passivation layer disposed over the second electrode, wherein a first ring exists between the second electrode and the passivation layer, and a second ring exists in the piezoelectric layer and along at least a portion of an active region of the BAW resonator device.

10. A BAW resonator device as claimed in claim 9 , wherein the first ring, or the second ring, or both the first and second rings are filled with air.

11. A BAW resonator device as claimed in claim 9 , wherein the first ring, or the second ring, or both the first and second rings are filled with a dielectric material.

12. A BAW resonator device as claimed in claim 11 , wherein the dielectric material comprises one of non-etchable borosilicate glass (NEBSG), carbon doped silicon dioxide (CDO), or silicon carbide (SiC).

13. A BAW resonator device as claimed in claim 9 , wherein the first ring, or the second ring, or both the first and second rings, are filled with a metal or a metal alloy.

14. BAW resonator device as claimed in claim 13 , wherein the metal comprises one or more of Iridium (Ir), Tungsten (W), Molybdenum (Mo), Niobium (Nb), Ruthenium (Ru), Aluminum (Al), and Cooper (Cu).

Assignments (5)
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE PREVIOUSLY RECORDED AT REEL: 047422 FRAME: 0464. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 6, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048883/0702 →
MERGER Recorded Oct 5, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047422/0464 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 28, 2014
From: ZOU, QIANG; BURAK, DARIUSZ
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 034055/0805 →
Continuity (5)
Continuation In Part 13208909 · Aug 12, 2011
Continuation In Part 13151631 · Jun 2, 2011
Continuation In Part 13074262 · Mar 29, 2011
Continuation In Part 13036489 · Feb 28, 2011
Related Publication 20160126930A1 · May 5, 2016