IP Library Granted Patent US 9,553,446
Granted Patent B2
US 9,553,446 · App. 14/529,282 · Granted Jan 24, 2017

Shared ESD circuitry

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,553,446
App. No.
14/529,282
Granted
Jan 24, 2017
Kind
B2
Abstract

An integrated circuit including ESD circuitry that is shared among more than one terminal segment of the integrated circuit to discharge current from an ESD event on any of the terminal segments. The shared ESD circuitry includes a clamp circuit that is coupled to power buses of each segment to discharge current from ESD events on each segment. The shared ESD circuitry includes a trigger circuit that is coupled to nodes coupled to terminals of each segment to detect an ESD event on each segment.

Claims (54)

1. An integrated circuit comprising:

an ESD clamp circuit;

a first bus coupled to a first current electrode of the ESD clamp circuit;

a first diode coupled between the first bus and the first current electrode;

a second bus coupled to the first current electrode of the ESD clamp circuit;

a second diode coupled between the second bus and the first current electrode;

a first plurality of terminals, each terminal of the first plurality coupled to the first bus;

a second plurality of terminals, each terminal of the second plurality coupled to the second bus; and

a trigger circuit including a first input coupled to a first node to sense an ESD event occurring on at least one terminal of the first plurality of terminals, a second input coupled to a second node to sense an ESD event occurring on at least one terminal of the second plurality of terminals, and an output coupled to a control electrode of the ESD clamp circuit for making the ESD clamp circuit conductive in response to a sensed ESD event on at least one terminal of the first plurality of terminals to discharge current from the sensed ESD event on the first bus through the first diode and for making the ESD clamp circuit conductive in response to a sensed ESD event on at least one terminal of the second plurality of terminals to discharge current from the sensed ESD event on the second bus through the second diode.

2. The integrated circuit of claim 1 , wherein the first node is a node of the first bus and the second node is a node of the second bus.

3. The integrated circuit of claim 1 , wherein:

the first node is a node of a third bus that is a separate bus from the first bus, each terminal of the first plurality of terminals is coupled to the third bus; and

the second node is a node of a fourth bus that is a separate bus from the second bus, each terminal of the second plurality of terminals is coupled to the fourth bus.

4. The integrated circuit of claim 1 , further comprising:

a first plurality of ESD clamp circuits coupled to the first bus for discharging current on the first bus from an ESD event, wherein the first plurality of ESD clamp circuits is not coupled to the second bus to discharge current on the second bus from an ESD event; and

a second plurality of ESD clamp circuits coupled to the second bus for discharging current on the second bus from an ESD event, wherein the second plurality of ESD clamp circuits is not coupled to the first bus to discharge current on the first bus from an ESD event.

5. The integrated circuit of claim 4 , further comprising:

a second trigger circuit including a first input coupled to the first node and an output coupled to a control electrode of each of the first plurality of ESD clamp circuits;

a third trigger circuit including a first input coupled to the second node and an output coupled to a control electrode of each of the second plurality of ESD clamp circuits.

6. The integrated circuit of claim 1 , wherein the trigger circuit further includes:

a first circuit portion, the first circuit portion including the first input and a first portion output coupled to the output of the trigger circuit, the first portion output for providing an indication of an ESD event occurring on at least one terminal of the first plurality of terminals;

a second circuit portion, the second circuit portion including the second input and a second portion output coupled to the output of the trigger circuit, the second portion output for providing an indication of an ESD event occurring on at least one terminal of the second plurality of terminals.

7. The integrated circuit of claim 6 , wherein the first portion output and the second portion output are coupled in a wired-OR configuration.

8. The integrated circuit of claim 6 , wherein the first node supplies power to the first circuit portion when an ESD event is occurring on at least one terminal of the first plurality of terminals and the second node supplies power to the second circuit portion when an ESD event is occurring on at least one terminal of the second plurality of terminals.

9. The integrated circuit of claim 1 , wherein the ESD clamp circuit is characterized as a termination clamp circuit for the first plurality of terminals and the second plurality of terminals.

10. The integrated circuit of claim 1 , wherein the trigger circuit comprises a first R-C circuit coupled to the first input to detect an ESD event occurring on at least one terminal of the first plurality of terminals and comprises a second R-C circuit coupled to the second input to detect an ESD event occurring on at least one terminal of the second plurality of terminals.

11. The integrated circuit of claim 1 , wherein the first plurality of terminals is located in a first region of the integrated circuit and the second plurality of terminals is located in a second region of the integrated circuit, wherein the ESD clamp circuit is located between the first region and the second region.

12. The integrated circuit of claim 11 , wherein the first and second regions are located proximate to an edge of the integrated circuit.

13. An integrated circuit comprising:

a first bus;

a second bus;

a first ESD clamp circuit coupled to the first bus for discharging current on the first bus from an ESD event, wherein the first ESD clamp circuit is not coupled to the second bus to discharge current on the second bus from an ESD event;

a second ESD clamp circuit coupled to the second bus for discharging current on the second bus from an ESD event, wherein the second ESD clamp circuit is not coupled to the first bus to discharge current on the first bus from an ESD event; and

a third ESD clamp circuit coupled to the first bus for discharging current on the first bus from an ESD event and to the second bus for discharging current on the second bus from an ESD event.

14. The integrated circuit of claim 13 , further comprising:

a first trigger circuit including a first input coupled to a first node and an output coupled to a control electrode of the first ESD clamp circuit for making the first ESD clamp circuit conductive in response to a detected ESD event to discharge current on the first bus from the detected ESD event;

a second trigger circuit including a first input coupled to a second node and an output coupled to a control electrode of the second ESD clamp circuit for making the second ESD clamp circuit conductive in response to a detected ESD event to discharge current on the second bus from the detected ESD event; and

a third trigger circuit including a first input coupled to the first node and a second input coupled to the second node, and an output coupled to a control electrode of the third ESD clamp circuit for making the third ESD clamp circuit conductive in response to a detected ESD event to discharge current from at least one of a group comprising the first bus and the second bus from the detected ESD event.

15. The integrated circuit of claim 13 further comprising:

core circuitry;

a first plurality of I/O terminals coupled to the first bus and coupled to the core circuitry;

a second plurality of I/O terminals coupled to the second bus and coupled to the core circuitry.

16. The integrated circuit of claim 13 , wherein the first bus is characterized as a power bus and the second bus is characterized as a power bus.

17. The integrated circuit of claim 13 , wherein the third ESD clamp circuit is at least twice a size in area of each of the first ESD clamp circuit and the second ESD clamp circuit.

18. An integrated circuit comprising:

a first segment comprising a first plurality of terminals, each terminal of the first plurality coupled to a first bus;

a first node;

a second segment comprising a second plurality of terminals, each terminal of the second plurality coupled to a second bus;

a second node;

a first trigger circuit portion including an input and an output, the input of the first trigger circuit portion coupled to the first node to sense an ESD event occurring in the first segment;

a second trigger circuit portion including an input and an output, the input of the second trigger circuit portion coupled to the second node to sense an ESD event occurring in the second segment;

an ESD clamp circuit including a first current electrode and a control electrode, the control electrode coupled to the output of the first trigger circuit portion and the output of the second trigger circuit portion for making the ESD clamp circuit conductive in response to a detected ESD event occurring on the first segment or occurring on the second segment to discharge current from the detected ESD event.

19. The integrated circuit of claim 18 , wherein the first node supplies power to the first trigger circuit portion when an ESD event is occurring on the first segment and the second node supplies power to the second trigger circuit portion when an ESD event is occurring on the second segment.

20. The integrated circuit of claim 18 , further comprising a first diode coupled between the first bus and the first current electrode of the ESD clamp circuit and a second diode coupled between the second bus and the first current electrode.

Assignments (13)
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040626 FRAME: 0683. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME EFFECTIVE NOVEMBER 7, 2016. Recorded Jan 12, 2017
From: NXP SEMICONDUCTORS USA, INC. (MERGED INTO); FREESCALE SEMICONDUCTOR, INC. (UNDER)
To: NXP USA, INC.
Reel/Frame 041414/0883 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNMENT DOCUMENTATION - INITIAL CONVENYANCE LISTED CHANGE OF NAME. PREVIOUSLY RECORDED ON REEL 040579 FRAME 0827. ASSIGNOR(S) HEREBY CONFIRMS THE UPDATE CONVEYANCE TO MERGER AND CHANGE OF NAME EFFECTIVE NOVEMBER 7, 2016. Recorded Dec 15, 2016
From: NXP SEMICONDUCTORS USA, INC. (MERGED INTO); FREESCALE SEMICONDUCTOR, INC. (UNDER)
To: NXP USA, INC.
Reel/Frame 040945/0252 →
CHANGE OF NAME Recorded Nov 16, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 040626/0683 →
CHANGE OF NAME Recorded Nov 9, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 040579/0827 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 5, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037444/0444 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 5, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037444/0535 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037358/0001 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Feb 18, 2015
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 035034/0019 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Feb 18, 2015
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 035033/0923 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Feb 18, 2015
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 035033/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 9, 2015
From: GERDEMANN, ALEX P.; ETHERTON, MELANIE; MILLER, JAMES W.; MOOSA, MOHAMED S.; RUTH, ROBERT S.; STOCKINGER, MICHAEL A.
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 034919/0029 →