Method of forming a trench gate MOSFET having a thick bottom oxide
A method of forming a trench gate MOSFET is provided. An epitaxial layer is formed on a substrate. A trench is formed in the epitaxial layer. A first insulating layer is conformally formed on surfaces of the epitaxial layer and the trench. A first conductive layer is formed at the bottom of the trench. A portion of the first insulating layer is removed to form a second insulating layer exposing an upper portion of the first conductive layer. An oxidation process is performed to oxidize the first conductive layer to a third insulating layer, wherein a fourth insulating layer is simultaneously formed on the surface of the epitaxial layer and on the sidewall of the trench. A second conductive layer is formed in the trench. Two body layers are formed in the epitaxial layer beside the trench. Two doped regions are formed in the body layers respectively beside the trench.
1. A method of forming a trench gate MOSFET comprising:
forming an epitaxial layer with a first conductivity type on a substrate with the first conductivity type;
forming a trench in the epitaxial layer;
conformally forming a first insulating layer on surfaces of the epitaxial layer and the trench;
forming a first conductive layer at a bottom of the trench;
removing a portion of the first insulating layer to form a second insulating layer exposing an upper portion of the first conductive layer;
performing an oxidation process to oxidize the first conductive layer to a third insulating layer, wherein a fourth insulating layer is simultaneously formed on the surface of the epitaxial layer and on a sidewall of the trench by the oxidation process;
forming a second conductive layer in the trench;
forming two body layers with a second conductivity type in the epitaxial layer respectively beside the trench; and
forming two doped regions with the first conductivity type in the body layers respectively beside the trench.
2. The method of forming the trench gate MOSFET as recited in claim 1 , wherein a method of forming the first conductive layer comprises:
forming a conductive material layer on the epitaxial layer, and the conductive material layer filling up the trench; and
performing an etching back process to remove a portion of the conductive material layer.
3. The method of forming the trench gate MOSFET as recited in claim 1 ,
wherein a method of forming the second insulating layer comprises performing an etching back process until ⅔ to ⅘ height of the first conductive layer is exposed.
4. The method of forming the trench gate MOSFET as recited in claim 1 , wherein a method of forming the second conductive layer comprises:
forming a conductive material layer on the epitaxial layer, and the conductive material layer filling up the trench; and
performing an etching back process to remove a portion of the conductive material layer.
5. The method of forming the trench gate MOSFET as recited in claim 1 , further comprising, after the step of performing the oxidation process and before the step of forming the second conductive layer:
removing the fourth insulating layer, a portion of the third insulating layer and a portion of the second insulating layer; and
forming a fifth insulating layer on the surfaces of the epitaxial layer and the trench.
6. The method of forming the trench gate MOSFET as recited in claim 1 , further comprising, after the step of forming the doped regions:
forming a dielectric layer on the second conductive layer and the doped regions;
forming two openings penetrating the dielectric layer and the doped regions; and
forming a third conductive layer on the dielectric layer, wherein the third conductive layer fills in the openings to be electrically connected to the body layers.
7. The method of forming the trench gate MOSFET as recited in claim 6 , wherein a material of the third conductive layer comprises metal.
8. The method of forming the trench gate MOSFET as recited in claim 1 , wherein a material of the first conductive layer comprises undoped polysilicon.
9. The method of forming the trench gate MOSFET as recited in claim 1 , wherein a material of the second conductive layer comprises doped polysilicon.
10. The method of forming the trench gate MOSFET as recited in claim 1 , wherein the first conductivity type is N-type and the second conductivity type is P-type; or the first conductivity type is P-type and the second conductivity type is N-type.