Geometrically Enhanced Resistive Random Access Memory (RRAM) Cell And Method Of Forming Same
A memory device (and method of making and using the memory device) includes a first electrode of conductive material, a second electrode of conductive material, and a layer transition metal oxide material that includes first and second elongated portions meeting each other at a sharp corner. Each of the first and second elongated portions is disposed between and in electrical contact with the first and second electrodes.
1 . A memory device, comprising:
a first electrode of conductive material;
a second electrode of conductive material;
a layer of transition metal oxide material that includes first and second elongated portions meeting each other at a sharp corner, wherein each of the first and second elongated portions includes elongated opposing first and second surfaces and is disposed between and in electrical contact with the first and second electrodes such that:
a portion of the first surface of the first elongated portion adjacent the sharp corner is in electrical contact with the first electrode and a portion of the second surface of the first elongated portion adjacent the sharp corner is in electrical contact with the second electrode, and
a portion of the first surface of the second elongated portion adjacent the sharp corner is in electrical contact with the first electrode and a portion of the second surface of the second elongated portion adjacent the sharp corner is in electrical contact with the second electrode.
2 . The memory device of claim 1 , wherein the first elongated portion extends in a first direction, the second elongated portion extends in a second direction, and the first and second directions are orthogonal to each other.
3 . The memory device of claim 1 , wherein the layer of transition metal oxide material is L-shaped.
4 . The memory device of claim 1 , wherein the transition metal oxide material includes at least one of HfOx, TaOx, TiOx, WOx, Vox, and CuOx.
5 . The memory device of claim 1 , wherein the layer of transition metal oxide material includes a first sublayer of Hf disposed between a second sublayer of TaOx and a third sublayer of HfOx layer.
6 . The memory device of claim 1 , further comprising:
a substrate of a first conductivity type;
first and second regions of a second conductivity type different than the first conductivity type formed in a surface of the substrate;
a conductive gate disposed over and insulated from the substrate, and between the first and second regions;
wherein the second electrode is electrically coupled to the second region.
7 . A method of making a memory device, comprising:
forming a first electrode of conductive material;
forming a second electrode of conductive material; and
forming a layer of transition metal oxide material that includes first and second elongated portions meeting each other at a sharp corner, wherein each of the first and second elongated portions includes elongated opposing first and second surfaces and is disposed between and in electrical contact with the first and second electrodes such that:
a portion of the first surface of the first elongated portion adjacent the sharp corner is in electrical contact with the first electrode and a portion of the second surface of the first elongated portion adjacent the sharp corner is in electrical contact with the second electrode, and
a portion of the first surface of the second elongated portion adjacent the sharp corner is in electrical contact with the first electrode and a portion of the second surface of the second elongated portion adjacent the sharp corner is in electrical contact with the second electrode.
8 . The method of claim 7 , further comprising:
forming a conductive filament across the layer of transition metal oxide material by applying a first voltage across the first and second electrodes.
9 . The method of claim 7 , wherein the first elongated portion extends in a first direction, the second elongated portion extends in a second direction, and the first and second directions are orthogonal to each other.
10 . The method of claim 7 , wherein the layer of transition metal oxide material is L-shaped.
11 . The method of claim 7 , wherein the transition metal oxide material includes at least one of HfOx, TaOx, TiOx, WOx, Vox, and CuOx.
12 . The method of claim 7 , wherein the forming of the layer of transition metal oxide material comprises:
forming a first sublayer of Hf;
forming a second sublayer of TaOx; and
forming a third sublayer of HfOx layer,
wherein the first sublayer is disposed between the second and third sublayers.
13 . The method of claim 7 , further comprising:
forming first and second regions of a first conductivity type in a surface of a substrate of a second conductivity type different than the first conductivity type;
forming a conductive gate disposed over and insulated from the substrate, and between the first and second regions;
electrically coupling the second electrode to the second region.
14 . A method of programming and erasing a memory device having a first electrode of conductive material, a second electrode of conductive material, and a layer of transition metal oxide material that includes first and second elongated portions meeting each other at a sharp corner, wherein each of the first and second elongated portions includes elongated opposing first and second surfaces and is disposed between and in electrical contact with the first and second electrodes, and a conductive filament extending through the layer of transition metal oxide material, such that:
a portion of the first surface of the first elongated portion adjacent the sharp corner is in electrical contact with the first electrode and a portion of the second surface of the first elongated portion adjacent the sharp corner is in electrical contact with the second electrode, and
a portion of the first surface of the second elongated portion adjacent the sharp corner is in electrical contact with the first electrode and a portion of the second surface of the second elongated portion adjacent the sharp corner is in electrical contact with the second electrode;
the method comprising:
rupturing the filament by applying a first voltage across the first and second electrodes such that the layer of transition metal oxide material provide a first electrical resistance between the first and second electrodes; and
restoring the ruptured filament by applying a second voltage across the first and second electrodes such that the layer of transition metal oxide material provide a second electrical resistance between the first and second electrodes that is lower than the first electrical resistance.
15 . The method of claim 14 , wherein the first elongated portion extends in a first direction, the second elongated portion extends in a second direction, and the first and second directions are orthogonal to each other.
16 . The method of claim 14 , wherein the layer of transition metal oxide material is L-shaped.
17 . The method of claim 14 , wherein the transition metal oxide material includes at least one of HfOx, TaOx, TiOx, WOx, Vox, and CuOx.
18 . The method of claim 14 , wherein the layer of transition metal oxide material includes a first sublayer of Hf disposed between a second sublayer of TaOx and a third sublayer of HfOx layer.