Folded ballistic conductor interconnect line
A method includes forming a folding template in a first dielectric layer. The folding template has a plurality of surfaces that are positioned in different planes. A ballistic conductor line is formed on the plurality of surfaces of the folding template. A device includes a first dielectric layer and a vertically folded line disposed in the first dielectric layer, the vertically folded line including a ballistic conductor material.
1. A method, comprising:
forming a folding template in a first dielectric layer, said folding template having a plurality of surfaces that are positioned in different planes; and
forming a ballistic conductor line on said plurality of surfaces of said folding template, said ballistic conductor line having a vertical serpentine cross section along its length corresponding to said plurality of surfaces of said folding template.
2. The method of claim 1 , wherein forming said ballistic conductor line comprises:
forming a cladding layer above said first dielectric layer and said folding template;
forming a patterned mask layer covering a portion of said cladding layer disposed above said folding template; and
performing an etch process to remove portions of said cladding layer not covered by said patterned mask layer.
3. The method of claim 2 , wherein forming said ballistic conductor line further comprises forming a ballistic conductor layer on said cladding layer.
4. The method of claim 1 , wherein forming said ballistic conductor line comprises:
forming a cladding layer above said first dielectric layer and said folding template;
forming a ballistic conductor layer on said cladding layer;
forming a patterned mask layer covering a portion of said ballistic conductor layer and said cladding layer disposed above said folding template; and
performing an etch process to remove portions of said ballistic conductor layer and said cladding layer not covered by said patterned mask layer.
5. The method of claim 1 , wherein said ballistic conductor line comprises a cladding layer and a ballistic conductor layer.
6. The method of claim 5 , wherein said cladding layer comprises a barrier layer formed on said plurality of surfaces and a copper layer formed above said barrier layer.
7. The method of claim 1 , further comprising forming a conductive feature in a second dielectric layer disposed beneath said first dielectric layer, wherein said folding template exposes at least one portion of said conductive feature, and said ballistic conductor line contacts said at least one exposed portion.
8. The method of claim 7 , wherein said conductive feature comprises a via.
9. The method of claim 1 , further comprising forming a second dielectric layer above said first dielectric layer and above said ballistic conductor line.
10. The method of claim 1 , wherein said plurality of surfaces comprises at least two adjacent vertical surfaces, the method further comprising forming a second dielectric layer above said first dielectric layer and above said ballistic conductor line without filling a space between said at least two adjacent vertical surfaces to define an air gap between said at least two adjacent vertical surfaces.
11. The method of claim 1 , wherein said ballistic conductor line comprises graphene.
12. A device, comprising:
a first dielectric layer; and
a vertically folded line having a vertical serpentine cross section along its length disposed in said first dielectric layer, said vertically folded line comprising a ballistic conductor material.
13. The device of claim 12 , wherein a portion of said vertically folded line is disposed above a horizontal surface of said first dielectric layer.
14. The device of claim 12 , wherein said vertically folded line comprises a ballistic conductor layer and a cladding layer.
15. The device of claim 14 , wherein said cladding layer comprises a barrier layer and a copper layer formed above said barrier layer.
16. The device of claim 12 , further comprising forming a conductive feature in a second dielectric layer disposed beneath said first dielectric layer, wherein said vertically folded line contacts said conductive feature.
17. The device of claim 16 , wherein said conductive feature comprises a via.
18. The device of claim 12 , wherein said vertically folded line comprises at least two adjacent vertical surfaces, further comprising a second dielectric layer disposed above said first dielectric layer and above said vertically folded line without filling a space between said at least two adjacent vertical surfaces to define an air gap between said at least two adjacent vertical surfaces.
19. The device of claim 12 , wherein said ballistic conductor material comprises graphene.
20. A device, comprising:
a first dielectric layer; and
a vertically folded line disposed in said first dielectric layer, said vertically folded line comprising a ballistic conductor material, wherein a portion of said vertically folded line is disposed above a horizontal surface of said first dielectric layer.
21. The device of claim 20 , wherein said vertically folded line comprises a ballistic conductor layer and a cladding layer, wherein said cladding layer comprises a barrier layer and a copper layer formed above said barrier layer.