Glass interposer with embedded thermoelectric devices
The present invention relates generally to integrated circuit (IC) chip packaging, and more particularly, to a structure and method of forming a glass interposer having one or more embedded peltier devices, alongside electrically conductive vias, to help dissipate heat from one or more IC chips in a multi-dimensional chip package through the glass interposer and into an organic carrier, where it can be dissipated into an underlying substrate.
1. A method of forming a Peltier device, comprising:
forming vias including a first via, a second via and a third via in a glass interposer by etching the glass interposer to form openings that extend only through an upper portion of the glass interposer, such that the vias have a bottom that is separated from a bottom surface of the glass interposer by a lower portion of the glass interposer;
forming a top seed layer on the glass interposer and in the vias;
depositing an n-type semiconductor material in the first via;
depositing a p-type semiconductor material in the second via; and
depositing an electrically conductive material in the third via and over the first and second vias, wherein the electrically conductive material is in direct contact with an upper surface of the n-type semiconductor material in the first via and in direct contact with an upper surface of the p-type semiconductor material in the second via.
2. The method of claim 1 , further comprising:
removing the lower portion of the glass interposer to expose the bottom of the vias;
forming a bottom seed layer on an exposed portion of the glass interposer, on an exposed portion of the n-type semiconductor material, on a exposed portion of the p-type semiconductor material, and on an exposed portion of the electrically conductive material;
forming a bottom conductive material on the bottom seed layer;
forming an opening in the bottom conductive material and the bottom seed layer;
forming an insulator in the opening and on the bottom conductive material; and
forming a solder connection on the bottom conductive material.
3. The method of claim 1 , wherein the electrically conductive material comprises copper, aluminum, titanium, platinum, or alloys thereof.
4. The method of claim 2 , wherein the n-type semiconductor material is electrically connected to another p-type semiconductor material by the bottom conductive material.
5. The method of claim 1 , wherein the n-type semiconductor material comprises:
bismuth telluride doped with n-type dopants, the n-type dopants comprising arsenic or phosphorous.
6. The method of claim 1 , wherein the p-type semiconductor material comprises:
bismuth telluride doped with p-type dopants, the p-type dopants comprising boron or aluminum.
7. The method of claim 1 , further comprising:
removing portions of the electrically conductive material to expose the glass interposer; and
forming an insulator on the exposed glass interposer.
8. The method of claim 1 , wherein the first via and the second via are adjacent.