Electronic package that includes a plurality of integrated circuit devices bonded in a three-dimensional stack arrangement
An electronic package comprising a plurality of vertically stacked integrated circuit (IC) devices including a first IC device and a second IC device is provided. The electronic package also includes a first bonding layer coupling one side of the first IC device entirely to a portion of a side of the second IC device. The remaining portion of the side of the second IC device that is not coupled to the one side of the first IC device, includes an antenna.
1. An electronic package comprising:
a plurality of vertically stacked integrated circuit (IC) devices including a first IC device and a second IC device; and
a first bonding layer coupling one side of the first IC device entirely to a portion of a side of the second IC device; wherein the remaining portion of the side of the second IC device that is not coupled to the one side of the first IC device, includes an antenna.
2. The electronic package of claim 1 wherein the first IC device includes at least one semiconductor device and the second IC device includes at least one semiconductor device; wherein the at least one semiconductor device of the first IC device and the at least one semiconductor device of the second IC device are coupled together with a vertical insulated through substrate via.
3. The electronic package of claim 1 wherein the first bonding layer includes a metal joining material directly coupling the first IC device to the second IC device.
4. The electronic package of claim 1 wherein the first bonding layer includes one or more of a controlled collapse IC device connects (C4) bonding, copper pillar, or metal landing pad coupling the first IC device to the second IC device.
5. The electronic package of claim 1 wherein the antenna is formed on the second IC device using components fabricated in the back end of line (BEOL) portion of the IC device formation.
6. The electronic package of claim 1 wherein the antenna is formed on the second IC device using an insulated through substrate via (TSV).
7. The electronic package of claim 1 wherein the plurality of vertically stacked IC devices further comprises a third IC device; and
wherein the electronic package further comprises a second bonding layer coupling another side of the first IC device entirely to a portion of a side of the third IC device; wherein the remaining portion of the side of the third IC device that is not coupled to the other side of the first IC device, includes an antenna.
8. The electronic package of claim 7 wherein the antenna of the second IC device is on a face of the remaining portion of the side of the second IC devices; and wherein the antenna of the third side is on a back of the remaining portion of the side of the third IC device.
9. The electronic package of claim 7 wherein the antenna of the second IC device is on a face of the remaining portion of the side of the second IC device; and wherein the antenna of the third IC device is on a face of the remaining portion of the side of the third IC device.
10. A method of creating an electronic package that includes a plurality of vertically stacked integrated circuit (IC) devices, the method comprising:
positioning a first IC device in a vertical alignment with a second IC device; and
forming a first bonding layer between the first IC device and the second IC device; the first bonding layer coupling one side of the first IC device entirely to a portion of a side of the second IC device; wherein the remaining portion of the side of the second IC device that is not coupled to the one side of the first IC device, includes an antenna.
11. The method of claim 10 wherein the first IC device includes at least one semiconductor device and the second IC device includes at least one semiconductor device; and
wherein the at least one semiconductor device of the first IC device and the at least one semiconductor device of the second IC device are coupled together with a vertical insulated through substrate via (TSV).
12. The method of claim 10 wherein the first bonding layer includes a metal joining material directly coupling the first IC device to the second IC device.
13. The method of claim 10 wherein the first bonding layer includes one or more of a controlled collapse IC device connects (C4) bonding, copper pillar, or metal landing pad coupling the first IC device to the second IC device.
14. The method of claim 10 wherein the antenna is formed on the second IC device using components fabricated in the back end of line (BEOL) portion of the IC device formation.
15. The method of claim 10 wherein the antenna is formed on the second IC device using an insulated through substrate via (TSV).
16. The method of claim 10 wherein the electronic package further comprises a third IC device; wherein the method further comprises:
positioning the third IC device in the vertical alignment with the second IC device and the first IC device; and
forming a second bonding layer coupling another side of the first IC device entirely to a portion of a side of the third IC device, wherein the remaining portion of the side of the third IC device that is not coupled to the other side of the first IC device, includes an antenna.
17. The method of claim 10 wherein the antenna of the second IC device is on a face of the remaining portion of the side of the second IC device; and
wherein the antenna of the third IC device is on a back of the remaining portion of the side of the third IC device.
18. The method of claim 17 wherein the antenna of the second IC device is on a face of the remaining portion of the side of the second IC device; and
wherein the antenna of the third side is on a face of the remaining portion of the side of the third IC device.