IP Library Granted Patent US 9,866,200
Granted Patent B2
US 9,866,200 · App. 14/883,400 · Granted Jan 9, 2018

Multiple coil spring MEMS resonator

Inventors: Wan-Thai Hsu (Hsinchu, TW); John Ryan Clark (Howell, MI)
Assignee: Microchip Technology Incorporated
H03H9/2431H03H9/02244H03H9/02259H03H9/02338B81B2201/0271H03H9/2452H03H2009/0233H03H2009/02251H03H2009/02283H03H2009/02307H03H2009/02346H03H2009/02496
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Quick Facts
Patent No.
US 9,866,200
App. No.
14/883,400
Granted
Jan 9, 2018
Kind
B2
Abstract

A multiple coil spring MEMS resonator includes a center anchor and a resonator body including two or more coil springs extending in a spiral pattern from the center anchor to an outer closed ring. Each pair of coil springs originates from opposing points on the center anchor and extends in the spiral pattern to opposing points on the outer ring. The number of coil springs, the length and the width of the coil springs and the weight of the outer ring are selected to realize a desired resonant frequency.

Claims (19)

1. A MEMS (microelectromechanical systems) resonator comprising:

a center anchor connected to a substrate;

a resonator body comprising one or more pairs of coil springs and an outer closed ring suspended above the substrate, the coil springs extending in a spiral pattern from the center anchor to the outer closed ring, the center anchor is at a nodal point of the resonator body;

one or more transducers formed on the outer closed ring, each transducer being formed perpendicular to and extending outward from the outer closed ring;

a set of drive electrodes and a set of sense electrodes formed attached to the substrate, each transducer being capacitively coupled to one drive electrode and one sense electrode, a pair of the drive and sense electrodes being coupled to drive a respective transducer using electrostatic parallel plate drive, the drive and sense electrodes and the respective transducer being capacitivly coupled in a parallel plate configuration and each of the drive and sense electrodes being separated from the respective transducer by a narrow gap in the parallel plate configuration.

2. The MEMS resonator of claim 1 , wherein a number of the pairs of coil springs, a length and a width of the coil springs, and a weight of the outer closed ring are selected to tune a resonant frequency of the MEMS resonator.

3. The MEMS resonator of claim 2 , further comprising:

structures formed on the outer closed ring to adjust the weight of the outer closed ring.

4. The MEMS resonator of claim 1 , wherein a respective drive electrode and a respective transducer are separated by a first gap, and a respective sense electrode and a respective transducer are separated by a second gap, each of the first and second gaps being equal to or less than 1 μm.

5. The MEMS resonator of claim 1 , wherein the resonator body has a thickness of 20-30 μm.

6. The MEMS resonator of claim 1 , wherein the resonator body is formed from a material selected from a single crystalline silicon layer and a polycrystalline silicon layer.

7. The MEMS resonator of claim 1 , wherein the substrate comprises a silicon base layer on which an insulating layer is formed.

8. The MEMS resonator of claim 1 , wherein each of the coil springs originates from a first position on the center anchor and extends in a spiral pattern for a full circle around the center anchor to terminate on the outer closed ring at a position aligned with the first position.

9. The MEMS resonator of claim 1 , wherein individual coil springs of each pair of coil springs originate from opposing points on the center anchor and extend in a spiral pattern to opposing points on the outer closed ring.

10. The MEMS resonator of claim 1 , wherein each of the coil springs extends in a clockwise spiral pattern from the center anchor.

11. The MEMS resonator of claim 1 , wherein each of the coil springs extends in a counter-clockwise spiral pattern from the center anchor.

12. The MEMS resonator of claim 1 , wherein the outer closed ring comprises release holes formed therein, the release holes adjusting the weight of the outer closed ring.

13. The MEMS resonator of claim 1 , wherein the one or more transducers comprise release holes formed therein, the release holes adjusting the weight of the one or more transducers.

14. The MEMS resonator of claim 1 , wherein the one or more transducers includes a plurality of transducers, the plurality of transducers being driven by respective drive electrodes by a DC voltage and AC drive signals in different phases.

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
MERGER Recorded Mar 14, 2017
From: MICREL, INC.
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 042007/0406 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 14, 2015
From: HSU, WAN-THAI; CLARK, JOHN RYAN
To: MICREL, INC.
Reel/Frame 036794/0633 →
Continuity (3)
Provisional Application 62067230 · Oct 22, 2014
Provisional Application 62067206 · Oct 22, 2014
Related Publication 20160118955A1 · Apr 28, 2016