Resistor and method for making same
A metal strip resistor is provided. The metal strip resistor includes a metal strip forming a resistive element and providing support for the metal strip resistor without use of a separate substrate. There are first and second opposite terminations overlaying the metal strip. There is plating on each of the first and second opposite terminations. There is also an insulating material overlaying the metal strip between the first and second opposite terminations. A method for forming a metal strip resistor wherein a metal strip provides support for the metal strip resistor without use of a separate substrate is provided. The method includes coating an insulative material to the metal strip, applying a lithographic process to form a conductive pattern overlaying the resistive material wherein the conductive pattern includes first and second opposite terminations, electroplating the conductive pattern, and adjusting resistance of the metal strip.
1. A metal strip resistor, comprising:
a metal strip having a generally planar top surface and forming a resistive element and providing support for the metal strip resistor without use of a separate substrate;
first and second photolithographically formed termination areas overlaying the top surface of the metal strip adjacent opposite first and second side ends of the metal strip;
copper plating on each of the first and second termination areas;
a first metal plating layer extending from a bottom edge of the resistive element adjacent the first side end of the metal strip, along the first side of the metal strip, and along the top surface of the metal strip, the first metal plating layer covering the copper plating of the first termination area; and,
a second metal plating layer extending from a bottom edge of resistive element adjacent the second side of the metal strip, along the second side of the metal strip, and along the top surface of the metal strip, the second metal plating layer covering the copper plating of the second termination area; and,
an insulating material overlaying the top surface of the metal strip between the first and second termination areas;
wherein the copper plating of each termination area does not overlap the first insulating material.
2. The metal strip resistor of claim 1 , wherein the metal strip is a metal alloy comprising at least one of nickel, chromium, aluminum, manganese, and copper.
3. The metal strip resistor of claim 1 , further comprising an adhesion layer applied to the metal strip.
4. The metal strip resistor of claim 1 , further comprising a pair of photolithographically formed terminations on a bottom surface of the metal strip.
5. The metal strip resistor of claim 4 , further comprising an insulating material overlaying the metal strip on a bottom surface of the metal strip.
6. The metal strip resistor of claim 1 , further comprising first and second solderable layers formed along opposite outer sides of the metal strip.
7. A method for forming a metal strip resistor wherein a generally planar metal strip provides support for the metal strip resistor without use of a separate substrate, the method comprising:
applying a photolithographic process to form a conductive pattern overlaying a top surface of the metal strip, wherein the conductive pattern includes first and second termination areas adjacent opposite first and second side ends of the metal strip;
electroplating the first and second areas with copper;
plating a first metal layer extending from a bottom edge of the resistive element adjacent the first side end of the metal strip, along the first side of the metal strip, and along the top surface of the metal strip, the first metal layer covering the electroplated copper of the first termination area; and,
plating a second metal plating layer extending from a bottom edge of resistive element adjacent the second side of the metal strip, along the second side of the metal strip, and along the top surface of the metal strip, the second metal plating layer covering the electroplated copper of the second termination area; and,
overlaying an insulating material along the top surface of the metal strip between the first and second termination areas;
wherein the electroplated copper of each termination area does not overlap the insulating material.
8. The method of claim 7 , wherein the metal strip is a metal alloy comprising at least one of nickel, chromium, aluminum, manganese, and copper.
9. The method of claim 7 , further comprising applying an adhesion layer to the metal strip prior to electroplating.
10. The method of claim 7 , further comprising applying a photolithographic process to form a conductive pattern overlaying a bottom surface of the metal strip, wherein the conductive pattern includes third and fourth opposite terminations.
11. The method of claim 10 , further comprising electroplating the conductive pattern on the bottom surface of the metal strip.
12. The method of claim 11 , further comprising applying an insulating material overlaying the metal strip between the third and fourth opposite terminations.
13. The method of claim 7 , further comprising plating first and second solderable layers along opposite outer sides of the metal strip.