Method for depinning the Fermi level of a semiconductor at an electrical junction and devices incorporating such junctions
An electrical device in which an interface layer is disposed in between and in contact with a conductor and a semiconductor.
1. An electrical junction comprising an interface layer disposed between a contact metal and a semiconductor, the semiconductor comprising a source or drain of a transistor, the interface layer configured to provide a specific contact resistivity between the contact metal and the semiconductor of less than 1 Ω·μm 2 , the interface layer comprising a metal oxide and an oxide of the semiconductor.
2. The electrical junction of claim 1 , wherein the oxide of the semiconductor of the interface layer has a thickness of approximately 0.1 nm to 5 nm.
3. The electrical junction of claim 2 , wherein the semiconductor comprises an n-type doped source or drain of a transistor.
4. The electrical junction of claim 2 , wherein the contact metal is a metal or a stack of metals deposited on the interface layer.
5. The electrical junction of claim 4 , wherein the metal or stack of metals includes titanium.
6. The electrical junction of claim 2 , wherein the metal oxide of the interface layer comprises an oxide of titanium.
7. The electrical junction of claim 6 , wherein the oxide of the semiconductor of the interface layer has a thickness of approximately less than 1 nm.
8. The electrical junction of claim 6 , wherein the semiconductor comprises an n-type doped source or drain of a transistor.
9. The electrical junction of claim 6 , wherein the contact metal is a metal or a stack of metals deposited on the interface layer.
10. The electrical junction of claim 6 , wherein the oxide of the semiconductor comprises an oxide of silicon.
11. The electrical junction of claim 6 , wherein the oxide of the semiconductor of the interface layer is adjacent the semiconductor.
12. The electrical junction of claim 2 , wherein the oxide of the semiconductor comprises an oxide of silicon.
13. The electrical junction of claim 12 , wherein the contact metal is a metal or a stack of metals deposited on the interface layer.
14. The electrical junction of claim 12 , wherein the metal oxide of the interface layer comprises an oxide of titanium.
15. The electrical junction of claim 14 , wherein the semiconductor comprises an n-type doped source or drain of a transistor.
16. The electrical junction of claim 1 , wherein the semiconductor comprises silicon, the semiconductor comprises an n-type source or drain of a transistor, the oxide of the semiconductor is adjacent the semiconductor and comprises an oxide of silicon, the metal oxide of the interface layer comprises an oxide of titanium, the contact metal comprises titanium, and the metal oxide of the interface layer is adjacent the contact metal.