Patent Assignment
Reel/Frame 069681/0837
Assignment of Assignor's Interest
Recorded: 2024-12-26
Pages: 13
Assignor
ACORN SEMI, LLC
Executed: 2024-12-26
Assignee
OAK IP, LLC
812 W. MCDERMOTT DR. #1026, ALLEN, TEXAS, 75013
Covered Properties
(36)
Method for Depinning the Fermi Level of a Semiconductor at an Electrical Junction and Devices Incorporating Such Junctions
Method for Depinning the Fermi Level of a Semiconductor at an Electrical Junction and Devices Incorporating Such Junctions
Method for Depinning the Fermi Level of a Semiconductor at an Electrical Junction and Devices Incorporating Such Junctions
Method for Depinning the Fermi Level of a Semiconductor at an Electrical Junction and Devices Incorporating Such Junctions
Method for Depinning the Fermi Level of a Semiconductor at an Electrical Junction and Devices Incorporating Such Junctions
Method for Depinning the Fermi Level of a Semiconductor at an Electrical Junction and Devices Incorporating Such Junctions
Method for Depinning the Fermi Level of a Semiconductor at an Electrical Junction and Devices Incorporating Such Junctions
Method for Depinning the Fermi Level of a Semiconductor at an Electrical Junction and Devices Incorporating Such Junctions
Method for Depinning the Fermi Level of a Semiconductor at an Electrical Junction and Devices Incorporating Such Junctions
Method for Depinning the Fermi Level of a Semiconductor at an Electrical Junction and Devices Incorporating Such Junctions
Method for Depinning the Fermi Level of a Semiconductor at an Electrical Junction and Devices Incorporating Such Junctions
Method for Depinning the Fermi Level of a Semiconductor at an Electrical Junction and Devices Incorporating Such Junctions
Method for Depinning the Fermi Level of a Semiconductor at an Electrical Junction and Devices Incorporating Such Junctions
Method for Depinning the Fermi Level of a Semiconductor at an Electrical Junction and Devices Incorporating Such Junctions
Method for Depinning the Fermi Level of a Semiconductor at an Electrical Junction and Devices Incorporating Such Junctions
Method for Depinning the Fermi Level of a Semiconductor at an Electrical Junction and Devices Incorporating Such Junctions
Method for Depinning the Fermi Level of a Semiconductor at an Electrical Junction and Devices Incorporating Such Junctions
Method for Depinning the Fermi Level of a Semiconductor at an Electrical Junction and Devices Incorporating Such Junctions
Insulated Gate Field Effect Transistor Having Passivated Schottky Barriers to the Channel
Insulated Gate Field Effect Transistor Having Passivated Schottky Barriers to the Channel
Insulated Gate Field Effect Transistor Having Passivated Schottky Barriers to the Channel
Insulated Gate Field Effect Transistor Having Passivated Schottky Barriers to the Channel
Insulated Gate Field Effect Transistor Having Passivated Schottky Barriers to the Channel
Insulated Gate Field Effect Transistor Having Passivated Schottky Barriers to the Channel
Insulated Gate Field Effect Transistor Having Passivated Schottky Barriers to the Channel
Transistor with Workfunction-Induced Charge Layer
Patent:
6,891,234 →
Application:
10/832,576 →
Insulated Gate Field-Effect Transistor Having Iii-Vi Source/Drain Layer(S)
Method for Depinning the Fermi Level of a Semiconductor at an Electrical Junction and Devices Incorporating Such Junctions
Process for Fabricating a Self-Aligned Deposited Source/Drain Insulated Gate Field-Effect Transistor
Field Effect Transistor Source or Drain with a Multi-Facet Surface
Mis Contact Structure with Metal Oxide Conductor
Patent:
9,620,611 →
Application:
15/186,378 →
Mis Contact Structure with Metal Oxide Conductor
Mis Contact Structure with Metal Oxide Conductor
Mis Contact Structure with Metal Oxide Conductor
Mis Contact Structure with Metal Oxide Conductor
Process for Fabricating a Self-Aligned Deposited Source/Drain Insulated Gate Field-Effect Transistor
Related Assignments
(12)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 12, 2002
From: GRUPP, DANIEL E.; CONNELLY, DANIEL J.
To: ACORN TECHNOLOGIES, INC.
Reel/Frame 013195/0068 →
Assignment of Assignor's Interest
Jan 8, 2009
From: GRUPP, DANIEL E.; CONNELLY, DANIEL J.
To: ACORN TECHNOLOGIES, INC.
Reel/Frame 022077/0447 →
Assignment of Assignor's Interest
Nov 28, 2012
From: GRUPP, DANIEL E.; CONNELLY, DANIEL J.
To: ACORN TECHNOLOGIES, INC.
Reel/Frame 029367/0526 →
Assignment of Assignor's Interest
Jun 22, 2015
From: GRUPP, DANIEL E.; CONNELLY, DANIEL J.
To: ACORN TECHNOLOGIES, INC.
Reel/Frame 035878/0420 →
Security Interest
May 30, 2019
From: ACORN SEMI LLC
To: THE PETER NORTON LIVING TRUST DATED APRIL 28, 1989,
Reel/Frame 049320/0634 →
Assignment of Assignor's Interest
Jun 26, 2019
From: ACORN TECHNOLOGIES, INC.
To: ACORN SEMI, LLC
Reel/Frame 049602/0324 →
Assignment of Assignor's Interest
Sep 15, 2020
From: GRUPP, DANIEL E.; CONNELLY, DANIEL J.
To: ACORN TECHNOLOGIES, INC.
Reel/Frame 053773/0225 →
Assignment of Assignor's Interest
Sep 15, 2020
From: ACORN TECHNOLOGIES, INC.
To: ACORN SEMI, LLC
Reel/Frame 053773/0306 →
Assignment of Assignor's Interest
Jun 14, 2021
From: GRUPP, DANIEL E.; CONNELLY, DANIEL J.
To: ACORN TECHNOLOGIES, INC.
Reel/Frame 056538/0139 →
Assignment of Assignor's Interest
Jun 14, 2021
From: ACORN TECHNOLOGIES, INC.
To: ACORN SEMI, LLC
Reel/Frame 056538/0154 →
Release of Security Interest
Dec 26, 2024
From: THE PETER NORTON LIVING TRUST
To: ACORN SEMI, LLC
Reel/Frame 069792/0173 →
Release of Security Interest
Dec 26, 2024
From: THE PETER NORTON LIVING TRUST
To: ACORN TECHNOLOGIES, INC.
Reel/Frame 069792/0208 →