Method for depinning the Fermi level of a semiconductor at an electrical junction and devices incorporating such junctions
An electrical device in which an interface layer is disposed in between and in contact with a conductor and a semiconductor.
1. An electrical junction, comprising an interface layer disposed between and in contact with a conductor and a semiconductor material, the interface layer containing a passivation material that bonds to the semiconductor material by way of terminating dangling bonds that are at a surface of the semiconductor material adjacent the passivation material the interface layer having a thickness that permits current to flow between the conductor and the semiconductor material when the junction is biased, wherein the interface layer comprises a monolayer of arsenic, fluorine, or another material having a valence similar to arsenic or fluorine and is configured to reduce a height of a Schottky barrier between the conductor and the semiconductor material from that which would exist at a junction between the conductor and the semiconductor material without the interface layer disposed therebetween.
2. The electrical junction of claim 1 , wherein the conductor is a metal silicide.
3. The electrical junction of claim 1 , wherein the conductor is a metal.
4. The electrical junction of claim 1 , wherein the semiconductor material comprises n-type doped silicon.
5. The electrical junction of claim 1 , wherein the semiconductor material is n-type doped semiconductor material.
6. The electrical junction of claim 1 , wherein the passivation material additionally bonds to the semiconductor material by way of terminating dangling bonds within a few molecular dimensions from the surface of the semiconductor material adjacent the passivation material.
7. A passivated Schottky barrier, comprising a semiconductor, an interface layer, and a conductor organized in a layered structure, the interface layer containing a passivation material that bonds to the semiconductor material by way of covalent bonds formed between the passivation material and the semiconductor, the layered structure having a Schottky barrier height that deviates from a Schottky barrier height that would form naturally at a contact junction between the semiconductor and the conductor without the interface layer disposed therebetween, wherein the passivated Schottky barrier is at a junction of a source or drain of a transistor, the semiconductor is a silicon-based semiconductor, the passivation material is a layer of material formed using arsenic, and the interface layer further includes an oxide.
8. The passivated Schottky barrier of claim 7 , wherein the conductor is a metal.
9. The passivated Schottky barrier of claim 7 , wherein the conductor is a metal silicide.
10. The passivated Schottky barrier of claim 7 , wherein the passivation material is a layer of a material formed using arsenic having a thickness of approximately 0.1 nm to 5 nm.
11. The passivated Schottky barrier of claim 7 , wherein the semiconductor material is a silicon-based semiconductor and the passivation material is a layer of material formed using arsenic having a thickness of approximately 0.1 nm to 5 nm.