Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
A stackable microelectronic package includes a first microelectronic die attached to and electrically connecting with a first substrate. A second microelectronic die is attached to the first die on one side, and to a second substrate on the other side. Electrical connections are made between the first die and the first substrate, between the second die and the second substrate, and between the first and second substrates, e.g., via wire bonding. The electrical connecting elements are advantageously encased in a molding compound. Exposed contacts on the first and/or second substrates, not covered by the molding compound, provide for electrical connections between the package, and another package stacked onto the package. The package may avoid coplanarity factors, can be manufactured using existing equipment, allows for intermediate testing, and can also offer a thinner package height.
1. A method for manufacturing a microelectronic package, comprising:
attaching a first die to a first substrate having a first external contact facing a first direction, a first wire bond contact facing a second direction opposite the first direction, and wherein the first substrate has a through opening;
extending wires from a plurality of contacts on the first die through the through opening to contacts facing the first direction;
attaching a second die to the first die;
attaching a second substrate to the second die, the second substrate having a second external contact and a second wire bond contact facing the second direction;
disposing a first wire bond between the first wire bond contact at the first substrate and the second wire bond contact at the second substrate; and
encapsulating the first and second wire bond contacts and the first wire bond with a molding compound without covering the first external contact or the second external contact.
2. The method of claim 1 wherein attaching a first die to a first substrate includes attaching the first die to the first substrate in a board-on-chip arrangement.
3. The method of claim 1 wherein attaching a first die to a first substrate includes attaching the first die to the first substrate in a flip-chip arrangement.
4. The method of claim 1 further comprising enclosing the wires in a mold compound.
5. The method of claim 1 further comprising excluding the molding compound from areas of the second substrate to leave a grid array of electrical contacts exposed, to allow the microelectronic package to be stacked on another microelectronic package.
6. The method of claim 1 further comprising excluding the molding compound from areas of the first substrate to leave a grid array of electrical contacts exposed, to allow the microelectronic package to be stacked on another microelectronic package.
7. The method of claim 1 further comprising attaching a back surface of the first die to a back surface of the second die via an adhesive.
8. A method for making a stackable multi-electronic package, comprising:
attaching a first die onto a first substrate, with the first die having electrical couplers physically contacting pads on the first substrate;
attaching second die on the first die;
attaching a second substrate on the second die;
wire bonding first contacts on the first substrate to first contacts on the second substrate; and
wire-bonding connecting terminals on the second die to second contacts on the second substrate.
9. The method of claim 8 wherein the first contacts on the first substrate are adjacent to an edge of the first substrate, and wherein the first contacts on the second substrate are adjacent to an edge of the second substrate.
10. The method of claim 8 wherein the second contacts on the second substrate are adjacent to an opening in the second substrate.
11. A method for manufacturing a microelectronic package, comprising:
attaching a first die to a first substrate having a first external contact facing a first direction and a first wirebond contact facing a second direction opposite the first direction;
attaching a second die to the first die;
attaching a second substrate to the second die, the second substrate having a second external contact and a second wirebond contact facing the second direction;
disposing a wirebond between the first wirebond contact at the first substrate and the second wirebond contact at the second substrate;
encapsulating the first and second wirebond contacts and the wirebond with a molding compound; and
exposing the first and second external contacts from the molding compound for external connection.
12. The method of claim 11 , further comprising:
attaching a first solder ball to the first external contact; and
attaching a second solder ball to the second external contact.
13. The method of claim 11 wherein encapsulating the first and second wirebond contacts includes at least partially encapsulating the first and second substrates and the first and second dies with the molding compound without covering the first external contact or the second external contact.
14. The method of claim 11 , further comprising electrically coupling the first die with the first substrate via wirebonding.
15. The method of claim 11 wherein attaching a first die to a first substrate includes attaching the first die to the first substrate in a flip-chip arrangement.
16. The method of claim 11 wherein the first substrate is larger than the second substrate, and wherein disposing a wirebond includes disposing a wirebond between the first wirebond contact and the second wirebond contact, the first wirebond contact being located in an area that extends beyond the second substrate.