High density server storage unit
View Patent ↗A rack mountable 1U storage unit includes a plurality of memory modules arranged in two groups. The storage unit also has control circuitry. The memory modules have a dedicated exhaust channel to draw heat away from the memory modules. The exhaust channel for the memory modules is disposed over and is physically separated from the exhaust channel for the control circuitry. The storage unit can accommodate up to 42 memory modules due to a unique method of placing the individual memory modules.
1. A storage unit comprising:
an enclosure having a front face, a back face opposing the front face, and two side faces;
a first section within the enclosure including a first plurality of memory modules;
a second section within the enclosure including a second plurality of memory modules, wherein the first and the second sections abut the back face;
a third section including control circuitry, the third section abutting the front face;
a panel overlying the third section;
a plurality of fans attached to the back face and operable to direct air flow towards the front face;
a first plurality of openings disposed in an upper section of the front face;
a second plurality of opening disposed directly below the first plurality of openings;
a first exhaust channel, the first exhaust channel thermally coupled to the first and the second plurality of memory modules and extending towards the front face over the panel and ending at the first plurality of openings, wherein the first exhaust channel is configured to direct flow of hot air from the first plurality of memory modules to the front face without allowing the hot air to interact with the control circuitry; and
a second exhaust channel thermally coupled to the third section and extending towards the front face underneath the panel and ending at the second plurality of openings.
2. The storage unit of claim 1 wherein each of the first and the second plurality of memory modules includes 21 memory modules.
3. The storage unit of claim 1 wherein each of the memory modules comprises:
a printed circuit board (PCB) including one or more memory devices; and
a stiffener member attached to the PCB, wherein a width of the stiffener member is between 5 mm and 6 mm.
4. The storage unit of claim 3 wherein the one or more memory devices include a multi-level cell (MLC) non-volatile memory devices.
5. The storage unit of claim 1 wherein the second exhaust channel is disposed below the first exhaust channel.
6. The storage unit of claim 1 wherein the first exhaust channel includes the panel that provides a physical barrier between the first exhaust channel and the third section.
7. A storage unit comprising:
a first plurality of memory modules disposed side-by-side to each other; and
a second plurality of memory modules disposed side-by-side to each other, wherein each of the first and second plurality of memory modules comprises:
a memory board including a plurality of memory devices; and
a stiffener attached to the memory board;
wherein the stiffeners of two neighboring memory module are configured to be in direct contact.
8. The storage unit of claim 7 further comprising an enclosure that conforms with 1 U specification for a rack mountable unit.
9. The storage unit of claim 7 wherein the memory module includes a pair of anchor points for connection with the stiffener.
10. The storage unit of claim 7 further comprising a first exhaust channel configured to exhaust hot air from the first plurality of memory modules and the second plurality of memory modules.
11. The storage unit of claim 10 further comprising:
control circuitry; and
a second exhaust channel configured to exhaust hot air from the control circuitry, wherein the second exhaust channel is disposed directly below the first exhaust channel.
12. The storage unit of claim 11 comprising a solid panel separating the first and the second exhaust channels.