IP Library Granted Patent US 10,468,590
Granted Patent B2
US 10,468,590 · App. 15/091,853 · Granted Nov 5, 2019

High annealing temperature perpendicular magnetic anisotropy structure for magnetic random access memory

Inventors: Bartlomiej Adam Kardasz (Pleasanton, CA); Mustafa Michael Pinarbasi (Morgan Hill, CA); Jacob Anthony Hernandez (Morgan Hill, CA)
Assignee: Spin Memory, Inc.
H01L43/10H01F10/3286H01F41/302H01L43/08H01L43/12H01F10/3272
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Quick Facts
Patent No.
US 10,468,590
App. No.
15/091,853
Granted
Nov 5, 2019
Kind
B2
Abstract

A perpendicular synthetic antiferromagnetic (pSAF) structure and method of making such a structure is disclosed. The pSAF structure can be a first high perpendicular Magnetic Anisotropy (PMA) multilayer and a second high PMA layer separated by a thin Ruthenium layer. Each PMA layer can be a first cobalt layer and a second cobalt layer separated by a nickel/cobalt multilayer. After each of the first and second PMA layers and the Ruthenium exchange coupling layer are deposited, the resulting structure goes through a high temperature annealing step, which results in each of the first and second PMA layers having a perpendicular magnetic anisotropy.

Claims (23)

1. A magnetic device, comprising

a PMA seed multilayer comprised of a first seed layer and a nickel (Ni) seed layer, the Ni seed layer being disposed over the first seed layer, the first seed layer comprising a layer of α-TaN;

a first magnetic perpendicular magnetic anisotropy (PMA) multilayer disposed over the PMA seed multilayer, the first magnetic PMA multilayer comprising a first cobalt (Co) layer and a second Co layer, where the first Co layer and the second Co layer are separated by a first nickel/cobalt (Ni/Co) multilayer, wherein the first magnetic PMA multilayer has been annealed at a temperature of 350 degrees Celsius or higher, and has a magnetic direction perpendicular to its plane;

a Ruthenium (Ru) antiferromagnetic interlayer exchange coupling layer disposed over the first magnetic PMA multilayer;

a second magnetic PMA multilayer disposed over the Ru antiferromagnetic interlayer exchange coupling layer, the second magnetic PMA multilayer comprising a third Co layer and a fourth Co layer, where the third Co layer and the fourth Co layer are separated by a second nickel/cobalt (Ni/Co) multilayer, wherein the second magnetic PMA multilayer has been annealed at the temperature of 350 degrees Celsius or higher, and has a magnetic direction perpendicular to its plane;

wherein the first magnetic PMA multilayer, the Ru interlayer exchange coupling layer and the second magnetic PMA multilayer form a perpendicular synthetic antiferromagnet.

2. The magnetic device of claim 1 where in the first seed layer has a thickness of five nanometers.

3. The magnetic device of claim 1 wherein the first Co layer has a thickness of 0.3 nanometers, the second Co layer has a thickness of 0.18 nanometers.

4. The magnetic device of claim 3 , wherein the first Ni/Co multilayer comprises a nickel layer having a thickness of 0.6 nanometers and a cobalt layer having a thickness of 0.2 nanometers.

5. The magnetic device of claim 4 , wherein the first Ni/Co multilayer is repeated five times.

6. The magnetic device of claim 1 , wherein the Ni seed layer of the PMA seed multilayer has a thickness ranging from 0.5 nanometers to 0.95 nanometers.

7. The magnetic device of claim 1 , wherein the Ni seed layer of the PMA seed multilayer has a thickness of 0.93 nanometers.

8. The magnetic device of claim 1 , wherein the Ruthenium (Ru) antiferromagnetic interlayer exchange coupling layer has a thickness of 0.85 nanometers.

9. The magnetic device of claim 1 , wherein the first Co layer has a thickness of 0.3 nanometers, the second Co layer has a thickness of 0.18 nanometers, the third Co layer has a thickness of 0.18 nanometers, the fourth Co layer has a thickness of 0.18 nanometers.

10. The magnetic device of claim 9 , wherein the first Ni/Co multilayer comprise a first Ni layer having a thickness of 0.6 nanometers and fifth Co layer having a thickness of 0.2 nanometers.

11. The magnetic device of claim 10 wherein the first Ni/Co multilayer comprises five Ni/Co multilayers.

12. The magnetic device of claim 9 , wherein the second Ni/Co multilayer comprise a sixth Co layer having a thickness of 0.2 nanometers and second Ni layer having a thickness of 0.6 nanometers.

13. The magnetic device of claim 12 wherein the second Ni/Co multilayer comprises five Ni/Co multilayers.

14. The magnetic device of claim 1 , further comprising:

a non-magnetic tunneling barrier layer over the second magnetic PMA multilayer;

a free magnetic layer over the non-magnetic tunneling barrier layer, the free magnetic layer having a magnetic direction that can precess between a first direction and a second direction, the non-magnetic tunneling barrier layer spatially separating the free magnetic layer from the second magnetic PMA multilayer; and

wherein the second magnetic PMA multilayer, the non-magnetic tunneling barrier layer, and the free magnetic layer form a magnetic tunnel junction.

15. The magnetic device of claim 1 , wherein the first seed layer further comprises a layer of Ta.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 11, 2021
From: SPIN (ASSIGNMENT FOR BENEFIT OF CREDITORS), LLC
To: INTEGRATED SILICON SOLUTION, (CAYMAN) INC.
Reel/Frame 057473/0319 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 20, 2021
From: SPIN MEMORY, INC.
To: SPIN (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
Reel/Frame 056927/0038 →
CHANGE OF NAME Recorded Jan 15, 2019
From: SPIN TRANSFER TECHNOLOGIES, INC.
To: SPIN MEMORY, INC.
Reel/Frame 048075/0550 →
SECURITY INTEREST Recorded Jun 16, 2017
From: SPIN TRANSFER TECHNOLOGIES, INC.
To: SILICON VALLEY BANK
Reel/Frame 042981/0819 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 6, 2016
From: KARDASZ, BARTLOMIEJ ADAM; PINARBASI, MUSTAFA MICHAEL; HERNANDEZ, JACOB ANTHONY
To: SPIN TRANSFER TECHNOLOGIES, INC.
Reel/Frame 038206/0114 →
Continuity (2)
Provisional Application 62150785 · Apr 21, 2015
Related Publication 20160315118A1 · Oct 27, 2016