Interconnections for 3D memory
Apparatuses and methods for interconnections for 3D memory are provided. One example apparatus can include a stack of materials including a plurality of pairs of materials, each pair of materials including a conductive line formed over an insulation material. The stack of materials has a stair step structure formed at one edge extending in a first direction. Each stair step includes one of the pairs of materials. A first interconnection is coupled to the conductive line of a stair step, the first interconnection extending in a second direction substantially perpendicular to a first surface of the stair step.
1. A method, comprising:
performing a read operation on a three dimensional memory array including a string of memory cells and access lines coupled to the string and comprising:
disabling an equalization circuit coupled to the access lines and the string;
providing a first voltage level to a selected one of the access lines,
providing a second voltage level to a non-selected one of the access lines, the second voltage level being higher than the first voltage level;
after performing the read operation:
providing a third voltage level to the selected one of the access lines, wherein the first and third voltage levels are different from each other, and the third voltage level is higher than a ground reference potential; and
enabling the equalization circuit such that the selected one of the access lines is coupled to the non-selected one of the access lines.
2. The method of claim 1 , comprising:
after performing the read operation, providing a fourth voltage level to the non-selected one of the access lines, wherein the third and fourth voltage levels are substantially equal to each other.
3. The method of claim 2 , comprising:
after providing the third voltage to the selected one of the access lines and the fourth voltage level to the non-selected one of the access lines, discharging the selected one of the access lines and the non-selected one of the access lines to the ground reference potential.
4. The method of claim 2 , comprising:
after performing the read operation, providing a fourth voltage level to the non-selected one of the access lines, wherein the third and fourth voltage levels are not equal to each other.
5. The method of claim 2 , comprising:
after performing the read operation, controlling the selected one of the access lines and the non-selected one of the access lines to be substantially equal to the ground reference potential.
6. The method of claim 2 , comprising:
discharging the selected one the access lines to the ground reference potential after providing the third voltage level to the selected one of the access lines.
7. An apparatus comprising:
a three dimensional memory comprising access lines coupled to memory cells and an equalization circuit, the access lines comprising a first access line configured to be a selected access line in a read operation and a second access line configured to be a non-selected access line in the read operation, wherein, upon completion of the read operation, the equalization circuit is enabled to couple the first access line to the second access line such that the first and second access lines are, after the read operation is completed, substantially equal in a voltage level to each other, the voltage level being different from a ground reference potential.
8. The apparatus of claim 7 , wherein the three dimensional memory comprises a stair step structure comprising the access lines.
9. The apparatus of claim 7 , wherein the first and second access lines are configured to be discharged to the ground reference potential after the first and second access lines are configured to be substantially equal in the voltage level to each other.
10. The apparatus of claim 9 , wherein the first and second access lines are configured to have, after being discharged to the ground reference potential, a non-negative potential.
11. The apparatus of claim 7 , comprising:
a first string driver coupled to a corresponding one of the access lines to drive the corresponding one of the access lines.
12. The apparatus of claim 11 , wherein the three dimensional memory array comprises a drain select gate and a source select gate and the apparatus comprises:
a second string driver coupled to the drain select gate to drive the drain select gate; and
a third string driver coupled to the source select gate to drive the select gate.
13. The apparatus of claim 7 , comprising:
a controller configured to control the read operation of the three dimensional memory.
14. The apparatus of claim 7 , comprising:
a host; and
an interface configured to communicate data used in the read operation with the host.