Top-side connector interface for processor packaging
An apparatus is provided which comprises: a processor die; a processor substrate having a region extended away from the processor die, wherein the processor die is mounted on the processor substrate, wherein the extended region has at least one signal interface which is connectable to a top-side connector; and an interposer coupled to the processor substrate and a motherboard.
1. An apparatus comprising:
a processor die;
a processor substrate coupled to the processor die; and
an interposer coupled to the processor substrate and a motherboard, wherein the interposer has a region which is extended away from the processor substrate, wherein the extended region of the interposer has at least one signal path communicatively coupled to the processor die, wherein the extended region of the interposer is configured to be directly connected to a top-side connector via an interface on the interposer, and wherein the interface is closer in proximity to the motherboard than the processor die is to the motherboard.
2. The apparatus of claim 1 , wherein the interposer comprises a reflow grid array (RGA).
3. The apparatus of claim 2 , wherein the RGA has heat traces to distribute heat uniformly in the RGA.
4. The apparatus of claim 3 , wherein the processor substrate is a substrate of a ball grid array (BGA).
5. The apparatus of claim 4 , wherein the top-side connector has screws to fasten the top-side connector to the interposer.
6. A system comprising:
a memory;
a processor die coupled to the memory;
a package encasing the processor die, the package including:
a processor substrate coupled to the processor die; and
an interposer coupled to the processor substrate and a motherboard, wherein the interposer has a region which is extended away from the processor substrate, wherein the extended region of the interposer has at least one signal path on the extended region of the processor substrate communicatively coupled to the processor die, wherein the extended region of the interposer is configured to be directly connected to a top-side connector at an interface on the interposer, wherein the interface is along a different plane than a plane of the processor die via an interface, and wherein the interface is closer in proximity to the motherboard than the processor die is to the motherboard; and
a wireless interface to allow the processor to communicate with another device.
7. The system of claim 6 , wherein the interposer comprises a reflow grid array (RGA).
8. The system of claim 7 , wherein the RGA has heat traces to distribute heat uniformly in the RGA.
9. The system of claim 8 , wherein the processor substrate is a substrate of a ball grid array (BGA).
10. The system of claim 6 , wherein the top-side connector has screws to fasten the top-side connector to the interposer.
11. A method comprising:
mounting a processor die on to a processor substrate;
mounting the processor substrate on to an interposer, wherein the interposer has a region which is extended away from the processor substrate, wherein the extended region of the interposer has at least one signal path communicatively coupled to the processor die, wherein the at least one signal path is along a same plane as the processor die, and wherein the extended region of the interposer is configured to be directly connected to a top-side connector; and
coupling a top-side connector to the extended region of the interposer.
12. The method of claim 11 comprises fastening the top-side connector to the extended region of the interposer with at least two screws.
13. The method of claim 11 , wherein the interposer comprises a reflow grid array (RGA), and wherein the processor substrate comprises a substrate of a ball grid array (BGA).