Buried source-drain contact for integrated circuit transistor devices and method of making same
An integrated circuit transistor is formed on a substrate. A trench in the substrate is at least partially filled with a metal material to form a source (or drain) contact buried in the substrate. The substrate further includes a source (or drain) region in the substrate which is in electrical connection with the source (or drain) contact. The substrate further includes a channel region adjacent to the source (or drain) region. A gate dielectric is provided on top of the channel region and a gate electrode is provided on top of the gate dielectric. The substrate may be of the silicon on insulator (SOI) or bulk type. The buried source (or drain) contact makes electrical connection to a side of the source (or drain) region using a junction provided at a same level of the substrate as the source (or drain) and channel regions.
1. A method, comprising:
providing a substrate comprising an insulator layer located between a base substrate layer and a semiconductor layer;
forming a trench in the substrate, wherein the trench extends through the semiconductor layer and into the insulator layer;
at least partially filling the trench with a metal material to form a source contact buried in the substrate, but exposing a side wall of the substrate;
doping the exposed side wall of the substrate to define a source region adjacent a channel region, wherein the source region and the channel region are located in the semiconductor layer;
providing a gate dielectric on top of the channel region;
forming a gate electrode on the gate dielectric; and
forming a conductive junction in the trench to electrically connect a top of the buried source contact to a side of the source region, the conductive junction provided at a same level as the semiconductor layer.
2. The method of claim 1 , further comprising defining a plurality of fins in the semiconductor layer, each fin including the source region and the channel region.
3. The method of claim 1 , further comprising forming a silicide region between the top of the buried source contact and a bottom of the conductive junction.
4. The method of claim 1 , further comprising forming a gate contact extending from above the gate electrode to make electrical contact with the gate electrode, the gate contact laterally extending over the source region.
5. The method of claim 4 , further comprising:
forming a premetal dielectric region over the substrate within which the gate contact is located; and
forming a via extending through the premetal dielectric region to make electrical contact with the buried source contact.
6. A method, comprising:
providing a bulk substrate including a first semiconductor layer located between a base substrate layer and a second semiconductor layer;
forming a trench in the bulk substrate, wherein the trench extends through the second semiconductor layer and into the first semiconductor layer;
at least partially filling the trench with a metal material to form a source contact buried in the bulk substrate, but exposing a side wall of the bulk substrate;
doping the exposed side wall of the bulk substrate to define a source region adjacent a channel region, wherein the source region and the channel region are located in the second semiconductor layer;
providing a gate dielectric on top of the channel region;
forming a gate electrode on the gate dielectric; and
forming a conductive junction in the trench to electrically connect a top of the buried source contact to a side of the source region, the conductive junction provided at a same level as the second semiconductor layer.
7. The method of claim 6 , further comprising defining a plurality of fins in the second semiconductor layer, each fin including the source region and the channel region.
8. The method of claim 6 , further comprising forming an insulating layer in the trench to separate the metal material of the source contact from at least the first semiconductor layer.
9. The method of claim 6 , further comprising forming a silicide region between the top of the buried source contact and a bottom of the conductive junction.
10. A method, comprising:
forming a trench in a bulk substrate comprising a semiconductor material, wherein the trench extends to a depth below a top portion of the bulk substrate;
at least partially filling the trench with a metal material to form a source contact buried in the bulk substrate, but exposing a side wall of the bulk substrate;
doping the exposed side wall of the bulk substrate to define a source region adjacent a channel region, wherein the source region and the channel region are located in a top portion of the bulk substrate;
providing a gate dielectric on top of the channel region;
forming a gate electrode on the gate dielectric; and
forming a conductive junction in the trench to electrically connect a top of the buried source contact to a side of the source region, the conductive junction provided at a same level as the top portion of the bulk substrate.
11. The method of claim 10 , further comprising defining a plurality of fins in the top portion of the bulk substrate, each fin including the source region and the channel region.
12. The method of claim 10 , further comprising forming an insulating layer in the trench to separate the metal material of the source contact from the bulk substrate.
13. The method of claim 10 , further comprising forming a silicide region between the top of the buried source contact and a bottom of the conductive junction.