Method of forming a copper based interconnect structure
View Patent ↗Low capacitance and high reliability interconnect structures and methods of manufacture are disclosed. The method includes forming a copper based interconnect structure in an opening of a dielectric material. The method further includes forming a capping layer on the copper based interconnect structure. The method further includes oxidizing the capping layer and any residual material formed on a surface of the dielectric material. The method further includes forming a barrier layer on the capping layer by outdiffusing a material from the copper based interconnect structure to a surface of the capping layer. The method further includes removing the residual material, while the barrier layer on the surface of the capping layer protects the capping layer.
1. A method, comprising:
forming a copper based interconnect structure comprising:
forming a Tantalum Nitride (TaN) layer in an opening of a dielectric material;
forming a CuMn layer directly on the TaN layer; and
electroplating a copper layer on the CuMn layer;
forming a capping layer on the copper based interconnect structure;
oxidizing the capping layer and residual material formed on a surface of the dielectric material;
forming a barrier layer on the capping layer by outdiffusing a material from the copper based interconnect structure to a surface of the capping layer; and
removing the residual material, while the barrier layer on the surface of the capping layer protects the capping layer,
wherein the forming the barrier layer comprises outdiffusing Mn from the CuMn layer through both the copper layer and the capping layer during an anneal process.
2. The method of claim 1 , wherein the forming the barrier layer comprises outdiffusing Mn to the surface of the capping layer during an anneal process.
3. The method of claim 1 , further comprising performing a chemical mechanical polish on a top surface of the copper based interconnect structure and a top surface of the dielectric material prior to the forming the capping layer on the copper based interconnect structure.
4. The method of claim 1 , wherein the capping layer extends entirely across a top surface of the copper based interconnect structure.
5. The method of claim 1 , wherein the capping layer comprises cobalt or CoWP.
6. The method of claim 1 , wherein:
a bottom surface of the capping layer is on an upper surface of the copper layer; and
the barrier layer is on an upper surface and side surfaces of the capping layer.
7. The method of claim 6 , wherein:
the capping layer is composed of cobalt (Co); and
the oxidizing forms a first cobalt oxide (CoO) passivation layer on the capping layer and a second CoO passivation layer on the residual material.
8. A method, comprising:
forming a copper based interconnect structure comprising:
forming a cobalt layer in an opening of a dielectric material;
forming a CuMn layer on the cobalt layer; and
electroplating a copper layer on the CuMn layer;
forming a capping layer on the copper based interconnect structure;
oxidizing the capping layer and residual material formed on a surface of the dielectric material;
forming a barrier layer on the capping layer by outdiffusing a material from the copper based interconnect structure to a surface of the capping layer; and
removing the residual material, while the barrier layer on the surface of the capping layer protects the capping layer,
wherein the capping layer is cobalt and the residual material is oxidized cobalt, and
wherein the forming the barrier layer comprises outdiffusing Mn from the CuMn layer through both the copper layer and the capping layer during an anneal process.
9. The method of claim 8 , wherein the barrier layer is formed at an interface of the dielectric material and the cobalt in the opening during the anneal process.
10. The method of claim 8 , wherein the forming the barrier layer comprises outdiffusing Mn to the surface of the capping layer during an anneal process.
11. The method of claim 8 , further comprising performing a chemical mechanical polish on a top surface of the copper based interconnect structure and a top surface of the dielectric material prior to the forming the capping layer on the copper based interconnect structure.
12. The method of claim 8 , wherein the capping layer extends entirely across a top surface of the copper based interconnect structure.
13. The method of claim 8 , wherein the capping layer comprises cobalt or CoWP.
14. The method of claim 8 , wherein:
a bottom surface of the capping layer is on an upper surface of the copper layer; and
the barrier layer is on an upper surface and side surfaces of the capping layer.
15. A method, comprising:
forming a copper based interconnect structure comprising:
forming an underlying barrier layer in an opening of a dielectric material, the underlying barrier layer being composed of a first material selected from the group consisting of: Ag, Sn, and Zn;
forming a CuMn layer on the underlying barrier layer; and
electroplating a copper layer on the CuMn layer;
forming a capping layer on the copper based interconnect structure, the capping layer being composed of the first material;
oxidizing the capping layer and residual material formed on a surface of the dielectric material;
forming a barrier layer on the capping layer by outdiffusing a material from the copper based interconnect structure to a surface of the capping layer; and
removing the residual material, while the barrier layer on the surface of the capping layer protects the capping layer,
wherein the forming the barrier layer comprises outdiffusing Mn from the CuMn layer through both the copper layer and the capping layer during an anneal process.
16. The method of claim 15 , wherein:
the oxidizing results in a first oxidized passivation layer on the capping layer and a second oxidized passivation layer on the residual material; and
the first oxidized passivation layer and the second oxidized passivation layer each are composed of one selected from the group consisting of: AgO when the first material is Ag; SnO when the first material is Sn; and ZnO when the first material is Zn.
17. The method of claim 15 , further comprising performing a chemical mechanical polish on a top surface of the copper based interconnect structure and a top surface of the dielectric material prior to the forming the capping layer on the copper based interconnect structure.