IC structure with interface liner and methods of forming same
Embodiments of the present disclosure may provide a method of forming an integrated circuit (IC) structure, the method including: providing a structure with: a conductive region, and an inter-level dielectric (ILD) material positioned on the conductive region, wherein the ILD material includes a contact opening to the conductive region; forming a doped metal layer within the contact opening such that the doped metal layer overlies the conductive region, wherein the doped metal layer includes a first metal doped with a second metal; and forming a contact to the conductive region within the contact opening of the ILD material by annealing the doped metal layer such that the second metal diffuses into the ILD material to form an interface liner directly between the annealed doped metal layer and the ILD material.
1. A method of forming an integrated circuit (IC) structure, the method comprising:
providing a structure including:
a conductive region, and
an inter-level dielectric (ILD) material positioned on the conductive region, wherein the ILD material includes a contact opening to the conductive region;
forming a doped metal layer within the contact opening such that the doped metal layer overlies the conductive region, wherein the doped metal layer includes a first metal doped with a second metal; and
forming a contact to the conductive region within the contact opening of the ILD material by annealing the doped metal layer such that the second metal diffuses into the ILD material to form an interface liner directly between the annealed doped metal layer and the ILD material,
wherein the interface liner is formed only on sidewalls of the contact opening and in direct contact with the ILD material, and
wherein the interface liner is formed only at an interface of the doped metal layer and the ILD material.
2. The method of claim 1 , wherein the conductive region comprises one of a transistor gate metal or a source/drain silicide.
3. The method of claim 1 , wherein annealing the second metal includes diffusing the second metal from the doped metal layer into the ILD material to form the interface liner without diffusing into the conductive region.
4. The method of claim 1 , wherein the first metal includes cobalt (Co).
5. The method of claim 1 , wherein the ILD material includes silicon oxide, and wherein annealing causes the silicon oxide to react with the second metal to yield a silicate compound.
6. The method of claim 1 , further comprising treating the sidewalls of the contact opening with a nitrogen plasma before forming the doped metal layer, wherein the nitrogen plasma enhances formation of the interface liner at the interface of the doped metal layer and the ILD material.
7. The method of claim 1 , further comprising planarizing an upper surface of the doped metal layer and the ILD material after the annealing.
8. The method of claim 1 , wherein annealing occurs at a temperature between approximately three-hundred and six-hundred degrees Celsius.
9. The method of claim 4 , wherein the second metal includes manganese (Mn).
10. The method of claim 5 , wherein the silicate compound includes manganese silicate.
11. A method of forming a transistor structure for an integrated circuit (IC), the method comprising:
forming a contact opening within an ILD material positioned over the transistor structure, wherein forming the contact opening exposes a source/drain region and a gate metal of the transistor structure;
forming a source/drain silicide on the source/drain region, after forming the contact opening;
forming a doped metal layer within the contact opening, wherein the doped metal layer includes a first metal doped with a second metal; and
forming a contact to the source/drain region and the gate metal within the contact opening of the ILD material by annealing the doped metal layer, such that the second metal diffuses into the ILD material to form an interface liner directly between the first metal and the ILD material,
wherein the interface liner is formed only on sidewalls of the contact opening and in direct contact with the ILD material, and
wherein the interface liner is formed only at an interface of the doped metal layer and the ILD material.
12. The method of claim 11 , wherein the first metal includes cobalt (Co), and wherein the second metal includes manganese (Mn).
13. The method of claim 11 , wherein annealing the second metal includes diffusing the second metal from the doped metal layer into the ILD material to form the interface liner, without the second metal diffusing into the gate region and the source/drain silicide of the transistor.
14. The method of claim 11 , further comprising treating the sidewalls of the contact opening with a nitrogen plasma before forming the doped metal layer therein, wherein the nitrogen plasma enhances formation of the interface liner at the interface of the doped metal layer and the ILD material.
15. The method of claim 12 , wherein the ILD material includes silicon oxide, and the annealing causes the silicon oxide compound to react with the manganese to yield manganese silicate.