Methods and apparatuses having strings of memory cells including a metal source

1. An apparatus comprising:

a plurality of alternating levels of control gate material and insulator material;

a vertical string of memory cells formed in the plurality of alternating levels of control gate material and insulator material, the vertical string of memory cells including a semiconductor channel material comprising polysilicon forming a pillar extending vertically through the plurality of alternating levels of control gate material and insulator material, the semiconductor channel material forming a channel for the memory cells of the vertical string of memory cells;

a doped metal silicide common source formed over a substrate and extending between the vertical string of memory cells and the substrate, the doped metal silicide common source in ohmic contact with the polysilicon-comprising semiconductor channel material, wherein dopant from the doped metal silicide common source is diffused into the vertically extending semiconductor channel material, extending upwardly from the doped metal silicide common source;

a capping layer over the doped metal silicide common source, wherein the polysilicon-comprising semiconductor channel material of each vertical string of memory cells extends through a respective opening extending through the plurality of alternating levels of control gate material and insulator material, and through the capping material, to the doped metal silicide common source; and

a material extending between the doped metal silicide common source and the substrate;

wherein memory cells of the vertical string of memory cells are at least partially formed in a respective lateral recess in a level of the control gate material, in which the control gate material is laterally recessed relative to adjacent levels of insulator material, and wherein the memory cells of the vertical string of memory cells comprise:

a dielectric material in the lateral recess adjacent to the control gate material;

a charge storage structure within the lateral recess and adjacent to the dielectric material; and

a tunnel dielectric material between the charge storage structure and the vertically extending, polysilicon-comprising semiconductor channel material.

2. The apparatus of claim 1 , wherein the dielectric material comprises an oxide-nitride-oxide material.

3. The apparatus of claim 1 , wherein the doped metal silicide source comprises an N+ doped metal silicide.

4. The apparatus of claim 3 , wherein the doped metal silicide source is doped with arsenic or phosphorus.

5. The apparatus of claim 1 , further comprising a select gate material and insulator material adjacent to the semiconductor material and between a lowest level of control gate material and the doped metal silicide source.

6. The apparatus of claim 1 , wherein the doped metal silicide source comprises tungsten silicide.

7. The apparatus of claim 1 , wherein the doped metal silicide source comprises a P+ doped metal silicide.

8. The apparatus of claim 7 , wherein the doped metal silicide source is doped with boron or gallium.

9. The apparatus of claim 1 , wherein the semiconductor material further comprises a polysilicon liner adjacent the select gate material, and wherein the polysilicon-containing semiconductor channel material extends within the polysilicon liner.

10. The apparatus of claim 1 , wherein the doped metal silicide source comprises a refractory metal silicide.

11. The apparatus of claim 1 , wherein the refractory metal silicide comprises tantalum silicide or molybdenum silicide.

12. A memory structure, comprising:

a doped metal silicide common source formed over a substrate, a material layer between the doped metal silicide common source and the substrate;

a capping material over the doped metal silicide common source;

multiple vertical strings of memory cells extending above the doped metal silicide common

source, each vertical string of memory cells respectively including,

multiple vertically-arranged charge storage transistors, and

a vertically extending pillar of semiconductor channel material forming a channel of the multiple charge storage transistors in the string;

wherein each of the vertically extending channel materials of respective strings of the multiple strings of memory cells extends upwardly from an ohmic contact with the doped metal silicide common source, and through an opening in the capping material, to the vertically-arranged charge storage transistors of the respective string, wherein the pillar is in selective communication with a respective bit line, and

wherein a dopant of the doped metal silicide common source is diffused into the vertically extending channel materials of each of the multiple vertical strings.

13. The memory structure of claim 12 , wherein the doped metal silicide source comprises a refractory metal silicide.

14. The memory structure of claim 13 , wherein the refractory metal silicide at least one of tungsten silicide, tantalum silicide, or know what molybdenum silicide.

15. The memory structure of claim 12 , wherein the doped metal silicide contains a N+ dopant.

16. A memory structure, comprising:

an N+ doped refractory metal silicide common source over a substrate;

a polysilicon or oxide material separating the N+ doped refractory metal silicide common source and the substrate;

multiple vertical strings of memory cells extending above the N+ doped refractory metal silicide common source, each string of the multiple vertical strings including, multiple vertically-arranged charge storage transistors, each charge storage transistor having a respective control gate,

a respective vertically-extending pillar comprising polysilicon forming a channel for the charge storage transistors of the string, and

tunnel dielectric material between the vertically-extending channel material and each charge storage transistor of the vertical string; and

wherein the vertically extending polysilicon pillar of each of the channels of the respective multiple vertical strings extends vertically from an ohmic contact with the N+ doped refractory metal silicide common source upwardly and adjacent the multiple vertically-arranged charge storage transistors of the respective string; and

wherein N+ dopant from the N+ doped refractory metal silicide common source is diffused into the polysilicon of the vertically extending channel material as a result of the ohmic contact.