IP Library Granted Patent US 10,409,301
Granted Patent B2
US 10,409,301 · App. 15/289,223 · Granted Sep 10, 2019

Electronic apparatus and surface temperature calculation method

Inventors: Masatoshi Ishii (Kawasaki, JP); Yoshiyasu Nakashima (Kawasaki, JP); Hiroshi Nakao (Yamato, JP)
Assignee: FUJITSU LIMITED
G05D23/1917G01K7/427G05D23/1928G06F1/206G01K7/22
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Quick Facts
Patent No.
US 10,409,301
App. No.
15/289,223
Granted
Sep 10, 2019
Kind
B2
Abstract

An electronic apparatus includes a housing; a substrate disposed on the inner side of the housing; a plurality of temperature sensors disposed on the substrate; and a processor. The processor performs a procedure including calculating heat source temperatures of a plurality of heat sources disposed on the substrate from temperatures measured by the temperature sensors by using a first heat transfer model not including a first parameter representing a transient response of heat transfer from the heat sources to the temperature sensors; and calculating a surface temperature of a surface of the housing from the heat source temperatures by using a second heat transfer model including the first parameter and a second parameter representing a transient response of heat transfer from the heat sources to the surface.

Claims (30)

1. An electronic apparatus comprising:

a housing;

a substrate disposed inside the housing;

a plurality of temperature sensors disposed on the substrate; and

a processor configured to perform a procedure including:

calculating heat source temperatures of a plurality of heat sources disposed on the substrate from measured temperatures measured by the temperature sensors, by using a first heat transfer model that assumes a steady state of heat transfer from the heat sources to the temperature sensors,

calculating a surface temperature of a surface of the housing from the heat source temperatures calculated by the first heat transfer model, by using a second heat transfer model including a first parameter representing a transient response of heat transfer from the heat sources to the temperature sensors and a second parameter representing a transient response of heat transfer from the heat sources to the surface, and

controlling at least part of operations of the heat sources, based on the calculated surface temperature;

wherein the first heat transfer model includes a first polynomial for calculating the heat source temperatures from the measured temperatures; and

the second heat transfer model includes a second polynomial for calculating the surface temperature from the heat source temperatures calculated by the first heat transfer model, calculation results of previous heat source temperatures, and calculation results of a previous surface temperature.

2. The electronic apparatus according to claim 1 , wherein:

the first parameter is a time constant representing response speed that indicates how fast changes in the heat source temperatures are reflected in the measured temperatures; and

the second parameter is a time constant representing response speed that indicates how fast the changes in the heat source temperatures are reflected in the surface temperature.

3. The electronic apparatus according to claim 1 , wherein:

the calculating of the surface temperature includes calculating, for a plurality of locations on the surface, a plurality of surface temperatures by using different second heat transfer models; and

the controlling is performed based on a maximum surface temperature amongst the calculated surface temperatures.

4. A surface temperature calculation method comprising:

acquiring, by a processor, measured temperatures measured by a plurality of temperature sensors disposed on a substrate provided inside a housing of an electronic apparatus;

calculating, by the processor, heat source temperatures of a plurality of heat sources disposed on the substrate from the measured temperatures by using a first heat transfer model that assumes a steady state of heat transfer from the heat sources to the temperature sensors;

calculating, by the processor, a surface temperature of a surface of the housing from the heat source temperatures calculated by the first heat transfer model, by using a second heat transfer model including a first parameter representing a transient response of heat transfer from the heat sources to the temperature sensors and a second parameter representing a transient response of heat transfer from the heat sources to the surface; and

controlling, by the processor, at least part of operations of the heat sources, based on the calculated surface temperature;

wherein the first heat transfer model includes a first polynomial for calculating the heat source temperatures from the measured temperatures; and

the second heat transfer model includes a second polynomial for calculating the surface temperature from the heat source temperatures calculated by the first heat transfer model, calculation results of previous heat source temperatures, and calculation results of a previous surface temperature.

5. A non-transitory computer-readable storage medium storing a computer program that causes a computer to perform a procedure comprising:

acquiring measured temperatures measured by a plurality of temperature sensors disposed on a substrate provided inside a housing of an electronic apparatus;

calculating heat source temperatures of a plurality of heat sources disposed on the substrate from the measured temperatures by using a first heat transfer model that assumes a steady state of heat transfer from the heat sources to the temperature sensors;

calculating a surface temperature of a surface of the housing from the heat source temperatures calculated by the first heat transfer model, by using a second heat transfer model including a first parameter representing a transient response of heat transfer from the heat sources to the temperature sensors and a second parameter representing a transient response of heat transfer from the heat sources to the surface; and

controlling at least part of operations of the heat sources, based on the calculated surface temperature;

wherein the first heat transfer model includes a first polynomial for calculating the heat source temperatures from the measured temperatures; and

the second heat transfer model includes a second polynomial for calculating the surface temperature from the heat source temperatures calculated by the first heat transfer model, calculation results of previous heat source temperatures, and calculation results of a previous surface temperature.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 10, 2016
From: ISHII, MASATOSHI; NAKASHIMA, YOSHIYASU; NAKAO, HIROSHI
To: FUJITSU LIMITED
Reel/Frame 040293/0563 →
Priority Claims (1)
JP 2015-228644 · Nov 24, 2015 · national
Continuity (1)
Related Publication 20170147017A1 · May 25, 2017
Cited By (2)
US 12,399,542 US 12,510,419