Granted Patent B2

US 12,399,542 · App. 18/208,092 · Granted Aug 26, 2025

Inventors: Sangmin Lee (Suwon-si, KR); Sungyong Bang (Suwon-si, KR); Jongwoo Kim (Suwon-si, KR); Hakryoul Kim (Suwon-si, KR); Mooyoung Kim (Suwon-si, KR)

Assignee: SAMSUNG ELECTRONICS CO., LTD.

G06F1/206G06F11/3058

Abstract

Claims (58)

1. An electronic device, comprising:

at least one sensor;

a communication circuit;

memory; and

at least one processor operationally connected with the at least one sensor, the communication circuit, and the memory,

wherein instructions, when executed by the at least one processor, cause the electronic device to:

identify an internal temperature of the electronic device using the at least one sensor;

provide, to an external device, internal temperature data associated with the internal temperature of the electronic device;

receive a surface temperature prediction model for predicting a surface temperature of the electronic device from the external device;

predict the surface temperature of the electronic device, the predicted surface temperature being represented two-dimensionally based on the surface temperature prediction model and the internal temperature of the electronic device;

generate a heat map based on the predicted surface temperature; and

select at least one heat source to enter heating control from among a plurality of modules of the electronic device based on the heat map.

2. The electronic device of claim 1 , wherein the instructions, when executed by the at least one processor, cause the electronic device to:

analyze the heat map based on information associated with a module location; and

collect information associated with heat diffusion on a surface of the electronic device based on the analyzing of the heat map.

3. The electronic device of claim 2 , wherein the instructions, when executed by the at least one processor, cause the electronic device to:

generate a limitation policy for limiting operation performance of the electronic device based on the analyzing of the heat map and a temperature policy.

4. The electronic device of claim 1 , wherein the instructions, when executed by the at least one processor, cause the electronic device to:

select a module disposed in a portion of the electronic device at which the predicted surface temperature is greater than or equal to a heating control entry temperature as the at least one heat source to enter the heating control.

5. The electronic device of claim 1 , wherein the instructions, when executed by the at least one processor, cause the electronic device to:

identify a module disposed adjacent to a heated portion as an adjacent module based on information associated with a module location.

6. The electronic device of claim 5 , wherein the instructions, when executed by the at least one processor, cause the electronic device to:

control the adjacent module, based on the adjacent module increasing in temperature and being influenced by the at least one heat source.

7. The electronic device of claim 1 , wherein the instructions, when executed by the at least one processor, cause the electronic device to:

receive a result of scaling and analyzing the surface temperature from the external device or a server, and

select the at least one heat source based on the result.

8. A method for controlling an electronic device, the method comprising:

identifying an internal temperature of the electronic device using at least one sensor;

providing, to an external device, internal temperature data associated with the internal temperature of the electronic device;

receiving a surface temperature prediction model for predicting a surface temperature of the electronic device from the external device;

predicting the surface temperature of the electronic device, the predicted surface temperature being represented two-dimensionally based on the surface temperature prediction model and the internal temperature of the electronic device;

generating a heat map based on the predicted surface temperature; and

selecting at least one heat source to enter heating control from among a plurality of modules of the electronic device based on the heat map.

9. The method of claim 8 , wherein the predicting of the surface temperature further comprises:

analyzing the heat map based on information associated with a module location; and

collecting information associated with heat diffusion on a surface of the electronic device based on the analyzing of the heat map.

10. The method of claim 9 , wherein the predicting of the surface temperature further comprises:

generating a limitation policy for limiting operation performance of the electronic device based on the analyzing of the heat map and a temperature policy.

11. The method of claim 8 , wherein the selecting of the at least one heat source comprises:

selecting a module disposed in a portion of the electronic device at which the predicted surface temperature is greater than or equal to a heating control entry temperature as the at least one heat source to enter the heating control.

12. The method of claim 8 , wherein the predicting of the surface temperature comprises:

identifying a module disposed adjacent to a heated portion as an adjacent module based on information associated with a module location.

13. The method of claim 12 , wherein the selecting of the at least one heat source comprises:

controlling the adjacent module, when the adjacent module increases in temperature and is influenced by the at least one heat source.

14. A non-transitory computer-readable storage medium configured to store instructions which, when executed by at least one processor, cause the at least one processor to:

identify an internal temperature of an electronic device using at least one sensor;

provide, to an external device, internal temperature data associated with the internal temperature of the electronic device;

receive a surface temperature prediction model for predicting a surface temperature of the electronic device from the external device;

predict the surface temperature of the electronic device, the predicted surface temperature being represented two-dimensionally based on the surface temperature prediction model and the internal temperature of the electronic device;

generate a heat map based on the predicted surface temperature; and

select at least one heat source to enter heating control from among a plurality of modules of the electronic device based on the heat map.

15. The non-transitory computer-readable storage medium of claim 14 , wherein to predict the surface temperature, the instructions further cause the at least one processor to:

analyze the heat map based on information associated with a module location; and

collect information associated with heat diffusion on a surface of the electronic device based on the analyzing of the heat map.

16. The non-transitory computer-readable storage medium of claim 15 , wherein to predict the surface temperature, the instructions further cause the at least one processor to:

generate a limitation policy for limiting operation performance of the electronic device based on the analyzing of the heat map and a temperature policy.

17. The non-transitory computer-readable storage medium of claim 14 , wherein to select the at least one heat source, the instructions further cause the at least one processor to:

select a module disposed in a portion of the electronic device at which the predicted surface temperature is greater than or equal to a heating control entry temperature as the at least one heat source to enter the heating control.

Assignments (1)

Priority Claims (1)

Continuity (2)

References Cited (52)