IP Library Granted Patent US 9,997,247
Granted Patent B2
US 9,997,247 · App. 15/339,374 · Granted Jun 12, 2018

Memory devices having source lines directly coupled to body regions and methods

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Quick Facts
Patent No.
US 9,997,247
App. No.
15/339,374
Granted
Jun 12, 2018
Kind
B2
Abstract

Memory devices, memory cell strings and methods of operating memory devices are shown. Configurations described include directly coupling an elongated body region to a source line. Configurations and methods shown should provide a reliable bias to a body region for memory operations such as erasing.

Claims (37)

1. A memory device, comprising:

a data line;

a source;

a first string of memory cells coupled at a first end to the data line by a first select gate, and directly coupled at a second end to the source through a second select gate;

a second string of memory cells coupled at a first end to the data line by a third select gate, and directly coupled at a second end to the source through a fourth select gate; and

a controller, wherein the controller is configured to concurrently bias the data line and the source to substantially the same potential, and perform a program operation on a selected memory cell of the first string of memory cells.

2. The memory device of claim 1 , wherein the controller is further configured to bias the first select gate to a potential greater than the potential to which it concurrently biases the data line.

3. The memory device of claim 1 , wherein the first and the second strings of memory cells are vertically formed above a substrate.

4. A memory device, comprising:

a plurality of strings of memory cells, where each string of memory cells is coupled at a first end to a data line and where each string of memory cells is directly coupled at a second end to a source; and

a controller, wherein the controller is configured to concurrently bias the data line and the source to a substantially same potential and to perform a program operation on a selected memory cell of a selected string of memory cells while the data line and the source are biased to substantially the same potential.

5. The memory device of claim 4 , wherein the plurality of strings of memory cells comprise vertically formed strings of memory cells.

6. A memory device, comprising:

a plurality of strings of memory cells, where each string of memory cells is coupled at a first end to a data line and where each string of memory cells is directly coupled at a second end to a source; and

a controller, wherein the controller is configured to concurrently float the data line, bias the source to an erase potential, and perform an erase operation on the memory cells of the plurality of strings of memory cells.

7. The memory device of claim 6 , wherein the controller is further configured to bias a control gate of each memory cell of the plurality of strings of memory cells to a potential less than the erase potential to which the source is biased during the erase operation.

8. The memory device of claim 6 , wherein the potential to which the control gates of the memory cells are biased comprises a ground potential.

9. An electronic system, comprising:

a communications interface;

a memory access device coupled to the communications interface and configured to generate memory device commands; and

a memory device coupled to the communications interface and configured to be responsive to the memory device commands, the memory device comprising:

a data line;

a source;

a first string of memory cells coupled at a first end to the data line by a first select gate, and directly coupled at a second end to the source through a second select gate;

a second string of memory cells coupled at a first end to the data line by a third select gate, and directly coupled at a second end to the source through a fourth select gate; and

a controller, wherein the controller is configured to concurrently bias the data line and the source to substantially a same potential, and perform a program operation on a selected memory cell of the first string of memory cells.

10. The electronic system of claim 9 , wherein t S ring and the second string comprise vertically formed strings of memory cells.

11. A memory device, comprising:

an elongated body region, having a source region coupled to a first d and a drain region coupled to a second end;

a plurality of gates along a length of the elongated body region, each of the plurality f gates being separated from the elongated body region by at least a charge storage structure; and

a source line directly coupled to the body region, wherein the source region surrounds a cross section of the first end of the elongated body region and is also coupled to the source line.

12. The memory device of claim 11 , wherein the elongated body region oriented vertically.

13. The memory device of claim 11 , wherein the elongated body region is oriented horizontally.

14. The memory device of claim 11 , wherein the elongated body region forms a “U” shape.

15. The memory device of claim 11 , further including a controller, wherein the controller is configured to concurrently bias the data line and the source to substantially the same potential, and perform a program operation on a selected memory cell of the first string of memory cell.

16. The memory device of claim 11 , further including a controller, wherein the controller is configured to concurrently bias the data line and the source to a substantially same potential and to perform a program operation on a selected memory cell of a selected string of memory cells while the data line and the source are biased to substantially the same potential.

17. The memory device of claim 11 , further including a controller, wherein the controller is configured to concurrently float the data line, bias the source to an erase potential, and perform an erase operation on the memory cells of the plurality of strings of memory cells.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 21, 2023
From: MICRON TECHNOLOGY, INC.
To: LODESTAR LICENSING GROUP, LLC
Reel/Frame 064986/0353 →
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050695/0825 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
SUPPLEMENT NO. 3 TO PATENT SECURITY AGREEMENT Recorded Feb 10, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041675/0105 →