Semiconductor devices with underfill control features, and associated systems and methods
View Patent ↗Semiconductor devices with underfill control features, and associated systems and methods. A representative system includes a substrate having a substrate surface and a cavity in the substrate surface, and a semiconductor device having a device surface facing toward the substrate surface. The semiconductor device further includes at least one circuit element electrically coupled to a conductive structure. The conductive structure is electrically connected to the substrate, and the semiconductor device further has a non-conductive material positioned adjacent the conductive structure and aligned with the cavity of the substrate. An underfill material is positioned between the substrate and the semiconductor device. In other embodiments, in addition to or in lieu of the con-conductive material, a first conductive structure is connected within the cavity, and a second conductive structure connected outside the cavity. The first conductive structure extends away from the device surface a greater distance than does the second conductive structure.
1. A semiconductor device assembly, comprising
a substrate having a substrate surface and a cavity in the substrate surface;
a semiconductor device having a device surface facing toward the substrate surface, the semiconductor device further having at least one circuit element electrically coupled to a conductive structure, wherein the conductive structure is electrically connected to the substrate, the semiconductor device further having a non-conductive material positioned adjacent the conductive structure and aligned with the cavity of the substrate; and
an underfill material positioned between the substrate and the semiconductor device, wherein
the cavity includes an elongated trench;
the conductive structure is one of multiple conductive structures, with individual conductive structures connected between the semiconductor device and corresponding locations in the cavity;
the multiple conductive structures include a first conductive structure connected to the substrate within the cavity, and a second conductive structure connected to the substrate outside the cavity;
the first conductive structure extends away from the device surface of the semiconductor device by a first distance; and
the second conductive structure extends away from the device surface of the semiconductor device by a second distance less than the first distance.
2. The system of claim 1 wherein the non-conductive material does not extend laterally outwardly beyond the cavity.
3. The system of claim 1 wherein a thickness of the non-conductive material and a depth of the cavity are at least approximately the same.
4. The system of claim 1 wherein the conductive structure includes an elongated pillar.
5. The system of claim 1 wherein the substrate includes a solder mask, and wherein the solder mask has an opening, and wherein the opening forms the cavity.
6. A semiconductor device assembly, comprising
a substrate having a substrate surface and a cavity in the substrate surface;
a semiconductor device having a device surface facing toward the substrate surface, the semiconductor device further having at least one semiconductor circuit element and a plurality of conductive structures, including a first conductive structure connected to the substrate within the cavity, and a second conductive structure connected to the substrate outside the cavity, wherein the first conductive structure extends away from the device surface of the semiconductor device by a first distance, and the second conductive structure extends away from the device surface of the semiconductor device by a second distance less than the first distance; and
an underfill material positioned between the substrate and the semiconductor device,
wherein the semiconductor device further includes a non-conductive material positioned adjacent the first conductive structure and aligned with the cavity of the substrate.
7. The system of claim 6 wherein the semiconductor device includes a diced die.
8. The system of claim 6 wherein the semiconductor device includes a wafer, and wherein the wafer includes a plurality of unsingulated die.
9. The system of claim 6 wherein the first conductive structure is electrically coupled to the circuit element to transmit electrical signals between the substrate and the semiconductor device.
10. The system of claim 6 wherein the second conductive structure is in thermal communication with the substrate.
11. The system of claim 10 wherein the second conductive structure is not electrically coupled to the circuit element.
12. The system of claim 6 wherein the underfill material includes a film.
13. The system of claim 6 wherein the underfill material includes a sheet.
14. The system of claim 6 wherein the first conductive structure includes a first component carried by the substrate and a second component carried by the semiconductor device.
15. The system of claim 14 wherein the first component includes a bond pad and wherein the second component includes a conductive pillar.
16. The system of claim 6 , further comprising:
a memory;
a processor; and
a power source, and wherein the semiconductor device is electrically coupled to at least one of the memory, the processor or the power source.
17. The system of claim 16 , further comprising an optical sensor, and wherein the semiconductor device is coupled to at least one of the memory, the processor, the power source or the optical sensor.
18. A semiconductor device assembly, comprising
a substrate having:
a substrate surface and a cavity in the substrate surface;
a semiconductor device having:
a device surface facing toward the substrate surface;
at least one circuit element;
a plurality of conductive structures, including a first conductive structure connected to the substrate in the cavity, and a second conductive structure connected to the substrate outside the cavity; and
a non-conductive material positioned adjacent the first conductive structure and aligned with the cavity of the substrate; and
wherein the first conductive structure extends away from the device surface by a first distance, and the second conductive structure extends away from the device surface by a second distance less than the first distance; and
an underfill material positioned between the substrate and the semiconductor device.
19. The system of claim 18 wherein the non-conductive material does not extend laterally outwardly beyond the cavity.
20. The system of claim 18 wherein the first conductive structure includes an elongated pillar.
21. The system of claim 18 wherein the substrate includes a solder mask, and wherein the solder mask has an opening, and wherein the opening forms the cavity.
22. The system of claim 18 wherein the first conductive structure is electrically coupled to the circuit element to transmit electrical signals between the substrate and the semiconductor device.
23. The system of claim 18 wherein the second conductive structure is in thermal communication with the substrate.
24. The system of claim 23 wherein the second conductive structure is not electrically coupled to the circuit element.