Bonding pads with thermal pathways
View Patent ↗Apparatuses and methods for providing thermal pathways from a substrate to a thermal bonding pad. The thermal pathways may be metal extensions of the thermal bonding pad that are disposed in channels formed in a backside passivation layer underneath the thermal bonding pad, and may be in direct contact with an underlying substrate. The thermal pathways may provide improved thermal dissipation from the substrate.
1. An apparatus, comprising:
a substrate including a through-via extending from the backside of the substrate to a frontside of the substrate;
a first bonding pad including thermal pathways in direct contact with a backside of the substrate, wherein the thermal pathways are disposed in channels formed in a passivation layer on the backside of the substrate; and
a second bonding pad disposed on the passivation layer and coupled to the through-via, wherein the second bonding pad is disposed as a circular bonding pad on the through-via.
2. The apparatus of claim 1 , wherein the thermal pathways are formed under the first bonding pad.
3. The apparatus of claim 1 , wherein the thermal pathways are disposed in the channels formed in the passivation layer such that the thermal pathways form concentric circles or a spiral in the passivation layer.
4. The apparatus of claim 1 , wherein the thermal pathways are disposed in the channels formed in the passivation layer such that the thermal pathways are distributed in parallel relative to each other and such that the thermal pathways extend along a length of the first bonding pad.
5. An apparatus comprising:
a substrate;
a first bonding pad including thermal pathways in direct contact with a backside of the substrate, wherein the thermal pathways are disposed in channels formed in a passivation layer on the backside of the substrate; and
a second bonding pad disposed on the passivation layer and coupled to the through-via, wherein the first bonding pad and the second bonding pad are substantially equal in height.
6. An apparatus comprising:
a substrate:
a first bonding pad including thermal pathways in direct contact with a backside of the substrate, wherein the thermal pathways are disposed in channels formed in a passivation layer on the backside of the substrate;
a second bonding pad disposed on the passivation layer and coupled to the through-via; and
electrical interconnections formed on the first bonding pad and the second bonding pad.
7. An apparatus comprising:
a substrate;
a first bonding pad including thermal pathways in direct contact with a backside of the substrate, wherein the thermal pathways are disposed in channels formed in a passivation layer on the backside of the substrate; and
a second bonding pad disposed on the passivation layer and coupled to the through-via, wherein the first bonding pad includes a first metal stack comprising at least one of copper, nickel, gold, or palladium, and wherein the second bonding pad includes a second metal stack comprising at least one of copper, nickel, gold, or palladium.
8. An apparatus, comprising:
a substrate having a backside and a through-via extending from the backside of the substrate to a frontside of the substrate;
a passivation layer disposed on the backside;
a first bonding pad disposed on the passivation layer;
a channel disposed in the passivation layer; the channel extending between the first bonding pad and the backside of the substrate;
conductive material disposed in the channel between the first bonding pad and the backside of the substrate; and
a second bonding pad disposed on the passivation layer and coupled to the through-via, wherein the first bonding pad includes a first metal stack comprising at least one of copper, nickel, gold, or palladium, and wherein the second bonding pad includes a second metal stack comprising at least one of cooper, nickel, gold, or palladium.
9. The apparatus of claim 8 , wherein the conductive material comprises a metal.
10. The apparatus of claim 8 , wherein the first bonding pad comprises an electrically-inactive bonding pad.
11. The apparatus of claim 8 , further comprising a through-via conductor that is in electrical connection with the bonding pad and terminates on a front side of the substrate.
12. The apparatus of claim 8 , wherein the conductive material disposed in the channel comprises at least one of a metal protrusion, extension, fin, or combinations thereof of the first bonding pad.
13. The apparatus of claim 8 , wherein the second bonding is disposed as a circular bonding pad on the through-via.
14. The apparatus of claim 8 , wherein the first bonding pad and the second bonding pad are substantially equal in height.
15. The apparatus of claim 8 , further comprising electrical interconnections formed on the first bonding pad and the second bonding pad.
16. The apparatus of claim 5 , further comprising electrical interconnections formed on the first bonding pad and the second bonding pad.
17. The apparatus of claim 5 , wherein the first bonding pad includes a first metal stack comprising at least one of copper, nickel, gold, or palladium, and wherein the second bonding pad includes a second metal stack comprising at least one of copper, nickel, gold, or palladium.
18. The apparatus of claim 6 , wherein the first bonding pad and the second bonding pad are substantially equal in height.
19. The apparatus of claim 6 , wherein the first bonding pad includes a first metal stack comprising at least one of copper, nickel, gold, or palladium, and wherein the second bonding pad includes a second metal stack comprising at least one of copper, nickel, gold, or palladium.
20. The apparatus of claim 7 , wherein the first bonding pad and the second bonding pad are substantially equal in height.