Serial link storage interface (SLSI) hybrid block storage
The present invention is directed to a computer subsystem that includes a central processing unit (CPU); one or more byte-addressable memory modules having a dual in-line memory module (DIMM) form factor connected to the CPU via a first memory channel; and a master persistent memory module and one or more slave persistent memory modules having the DIMM form factor connected to the CPU via a second memory channel. The master persistent memory module and the one or more slave persistent memory modules are connected in a daisy chain configuration. The one or more slave persistent memory modules receive commands directly from the master persistent memory module.
1. A computer subsystem comprising:
a central processing unit (CPU);
one or more byte-addressable memory modules having a dual in-line memory module (DIMM) form factor and directly connected to said CPU via a first memory channel; and
a master and one or more slave persistent memory modules having said DIMM form factor and directly connected to said CPU via a second memory channel,
wherein said master persistent memory module and said one or more slave persistent memory modules are connected in a daisy chain configuration by a serial link, said one or more slave persistent memory modules receive commands originated from said master persistent memory module.
2. The computer subsystem of claim 1 , wherein each of said one or more byte-addressable memory modules includes dynamic random access memory (DRAM).
3. The computer subsystem of claim 1 , wherein each of said one or more byte-addressable memory modules includes magnetic random access memory (MRAM).
4. The computer subsystem of claim 1 , wherein said master persistent memory module includes a plurality of block-addressable persistent memory devices for storing data and a byte-addressable persistent memory device.
5. The computer subsystem of claim 4 , wherein said plurality of block-addressable persistent memory devices are made of NAND Flash memory.
6. The computer subsystem of claim 4 , wherein said plurality of block-addressable persistent memory devices are made of MRAM.
7. The computer subsystem of claim 4 , wherein said byte-addressable persistent memory device is made of MRAM.
8. The computer subsystem of claim 4 , wherein said byte-addressable persistent memory device includes multiple partitions with at least one of said multiple partitions being invisible to BIOS during booting.
9. The computer subsystem of claim 1 , wherein each of said one or more slave persistent memory modules includes a plurality of block-addressable persistent memory devices for storing data.
10. The computer subsystem of claim 9 , wherein said plurality of block-addressable persistent memory devices are made of NAND Flash.
11. The computer subsystem of claim 9 , wherein said plurality of block-addressable persistent memory devices are made of MRAM.
12. The computer subsystem of claim 1 , wherein said one or more slave persistent memory modules are invisible to BIOS during booting.
13. The computer subsystem of claim 1 , wherein said commands include global wear leveling.
14. The computer subsystem of claim 1 , wherein said commands include global garbage collection.
15. The computer subsystem of claim 1 , wherein data between said CPU and said one or more slave persistent memory modules is transferred via said second memory channel.
16. The computer subsystem of claim 1 , wherein said CPU includes a memory controller connected to said first and second memory channels.