Methods and systems to minimize delamination of multilayer ceramic capacitors
Methods and systems to improve a multilayer ceramic capacitor using additive manufacturing are disclosed. Conductive layer ends of a multilayer ceramic capacitor may be modified to comprise a round shape, which may increase structural stability of the capacitor's layers. Other configurations may be possible, such as bulbous or wavy shaped conductive layer ends. The layers may comprise one or more pillars made from dielectric material, e.g., barium titanate, disposed through a portion of a conductive layer. The dielectric material may be the same material used in the insulator layers of the capacitor. Each pillar may comprise a plurality of spot connections surrounding its perimeter. The embedded pillars may be used to prevent delamination of the layers and to increase mechanical strength. Additionally, an algorithm of a computing device may determine an optimal shape, size, and/or configuration of the capacitor based on one or more predetermined specifications or properties.
1. A multilayer ceramic capacitor, comprising:
a ceramic body;
one or more dielectric layers alternately stacked with two or more conductive layers;
one or more pillars disposed through the two or more conductive layers for preventing delamination of the one or more dielectric layers and the two or more conductive layers,
wherein at least one conductive layer comprises a conductive layer end comprising a round shape for increasing structural stability of the capacitor;
a pair of external terminations disposed at opposite end portions of the body, and
wherein the two or more conductive layers are alternately coupled to an external termination of the pair of external termination, and
wherein a total volume of the one or more pillars and a total volume of the conductive layer through which it is disposed does not exceed a predetermined ratio.
2. A multilayer ceramic capacitor, comprising:
a ceramic body;
one or more dielectric layers alternately stacked with two or more conductive layers;
one or more pillars disposed through the two or more conductive layers for preventing delamination of the one or more dielectric layers and the two or more conductive layers,
wherein at least one conductive layer comprises a conductive layer end comprising a round shape for increasing structural stability of the capacitor;
a pair of external terminations disposed at opposite end portions of the body, and
wherein the two or more conductive layers are alternately coupled to an external termination of the pair of external termination, and
wherein the one or more pillars comprise a dielectric material.
3. The multilayer ceramic capacitor of claim 2 , further comprising:
wherein the one or more pillars comprise the same dielectric material as the one or more dielectric layers.
4. The multilayer ceramic capacitor of claim 2 , further comprising:
wherein the one or more pillars comprise a different dielectric material as the one or more dielectric layers.
5. A multilayer ceramic capacitor, comprising:
a ceramic body;
one or more dielectric layers alternately stacked with two or more conductive layers;
one or more pillars disposed through the two or more conductive layers for preventing delamination of the one or more dielectric layers and the two or more conductive layers,
wherein at least one conductive layer comprises a conductive layer end comprising a round shape for increasing structural stability of the capacitor;
a pair of external terminations disposed at opposite end portions of the body,
wherein the two or more conductive layers are alternately coupled to an external termination of the pair of external termination, and
wherein the one or more pillars comprise a nook for increased structural stability.
6. The multilayer ceramic capacitor of claim 5 , further comprising:
wherein the nook comprises a rounded tip.
7. The multilayer ceramic capacitor of claim 5 , further comprising:
wherein the nook is less than 2 microns in length.