Copper interconnect structure with manganese oxide barrier layer
View Patent ↗Low capacitance and high reliability interconnect structures and methods of manufacture are disclosed. The method includes forming a copper based interconnect structure in an opening of a dielectric material. The method further includes forming a capping layer on the copper based interconnect structure. The method further includes oxidizing the capping layer and any residual material formed on a surface of the dielectric material. The method further includes forming a barrier layer on the capping layer by outdiffusing a material from the copper based interconnect structure to a surface of the capping layer. The method further includes removing the residual material, while the barrier layer on the surface of the capping layer protects the capping layer.
1. An interconnect structure comprising:
a copper interconnect structure formed in a dielectric material;
a capping layer in contact with a top surface of the copper interconnect structure, wherein an interface of a bottom surface of the capping layer and the top surface of the copper interconnect structure is co-planar with a top surface of the dielectric material; and
a barrier layer outdiffused on a surface of the capping layer,
wherein the copper interconnect structure comprises: a layer of Tantalum Nitride (TaN);
a layer of CuMn directly on the TaN layer; and an electroplated copper layer on the CuMn layer;
the bottom surface of the capping layer is directly on the top surface of the copper interconnect structure; and
the barrier layer is at an upper surface and side surfaces of the capping layer.
2. The interconnect structure of claim 1 , wherein the capping layer is Ru, Ag, Zn, Sn or Ni and the barrier layer is MnO.
3. The interconnect structure of claim 2 , further comprising a barrier layer at an interface of the copper interconnect structure and the dielectric material.
4. The interconnect structure of claim 1 , wherein the capping layer is cobalt and the barrier layer is MnO.
5. The interconnect structure of claim 4 , further comprising a barrier layer at an interface of the copper interconnect structure and the dielectric material.
6. The interconnect structure of claim 5 , wherein the capping layer is oxidized.
7. The interconnect structure of claim 1 , wherein the capping layer extends entirely across a topmost surface of the copper interconnect structure.
8. The interconnect structure of claim 1 , wherein the barrier layer comprises Mn outdiffused from the CuMn layer to an upper surface of the capping layer during an anneal process.