Insitu tool health and recipe quality monitoring on a CDSEM
Systems, methods, and computer program products for monitoring the tool health of on a critical dimension scanning electron microscope (CDSEM) and recipe quality on a CDSEM. Run-time data from a critical dimension scanning electron microscope is received at a computer. The computer converts the run-time data to time-sequenced data, and analyzes the time-sequenced data to detect an operational abnormality associated with the CDSEM.
1. A method comprising:
acquiring run-time data for a plurality of features on a plurality of wafers at a critical dimension scanning electron microscope during the operation of critical dimension scanning electron microscope;
generating, from the run-time data at an equipment interface coupling the critical dimension scanning electron microscope with a computer, a plurality of data packages including a plurality of measurements of the features organized per wafer by fields of view;
receiving, at the computer, the data packages via the equipment interface;
converting, by the computer, the run-time data in the data packages to time-sequenced data organized by a time sequence of the measurements for each feature according to the fields of view and an order of introduction of the wafers into the critical dimension scanning electron microscope; and
analyzing, by the computer, the time-sequenced data to detect an operational abnormality associated with the critical dimension scanning electron microscope.
2. The method of claim 1 further comprising:
performing, by the computer, a fault detection and classification analysis.
3. The method of claim 1 further comprising:
building, by the computer, a virtual sensor using a mathematical model to assess a content of the time-sequenced data.
4. The method of claim 1 further comprising:
building, by the computer, a plurality of virtual sensors using mathematical models to assess a content of the time-sequenced data.
5. The method of claim 1 further comprising:
adjusting a control at the critical dimension scanning electron microscope to correct the operational abnormality.
6. The method of claim 1 wherein the critical dimension scanning electron microscope generates the run-time data while being operated to measure the features on the wafers according to a recipe, and further comprising:
adjusting the recipe to correct the operational abnormality of the critical dimension scanning electron microscope.
7. A system comprising:
a critical dimension scanning electron microscope configured to acquire run-time data for a plurality of features on a plurality of wafers during the operation of critical dimension scanning electron microscope;
an equipment interface coupled with the critical dimension scanning electron microscope, the equipment interface configured to generate, from the run-time data, a plurality of data packages including a plurality of measurements of the features organized per wafer by fields of view;
one or more computer processors linked by the equipment interface in communication with the critical dimension scanning electron microscope; and
a memory storing instructions that, upon execution by the one or more computer processors, cause the system to:
receive the data packages via the equipment interface;
convert the run-time data in the data packages to time-sequenced data the run-time data in the data packages to time-sequenced data organized by a time sequence of the measurements for each feature according to the fields of view and an order of introduction of the wafers into the critical dimension scanning electron microscope; and
analyze the time-sequenced data to detect an operational abnormality associated with the critical dimension scanning electron microscope.
8. The system of claim 7 further comprising instructions that upon execution by the one or more computer processors cause the system to:
perform a fault detection and classification analysis.
9. The system of claim 7 further comprising instructions that upon execution by the one or more computer processors cause the system to:
build a virtual sensor using a mathematical model to assess a content of the time-sequenced data.
10. The system of claim 7 further comprising instructions that upon execution by the one or more computer processors cause the system to:
build a plurality of virtual sensors using mathematical models to assess a content of the time-sequenced data.
11. The system of claim 7 further comprising instructions that upon execution by the one or more computer processors cause the system to:
adjust a control at the critical dimension scanning electron microscope to correct the operational abnormality.
12. The system of claim 7 wherein the critical dimension scanning electron microscope generates the run-time data while being operated to measure the features on the wafers according to a recipe, and further comprising instructions that upon execution by the one or more computer processors cause the system to:
adjust the recipe to correct the operational abnormality of the critical dimension scanning electron microscope.