Acoustic wave filter with enhanced rejection
View Patent ↗An acoustic filter comprises a piezoelectric layer; an acoustic resonator structure monolithically disposed on the piezoelectric layer, the acoustic resonator structure including an arrangement of planar interdigitated resonator fingers; and a lumped capacitive structure monolithically disposed on the piezoelectric layer and being electrically coupled to the acoustic resonator structure, the lumped capacitive structure including an arrangement of planar interdigitated capacitive fingers, each of at least one of the interdigitated capacitive fingers having an edge that is entirely continuous.
1. An acoustic filter, comprising:
a piezoelectric layer;
an acoustic resonator structure monolithically disposed on the piezoelectric layer, the acoustic resonator structure comprising an arrangement of planar interdigitated resonator fingers; and
a lumped capacitive structure monolithically disposed on the piezoelectric layer and being electrically coupled to the acoustic resonator structure, the lumped capacitive structure comprising an arrangement of planar interdigitated capacitive fingers, wherein at least one of the interdigitated capacitive fingers and at least one of the interdigitated resonator fingers have orientations that are oblique to each other.
2. The acoustic filter of claim 1 , wherein the interdigitated capacitive fingers have edges that are entirely continuous.
3. The acoustic filter of claim 2 , wherein the entirely continuous edge of at least one interdigitated capacitive finger has one or more undulations.
4. The acoustic filter of claim 2 , wherein the entirely continuous edge of at least one interdigitated capacitive finger has a plurality of undulations.
5. The acoustic filter of claim 2 , wherein no finite portion of the continuous edge is parallel to any finite portions of edges along the lengths of the interdigitated resonator fingers.
6. The acoustic filter of claim 1 , wherein the lumped capacitive structure is electrically coupled in parallel to the acoustic resonator structure.
7. The acoustic filter of claim 1 , wherein at least one interdigitated capacitive finger has a length/width ratio of less than two.
8. The acoustic filter of claim 1 , wherein at least one interdigitated capacitive finger has a length/width ratio of less than one.
9. The acoustic filter of claim 1 , wherein at least one interdigitated capacitive finger comprises a plurality of interdigitated capacitive sub-fingers.
10. The acoustic filter of claim 9 , wherein the plurality of interdigitated capacitive sub-fingers has an orientation that is orthogonal to the orientation of the at least one interdigitated capacitive finger.
11. The acoustic filter of claim 1 , further comprising a non-piezoelectric substrate, wherein the piezoelectric layer is monolithically disposed on the non-piezoelectric substrate.
12. The acoustic filter of claim 11 , wherein the piezoelectric layer is a thin-film piezoelectric.
13. The acoustic filter of claim 1 , wherein all of the interdigitated capacitive fingers and all of the interdigitated resonator fingers have orientations that are oblique to each other.
14. The acoustic filter of claim 1 , further comprising:
a metalized signal plane monolithically disposed on the piezoelectric layer; and
a metalized ground plane monolithically disposed on the piezoelectric layer, wherein each of the acoustic resonator structure and the lumped capacitive structure is electrically coupled between the signal plane and the ground plane.
15. The acoustic filter of claim 14 , wherein the lumped capacitive structure is least partially nested within at least one of the signal plane and the ground plane.
16. The acoustic filter of claim 14 , wherein the lumped capacitive structure is fully nested within at least one of the signal plane and the ground plane.
17. The acoustic filter of claim 1 , further comprising:
a metalized input signal plane portion monolithically disposed on the piezoelectric layer; and
a metalized output signal plane portion monolithically disposed on the piezoelectric layer, wherein each of the acoustic resonator structure and the capacitive resonator structure is electrically coupled between the input signal plane portion and the output signal plane portion.
18. The acoustic filter of claim 17 , wherein the lumped capacitive structure is least partially nested within at least one of the input signal plane portion and the output signal plane portion.
19. The acoustic filter of claim 17 , wherein the lumped capacitive structure is fully nested within at least one of the input signal plane portion and the output signal plane portion.
20. The acoustic filter of claim 1 , wherein the piezoelectric layer is a piezoelectric substrate.
21. An acoustic filter, comprising:
a piezoelectric layer;
an acoustic resonator structure monolithically disposed on the piezoelectric layer, the acoustic resonator structure comprising an arrangement of planar interdigitated resonator fingers;
a lumped capacitive structure monolithically disposed on the piezoelectric layer and being electrically coupled to the acoustic resonator structure, the lumped capacitive structure comprising an arrangement of planar interdigitated capacitive fingers,
a metalized input signal plane portion monolithically disposed on the piezoelectric layer; and
a metalized output signal plane portion monolithically disposed on the piezoelectric layer, wherein each of the acoustic resonator structure and the capacitive resonator structure is electrically coupled between the input signal plane portion and the output signal plane portion, and wherein the lumped capacitive structure is least partially nested within at least one of the input signal plane portion and the output signal plane portion.
22. An acoustic filter, comprising:
a piezoelectric layer;
an acoustic resonator structure monolithically disposed on the piezoelectric layer, the acoustic resonator structure comprising an arrangement of planar interdigitated resonator fingers;
a lumped capacitive structure monolithically disposed on the piezoelectric layer and being electrically coupled to the acoustic resonator structure, the lumped capacitive structure comprising an arrangement of planar interdigitated capacitive fingers,
a metalized input signal plane portion monolithically disposed on the piezoelectric layer; and
a metalized output signal plane portion monolithically disposed on the piezoelectric layer, wherein each of the acoustic resonator structure and the capacitive resonator structure is electrically coupled between the input signal plane portion and the output signal plane portion, and wherein the lumped capacitive structure is fully nested within at least one of the input signal plane portion and the output signal plane portion.