Plasma processing apparatus and analysis method for analyzing plasma processing data
According to the present invention, a plasma processing apparatus includes an analysis unit that obtains wavelengths of the light correlated with a plasma processing result, selects, from the obtained wavelengths, a wavelength having a first factor that represents a deviation in an intensity distribution of the light and is larger than a first predetermined value, and predicts the plasma processing result using the selected wavelength, or an analysis unit that obtains values computed using each of light intensities of a plurality of wavelengths and correlated with the plasma processing result, selects, from the obtained values, a value having a second factor that represents a deviation in a distribution of the obtained values and is larger than a second predetermined value, and predicts the plasma processing result using the selected value.
1. A plasma processing apparatus comprising:
a processing chamber configured to perform processing using plasma; and
an analysis device comprising a computer, a memory, and an interface, wherein the analysis device is configured to analyze data of light emitted from the plasma,
wherein the analysis device is further configured to obtain wavelengths of the light correlated with a plasma processing result, and to select, from the obtained wavelengths, a wavelength such that a first factor is larger than a first predetermined value, and to obtain a prediction formula to predict the plasma processing result, based on the selected wavelength, and
wherein the first factor represents a deviation in an intensity distribution of the light.
2. The plasma processing apparatus according to claim 1 , wherein the first predetermined value is a value defined to satisfy a condition that a prediction error of a prediction formula obtained based on the selected wavelength is an acceptable value or a less than acceptable value.
3. The plasma processing apparatus according to claim 1 , wherein the first factor is obtained based on a standard deviation or a square of the standard deviation.
4. The plasma processing apparatus according to claim 1 , wherein the first factor is obtained by dividing a standard deviation by an average value of the light intensity.
5. The plasma processing apparatus according to claim 1 , wherein the first factor is a ratio between the standard deviations obtained from a pair of different groups of plasma processing samples.
6. The plasma processing apparatus according to claim 1 , wherein the first factor includes a value obtained by dividing a standard deviation by an average value of the light intensity and a ratio of the standard deviations obtained from a pair of different groups of plasma processing samples.
7. The plasma processing apparatus according to claim 1 , further comprising a control device configured to control for adjusting a plasma processing condition on the basis of the predicted plasma processing result.
8. The plasma processing apparatus according to claim 1 , further comprising a control unit configured to determine abnormality if the predicted plasma processing result exceeds a predetermined range.
9. A plasma processing apparatus comprising:
a processing chamber configured to perform processing using plasma; and
an analysis device comprising a computer, a memory, and an interface, wherein the analysis device is configured to analyze data of light emitted from the plasma,
wherein the analysis device is further configured to obtain values computed using each of light intensities of a plurality of wavelengths and correlated with the plasma processing result, and to select, from the obtained values, a value such that a second factor is larger than a second predetermined value, and to obtain a prediction formula to predict the plasma processing result based on the selected value, and
wherein the second factor represents a deviation in a distribution of the obtained values.