Packaged resonator with polymeric air cavity package
View Patent ↗A packaged resonator includes a substrate, an acoustic stack, a first polymer layer and a second polymer layer. The acoustic stack is disposed over the substrate. The first polymer layer is disposed over the substrate surrounding the acoustic stack. The first polymer layer also provides a first air gap above the acoustic stack. The second polymer layer is disposed over the acoustic stack and above the first air gap.
1. A packaged resonator, comprising:
a substrate;
an acoustic stack disposed over the substrate;
a first polymer layer disposed over the substrate, surrounding the acoustic stack, and providing a first air gap above the acoustic stack;
a second polymer layer disposed over the acoustic stack and above the first air gap; and
at least three release holes disposed between an air cavity under the acoustic stack, and the first polymer layer, wherein the first polymer layer covers each of the at least three release holes.
2. The packaged resonator of claim 1 ,
wherein the at least three release holes surround the acoustic stack within a periphery of the air cavity.
3. The packaged resonator of claim 1 ,
wherein the acoustic stack comprises a first electrode, a second electrode, and a piezoelectric layer disposed between the first and second electrode.
4. The packaged resonator of claim 3 ,
wherein the at least three release holes are formed through the piezoelectric layer of the acoustic stack.
5. The packaged resonator of claim 1 ,
wherein the first polymer layer substantially conforms to topology of the substrate except for the at least three release holes.
6. The packaged resonator of claim 1 ,
wherein the packaged resonator comprises a thin film bulk acoustic resonator,
the thin film bulk acoustic resonator comprises a resonator membrane, and
the first polymer layer is absent over the resonator membrane.
7. The packaged resonator of claim 1 ,
wherein the acoustic stack comprises a first electrode, a second electrode, and a piezoelectric layer disposed between the first and second electrode.
8. The packaged resonator of claim 1 , wherein the acoustic stack is a first acoustic stack, and the packaged resonator further comprising:
a second acoustic stack provided over the substrate;
a second air gap formed in the first polymer layer and above the second acoustic stack,
wherein the second polymer layer is disposed over the second acoustic stack and above the second air gap.
9. The packaged resonator of claim 8 , further comprising:
at least three first release holes between a first air cavity under the first acoustic stack and the first polymer layer, and
at least three second release holes between a second air cavity under the second acoustic stack and the first polymer layer,
wherein the first polymer layer provides a barrier between the first air gap and the second air gap.
10. A wireless communication device, comprising:
a substrate;
an acoustic stack disposed over the substrate, wherein the acoustic stack comprises a first electrode, a second electrode, and a piezoelectric layer disposed between the first and second electrode;
an air cavity disposed below the acoustic stack;
a first polymer layer disposed over the substrate and surrounding the acoustic stack to provide an air gap above the acoustic stack; and
a second polymer layer disposed over the acoustic stack and above the air gap; and
at least one release hole in communication with the air cavity, wherein the first polymer layer covers the at least one release hole.
11. The wireless communication device of claim 10 , further comprising:
a plurality of release holes covered by the first polymer layer.
12. The wireless communication device of claim 10 ,
wherein the air cavity exists in the substrate below the acoustic stack, and
the at least one release hole exists through the piezoelectric layer between the first polymer layer and the air cavity.
13. The wireless communication device of claim 10 ,
wherein a portion of a bottom surface of the first polymer layer over the at least one release hole is planar.
14. The wireless communication device of claim 13 , further comprising:
a layer under the first polymer layer,
wherein portions of the first polymer layer away from the at least one release hole conform to the layer under the first polymer layer.
15. The wireless communication device of claim 10 ,
wherein the acoustic stack comprises a thin film bulk acoustic resonator surrounded by the first polymer layer.
16. The wireless communication device of claim 10 ,
wherein a portion of a bottom surface of the first polymer layer covering the at least one release hole is planar.
17. A bulk acoustic resonator, comprising:
a substrate;
at least one acoustic stack disposed over the substrate, each acoustic stack including a first electrode, a second electrode, and a piezoelectric layer disposed between the first and second electrode and over an edge of the first electrode to be in direct contact with an upper surface of the substrate;
a first polymer layer disposed over the substrate and surrounding each acoustic stack disposed over the substrate to provide an air gap above each acoustic stack;
a second polymer layer disposed over each acoustic stack and above each air gap; and
at least three release holes exist through the piezoelectric layer of each acoustic stack and between an air cavity under each acoustic stack and the first polymer layer, wherein the first polymer layer covers each of the at least three release holes.