Post write erase conditioning
A storage device with a charge trapping (CT) based memory may include improved data retention performance. Data retention problems, such as charge loss in CT memory may increase for a particular programmed state when a neighboring state is at erased state. Modifying the erase state with post write erase conditioning (PWEC) by pushing up deeply erased states can reduce the lateral charge movement and improve high temperature data retention. In particular, the erase state may be reprogrammed such that the erase distribution is tighter with a higher voltage.
1. A storage device comprising:
a memory comprising memory blocks for data storage, wherein the memory comprises a dielectric layer for charge trapping;
a controller coupled with the memory and configured for programming the memory blocks; and
a recondition circuitry configured to reprogram deeply erased cells when a voltage of an erase state is below a threshold by narrowing a voltage distribution of those erase states, wherein the recondition circuitry is configured to reprogram deeply erased cells within a closed block that has its wordlines fully programmed.
2. The storage device of claim 1 wherein the memory comprises a charge trap flash memory with a charge trapped in the dielectric layer.
3. The storage device of claim 1 wherein recondition circuitry reprogramming is performed as a background operation.
4. The storage device of claim 1 wherein the reprogramming comprises applying a voltage to the deeply erases cells that narrows and shifts the voltage distribution of the erase state for each of the deeply erased cells.
5. The storage device of claim 1 wherein the recondition circuitry is further configured for:
performing a read operation on one of the wordlines of one of the memory blocks;
comparing, based on the read operation, a voltage of each erase state for a cell with the threshold;
identifying a cell as deeply erased when the voltage of the cell is below the threshold; and
iteratively cycling through each of the wordlines of the one of the memory blocks for identifying each of the deeply erased cells in the one of the memory blocks.
6. The storage device of claim 5 wherein the identifying the cell as deeply erased comprises:
performing a read operation on a wordline;
comparing, based on the read operation, a voltage of each erase state for a cell with a threshold value; and
identifying a cell as deeply erased when the voltage of the cell is below the threshold value.
7. The storage device of claim 6 wherein the threshold value comprises 0 Volts, such that each deeply erased cell has an erase state below 0 Volts.
8. The storage device of claim 1 wherein the reprogramming comprises applying a voltage to the deeply erases cells.
9. The storage device of claim 8 wherein the voltage is applied through a dumb pulse.
10. The storage device of claim 8 wherein the voltage is applied through a verify pulse.
11. The storage device of claim 1 wherein the dielectric layer for trapping electrons is a silicon nitride film.
12. The storage device of claim 11 wherein the memory comprises a charge trap flash memory that comprises a metal oxide nitride oxide semiconductor (MONOS) capacitor structure.
13. The storage device of claim 2 wherein the memory comprises a three-dimensional (3D) NAND memory configuration, and wherein the controller is associated with operation of and storing to the charge trap flash memory.
14. The storage device of claim 1 wherein the reprogramming improves data retention by increasing a voltage level and narrowing a distribution of an erase state for the deeply erased cells.
15. A memory system comprising:
means for identifying a block that is fully programmed and closed;
means for reading the identified block;
means for identifying erase bits based on comparing a voltage from the reading with a threshold for each cell in the identified block in order to identify deeply erased bits with an erase state that has a voltage below the threshold; and
means for modifying the erase state for each of the deeply erased bits in the identified block by reprogramming the erase state to have a narrowed distribution.
16. The system of claim 15 wherein those erase states have a distribution that is shifted by increasing a voltage through reprogramming based on the modifying.
17. A storage device comprising:
a memory comprising a dielectric layer for charge trapping;
a controller coupled with the memory and configured for programming memory blocks of the memory, wherein the programming comprises:
performing a post write erase conditioning operation as a background process for deeply erased cells in the memory, the post write erase conditioning operation comprising:
identifying, as a background process, the deeply erased cells from a programmed block of the charge trapping memory; and
reprogramming, as a background process, the identified deeply erased cells.
18. The storage device of claim 17 wherein the identifying deeply erased cells comprises:
performing a read operation on a wordline;
comparing, based on the read operation, a voltage of each erase state for a cell with a threshold value;
identifying a cell as deeply erased when the voltage of the cell is below the threshold value; and
iteratively cycling through each of the wordlines of the block for identifying each of the deeply erased cells in the block.
19. The storage device of claim 17 wherein the reprogramming narrows a distribution of an erase state for each of the identified deeply erased cells.