EUV lithography system and operating method
An EUV lithography system ( 1 ) includes: at least one optical element ( 13, 14 ) having an optical surface ( 13 a, 14 a ) arranged in a vacuum environment ( 17 ) of the EUV lithography system ( 1 ), and a feed device ( 27 ) for feeding hydrogen into the vacuum environment ( 17 ), in which at least one silicon-containing surface ( 29 a ) is arranged. The feed device ( 27 ) additionally feeds an oxygen-containing gas into the vacuum environment ( 17 ) and has a metering device ( 28 ) that sets an oxygen partial pressure (p O2 ) at the at least one silicon-containing surface ( 29 a ) and/or at the optical surface ( 13 a, 14 a ).
1. A system for extreme ultraviolet (EUV) lithography, comprising:
at least one optical element having an optical surface and at least one silicon-containing surface arranged in a vacuum environment of the EUV lithography system, and
a feed device configured to feed hydrogen and an oxygen-containing gas into the vacuum environment,
wherein the feed device comprises a metering device configured to feed the oxygen with a flow rate selected to set an oxygen partial pressure at the at least one silicon-containing surface and/or at the optical surface within a predefined interval between a maximum value and a minimum value,
wherein the silicon-containing surface is positioned at a component that is not arranged in an EUV beam path of the EUV lithography system, and
wherein the metering device is configured to set the oxygen partial pressure to more than 5×10 −6 mbar and less than 5×10 −5 mbar at the silicon-containing surface and/or at the optical surface.
2. The system according to claim 1 , wherein the metering device is configured to set the oxygen partial pressure to less than 2×10 −5 mbar at the silicon-containing surface and/or at the optical surface.
3. The system according to claim 1 , wherein the oxygen-containing gas is selected from the group consisting of: oxygen, water, air and mixtures thereof.
4. The system according to claim 1 , wherein the feed device comprises a feed line having an exit opening arranged and aligned to allow the oxygen-containing gas to emerge along a line of sight to the at least one silicon-containing surface and/or to the optical surface.
5. The system according to claim 1 , wherein the feed device is configured to allow the hydrogen and the oxygen-containing gas to emerge via an exit opening of a common feed line into the vacuum environment.
6. The system according to claim 1 , wherein the optical element is arranged in a vacuum chamber arranged in an interior of a housing, and wherein the vacuum chamber has an outlet that connects the vacuum chamber to the interior.
7. The system according to claim 6 , wherein the feed device has a feed line having an exit opening that is arranged in the vacuum chamber and is configured to feed the oxygen-containing gas and a purge gas into the vacuum environment of the vacuum chamber.
8. The system according to claim 6 , wherein the feed device has a feed line having an exit opening and is configured to feed the oxygen-containing gas to the interior of the housing.
9. The system according to claim 1 , wherein the feed device is configured to feed the oxygen-containing gas and a purge gas to a tubular channel between a first housing and a second housing of the EUV lithography system.
10. A method for operating an EUV lithography system, comprising:
feeding hydrogen and an oxygen-containing gas into a vacuum environment in which at least one optical element having an optical surface and at least one silicon-containing surface is arranged, and
setting an oxygen partial pressure at the at least one silicon-containing surface and/or at the optical surface;
wherein the silicon-containing surface is positioned at a component that is not arranged in an EUV beam path of the EUV lithography system, and
wherein the oxygen partial pressure is set to a value of more than 5×10 −6 mbar and less than 5×10 −5 mbar at the silicon-containing surface and/or at the optical surface.
11. The method according to claim 10 , wherein the oxygen partial pressure is set to a value of less than 2×10 −5 mbar at the silicon-containing surface and/or at the optical surface.
12. The system according to claim 1 , wherein the metering device is configured to set the oxygen partial pressure to more than 9×10 −6 mbar at the silicon-containing surface and/or at the optical surface.
13. The system according to claim 7 , wherein the purge gas is hydrogen.
14. The system according to claim 9 , wherein the purge gas is hydrogen.
15. The method according to claim 10 , wherein the oxygen partial pressure is set to a value of more than 9×10 −6 mbar at the silicon-containing surface and/or at the optical surface.