Apparatuses and methods for forming die stacks

1. A method comprising:

placing a die onto a substrate including a release layer and a temporary adhesive;

forming, on the substrate, a die stack that includes the die;

removing the die and the temporary adhesive; and

removing the temporary adhesive from the die.

2. The method of claim 1 wherein the die placed onto the substrate comprises a logic die and wherein the die stack comprises a plurality of memory die and the logic die.

3. The method of claim 1 wherein removing the base die and the temporary adhesive comprises activating the release layer.

4. The method of claim 1 wherein the substrate comprises a glass substrate.

5. The method of claim 1 , further comprising:

placing the die stack on a carrier film to remove the temporary adhesive from the die.

6. A method comprising:

placing a process substrate over an opening of a process carrier, wherein the process substrate includes a release layer on one side, and wherein the side of the process substrate that includes the release layer is positioned opposite the opening of the process carrier;

temporarily adhering a base die onto the release layer;

stacking a plurality of die on the base die; and

removing the process substrate from the base die.

7. The method of claim 6 wherein the opening of the process carrier provides access to a bottom side of the process substrate.

8. The method of claim 6 wherein the plurality of die stacked on the base die comprises a plurality of memory die.

9. The method of claim 6 wherein temporarily adhering the base die onto the release layer comprises adhering the base die to the release layer with a temporary adhesive that is removed separately from removing the process substrate from the base die.

10. The method of claim 6 wherein stacking the plurality of die on the base die comprises:

aligning metallic bonding pads of a first die of the plurality of die with metallic bonding pads of a second die of the plurality of die; and

forming metallic bonds between the metallic bonding pads of the first die of the plurality of die and the metallic bonding pads of the second die of the plurality of die.

11. The method of claim 10 wherein forming metallic bonds between the metallic bonding pads of the first die of the plurality of die and the metallic bonding pads of the second die of the plurality of die comprises performing a heating process.

12. A method, comprising:

defining a shape and size of a process substrate on a substrate, wherein the substrate includes a release layer;

dicing the substrate including the release layer based on the defined size and shape;

dispensing a temporary adhesive onto the release layer of a process substrate to attach a die stack to the process substrate;

activating the release layer disposed on the process substrate to remove the die stack; and

removing the temporary adhesive from the die stack.

13. The method of claim 12 wherein the substrate on which the shape and size of the process substrate is defined comprises a substrate that is transparent to at least one wavelength of electro-magnetic radiation.

14. The method of claim 13 wherein activating the release layer comprises exposing the release layer to the at least one wavelength of electro-magnetic radiation.

15. The method of claim 12 , further comprising placing the removed die stack onto a carrier film.

16. The method of claim 12 wherein removing the temporary adhesive from the die stack comprises:

placing a tape in contact with the temporary adhesive; and

rolling a roller over the tape while pulling the tape away from the die stack.

17. The method of claim 12 wherein the die stack comprises a logic die and a plurality of memory die stacked on the logic die.

18. A method comprising:

forming a pattern on a substrate, wherein the substrate includes a release layer disposed on one side;

dicing the substrate based on the pattern to form a temporary substrate;

temporarily attaching a die onto the substrate,

stacking a plurality of die onto the die attached to the substrate to form a die stack;

removing the die stack from the substrate.

19. The method of claim 18 wherein temporarily attaching the die onto the substrate comprises:

dispensing temporary adhesive onto the substrate;

placing the die onto the temporary adhesive; and

curing the temporary adhesive.

20. The method of claim 18 , further comprising:

placing the substrate onto a process carrier, wherein the process carrier has an opening and the substrate is placed over the opening.