Substrate treatment method using a block copolymer containing a hydrophilic and a hydrophobic polymers
A substrate treatment method of treating a substrate using a block copolymer containing a hydrophilic polymer and a hydrophobic polymer, includes: a resist pattern formation step of forming a predetermined resist pattern by a resist film on the substrate; a thin film formation step of forming a thin film for suppressing deformation of the resist pattern on a surface of the resist pattern; a block copolymer coating step of applying a block copolymer to the substrate after the formation of the thin film; and a polymer separation step of phase-separating the block copolymer into the hydrophilic polymer and the hydrophobic polymer.
1. A substrate treatment method of treating a substrate using a block copolymer containing a hydrophilic polymer and a hydrophobic polymer, the substrate treatment method comprising:
a resist pattern formation step of forming a predetermined resist pattern by a resist film on the substrate;
a thin film formation step of forming a thin film of 2 nm to 3 nm thickness for suppressing deformation of the resist pattern to cover a surface of the resist pattern with the thin film, wherein the thin film is a silicon-containing film;
a block copolymer coating step of applying a block copolymer to the substrate after the formation of the thin film; and
a polymer separation step of phase-separating the block copolymer into the hydrophilic polymer and the hydrophobic polymer.
2. The substrate treatment method according to claim 1 ,
wherein the silicon-containing film is formed by plasma processing, and
wherein the plasma processing is performed by applying high-frequency power to an electrode containing silicon.
3. The substrate treatment method according to claim 1 ,
wherein the silicon-containing film is SiO, SiO 2 , or SiOC.