On-die termination control
A memory control component outputs a memory write command to a memory IC and also outputs write data to be received via data inputs of the memory IC. Prior to reception of the write data within the memory IC, the memory control component asserts a termination control signal that causes the memory IC to apply to the data inputs a first on-die termination impedance during reception of the write data followed by a second on-die termination impedance after the write data has been received. The memory control component deasserts the termination control signal to cause the memory IC to apply no termination impedance to the data inputs.
1. An integrated circuit device for controlling a dynamic random access memory device (DRAM), the integrated circuit device comprising:
a first interface to transmit to the DRAM:
a write command to indicate that write data is to be received by the DRAM;
a chip-select signal to indicate that the DRAM is to respond to the write command;
one or more commands that specify storage of a digital control value within a register of the DRAM, the digital control value indicating a value of a termination impedance that the DRAM is to couple to a data interface of the DRAM in response to the chip select signal and the write command, such that the termination impedance is coupled to the data interface prior to reception of the write data according to a predetermined amount of time after reception of the write command, and decoupled from the data interface after reception of the write data; and
a second interface to transmit the write data to the data interface of the DRAM.
2. The integrated circuit device of claim 1 wherein the first interface is further to transmit the digital control value to the DRAM.
3. The integrated circuit device of claim 1 wherein the first interface comprises a plurality of signal driver circuits, including a first set of signal driver circuits to transmit the write command to the DRAM and at least one other signal driver circuit, distinct from the first set, to transmit the chip-select signal to the DRAM.
4. The integrated-circuit device of claim 3 wherein the first set of signal driver circuits are additionally to transmit the one or more commands that specify storage of the digital control value.
5. The integrated-circuit device of claim 1 wherein the first interface is to transmit to the DRAM the one or more commands that specify storage of the digital control value prior to transmitting the write command to the DRAM and prior to transmitting the chip-select signal to the DRAM.
6. The integrated circuit device of claim 1 wherein the data interface of the DRAM comprises a plurality of interconnects coupled to respective signal lines of an external data path, and wherein the first interface to transmit to the DRAM the one or more commands that specify storage of the digital control value indicating the value of the termination impedance that the DRAM is to couple to the data interface of the DRAM during reception of the write data comprises circuitry to transmit one or more commands that specify storage of a digital control value indicating a respective value of termination impedance that the DRAM is to couple to each of the interconnects of the data interface during reception of the write data.
7. The integrated circuit device of claim 1 wherein the first and second interfaces are to transmit the write command and the write data at respective times such that coupling of the termination impedance to the data interface of the DRAM a first predetermined time after reception of the write command within the DRAM ensures that the termination impedance is coupled to the data interface prior to reception of the write data.
8. The integrated circuit device of claim 7 wherein the first and second interfaces are to transmit the write command and the write data at respective times such that decoupling of the termination impedance from the data interface of the DRAM a second predetermined time after reception of the write command within the DRAM ensures that the termination impedance is decoupled from the data interface after reception of the write data.
9. The integrated circuit device of claim 7 wherein the first interface is to transmit the chip-select signal and the write command to the DRAM at respective times such that the chip-select signal arrives at the DRAM in time to enable the DRAM to respond to the write command.
10. The integrated circuit device of claim 1 wherein the first interface to transmit to the DRAM one or more commands that specify storage of the digital control value comprises circuitry to transmit one or more commands that indicate a value of a termination impedance that the DRAM is to couple to the data interface during an internal state of the DRAM effected by reception of the write command within the DRAM.
11. A method of controlling a dynamic random access memory device (DRAM), the method comprising:
transmitting to the DRAM a write command to indicate that write data is to be received by the DRAM;
transmitting to the DRAM a chip-select signal to indicate that the DRAM is to respond to the write command;
transmitting to the DRAM one or more commands that specify storage of a digital control value within a register of the DRAM, the digital control value indicating a value of a termination impedance that the DRAM is to couple to a data interface of the DRAM in response to the chip select signal and the write command, such that the termination impedance is coupled to the data interface prior to reception of the write data according to a predetermined amount of time after reception of the write command, and decoupled from the data interface after reception of the write data; and
transmitting the write data to the data interface of the DRAM.
12. The method of claim 11 further comprising transmitting the digital control value to the DRAM.
13. The method of claim 11 wherein transmitting the write command to the DRAM comprises transmitting the write command to the DRAM via a first set of signal driver circuits and wherein transmitting the chip-select signal to the DRAM comprises transmitting the chip-select signal to the DRAM via at least one other signal driver circuit not included in the first set.
14. The method of claim 13 wherein transmitting the one or more commands that specify storage of the digital control value comprises transmitting each of the one or more commands via the first set of signal driver circuits.
15. The method of claim 11 wherein transmitting to the DRAM the one or more commands that specify storage of the digital control value comprises transmitting to the DRAM the one or more commands that specify storage of the digital control value prior to transmitting the write command to the DRAM and prior to transmitting the chip-select signal to the DRAM.
16. The method of claim 11 wherein the data interface of the DRAM comprises a plurality of interconnects coupled to respective signal lines of an external data path, and wherein transmitting to the DRAM the one or more commands that specify storage of the digital control value indicating the value of the termination impedance that the DRAM is to couple to the data interface of the DRAM during reception of the write data comprises transmitting one or more commands that specify storage of a digital control value indicating a respective value of termination impedance that the DRAM is to couple to each of the interconnects of the data interface during reception of the write data.
17. The method of claim 11 wherein transmitting the write command and transmitting the write data comprise transmitting the write command and the write data at respective times such that coupling of the termination impedance to the data interface of the DRAM a first predetermined time after reception of the write command within the DRAM ensures that the termination impedance is coupled to the data interface prior to reception of the write data.
18. The method of claim 17 wherein transmitting the write command and transmitting the write data further comprise transmitting the write command and the write data at respective times such that decoupling of the termination impedance from the data interface of the DRAM a second predetermined time after reception of the write command within the DRAM ensures that the termination impedance is decoupled from the data interface after reception of the write data.
19. The method of claim 17 wherein transmitting the chip-select signal and the write command to the DRAM comprises transmitting the chip-select signal and the write command at respective times such that the chip-select signal arrives at the DRAM in time to enable the DRAM to respond to the write command.
20. An integrated circuit device for controlling a dynamic random access memory device (DRAM), the integrated circuit device comprising:
means for transmitting to the DRAM a write command to indicate that write data is to be received by the DRAM;
means for transmitting to the DRAM a chip-select signal to indicate that the DRAM is to respond to the write command;
means for transmitting to the DRAM one or more commands that specify storage of a digital control value within a register of the DRAM, the digital control value indicating a value of a termination impedance that the DRAM is to couple to a data interface of the DRAM in response to the chip select signal and the write command, such that the termination impedance is coupled to the data interface prior to reception of the write data according to a predetermined amount of time after reception of the write command, and decoupled from the data interface after reception of the write data; and
means for transmitting the write data to the data interface of the DRAM.