Fin field-effect transistor (FinFET) with reduced parasitic capacitance
A semiconductor device includes a substrate, a plurality of fins on the substrate, wherein the plurality of fins each include a fin channel region, first isolation regions on the substrate corresponding to active gate regions, a second isolation region on the substrate corresponding to a dummy gate region, wherein a height of the second isolation region is greater than a height of the first isolation regions, a plurality of active gate structures formed around the fins, and on the first isolation regions, and a dummy gate structure formed on the second isolation region.
1. A semiconductor device, comprising:
a substrate;
a plurality of fins on the substrate, wherein the plurality of fins each comprise a fin channel region;
first isolation regions on the substrate corresponding to active gate regions;
a second isolation region on the substrate corresponding to a dummy gate region, wherein a height of the second isolation region is greater than a height of each of the first isolation regions;
a plurality of active gate structures formed around the plurality of fins, and on the first isolation regions; and
a dummy gate structure formed on the second isolation region;
wherein the second isolation region has a top surface adjacent to and at the same or substantially the same height as a top surface of the fin channel regions.
2. The semiconductor device according to claim 1 , wherein the first isolation regions have top surfaces adjacent bottom portions of the fin channel regions.
3. The semiconductor device according to claim 1 , wherein the plurality of fins each comprise a punchthrough stop (PTS) doped region under the fin channel region of each of the fins.
4. The semiconductor device according to claim 3 , wherein the punchthrough stop (PTS) doped region of each of the fins is doped differently than source/drain regions of transistors of the active gate regions.
5. The semiconductor device according to claim 3 , wherein the second isolation region is positioned between source/drain regions of adjacent transistors of the active gate regions, and between punchthrough stop (PTS) doped regions respectively corresponding to the adjacent transistors.
6. The semiconductor device according to claim 1 , wherein a difference between the height of the second isolation region and the height of each of the first isolation regions is equal to or substantially equal to a thickness of the fin channel regions.
7. The semiconductor device according to claim 1 , wherein the second isolation region is positioned between source/drain regions of adjacent transistors of the active gate regions.
8. The semiconductor device according to claim 7 , wherein a height of the second isolation region with respect to the substrate is equal to or substantially equal to a height of each of the plurality of fins with respect to the substrate.
9. The semiconductor device according to claim 1 , wherein the first and second isolation regions comprise at least one of silicon dioxide (SiO 2 ), low-temperature oxide (LTO), high-temperature oxide (HTO) and field oxide (FOX).
10. A semiconductor device, comprising:
a substrate;
a plurality of fins on the substrate, wherein each fin of the plurality of fins is divided into at least two active gate regions;
an isolation region on the substrate corresponding to a dummy gate region, wherein the isolation region is positioned between source/drain regions of adjacent active gate regions of each fin of the plurality of fins;
a plurality of active gate structures formed around the plurality of fins; and
a dummy gate structure formed on the isolation region;
wherein the isolation region has a top surface adjacent to and at the same or substantially the same height as a top surface of the source/drain regions.
11. The semiconductor device according to claim 10 , wherein the plurality of fins each comprise a fin channel region.
12. The semiconductor device according to claim 11 , wherein the plurality of fins each comprise a punchthrough stop (PTS) doped region under the fin channel region of each of the fins.
13. The semiconductor device according to claim 12 , wherein the punchthrough stop (PTS) doped region of each of the fins is doped differently than the source/drain regions.
14. The semiconductor device according to claim 12 , wherein the isolation region is further positioned between punchthrough stop (PTS) doped regions respectively corresponding to the adjacent active gate regions of each fin.
15. The semiconductor device according to claim 11 , further comprising additional isolation regions on the substrate corresponding to the adjacent active gate regions, wherein the additional isolation regions have top surfaces adjacent bottom portions of the fin channel regions.
16. The semiconductor device according to claim 15 , wherein:
a height of the isolation region is greater than a height of each of the additional isolation regions; and
a difference between the height of the isolation region and the height of each of the additional isolation regions is equal to or substantially equal to a thickness of the fin channel regions.
17. The semiconductor device according to claim 10 , wherein a height of the isolation region with respect to the substrate is equal to or substantially equal to a height of each of the plurality of fins with respect to the substrate.
18. The semiconductor device according to claim 10 , wherein the isolation region comprises at least one of silicon dioxide (SiO 2 ), low-temperature oxide (LTO), high-temperature oxide (HTO) and field oxide (FOX).